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Search "Global and Chinese CMOS Camera Module Industry Report, 2013" returned 24 results.

PRODUCT TITLE

Global and Chinese CMOS Camera Module Industry Report, 2013

The growth rate of cell phone camera pixels slows down, or even declines in 2013 Apple's iPhone 5S still employs 8-megapixel, instead of 13-megapixel adopted by other top cell phone vendors In addition,...

November 2013
FROM

Global and Chinese CMOS Camera Module Industry Report, 2013

The growth rate of cell phone camera pixels slows down, or even declines in 2013 Apple's iPhone 5S still employs 8-megapixel, instead of 13-megapixel adopted by other top cell phone vendors In addition,...

November 2013
FROM

Global and Chinese CMOS Camera Module Industry Report, 2013-2014

In Chinese mobile phone market, 8MP will be replaced by 13MP which has become the standard configuration of mobile phones priced at RMB1,000 or above in 2014 Chinese brands use 13MP more widely than...

May 2014
FROM

Global and Chinese CMOS Camera Module Industry Report, 2013-2014

In Chinese mobile phone market, 8MP will be replaced by 13MP which has become the standard configuration of mobile phones priced at RMB1,000 or above in 2014 Chinese brands use 13MP more widely than...

May 2014
FROM
Camera Module Trends Camera Module Trends - Product Thumbnail Image

Camera Module Trends

A camera module primarily integrates a lens module, an image sensor chip, and a module case The integrated image sensor chip includes a back surface, an active surface along with a plurality of side...

January 2014
FROM
Global and Chinese Mobile Phone Camera Module Industry Report 2014 Global and Chinese Mobile Phone Camera Module Industry Report 2014 - Product Thumbnail Image

Global and Chinese Mobile Phone Camera Module Industry Report 2014

The Global and Chinese Mobile Phone Camera Module Industry Report 2014 is a professional and in-depth study on the current state of the global mobile phone camera module industry with a focus on the...

May 2014
FROM
Global Camera Module Market - Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019 Global Camera Module Market - Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019 - Product Thumbnail Image

Global Camera Module Market - Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019

Camera modules are gaining popularity and witnessing an increased demand across different application sectors such as in smartphones and tablet PCs, as well as in industrial, medical and automotive...

October 2013
FROM
Sapphire Substrates 2013 Sapphire Substrates 2013 - Product Thumbnail Image

Sapphire Substrates 2013

Excess capacity to trigger massive consolidation and attrition Will cell phone windows come to the rescue? Significant overcapacity and low LED substrate prices will affect the profitability and viability...

December 2012
FROM

Global Camera Module in Mobile Device Market 2014-2018

The analysts forecast the Global Camera Module in Mobile Device market to grow at a CAGR of 13.20 percent over the period 2013-2018. One of the key factors contributing to this market growth is the...

November 2013
FROM

Global and Chinese CCM (CMOS Camera Module) Industry Report, 2014-2015

In 2014, global CCM market size was worth about USD16.402 billion, growing by 13.4% from 2013, mainly stimulated by higher camera pixel of mobile phone and OIS. It is expected that OIS will expand rapidly...

January 2015
FROM

Global and Chinese CCM (CMOS Camera Module) Industry Report, 2014-2015

In 2014, global CCM market size was worth about USD16.402 billion, growing by 13.4% from 2013, mainly stimulated by higher camera pixel of mobile phone and OIS. It is expected that OIS will expand rapidly...

January 2015
FROM
IC Advanced Packaging Industry Report, 2009 IC Advanced Packaging Industry Report, 2009 - Product Thumbnail Image

IC Advanced Packaging Industry Report, 2009

The semiconductor industry is in the era of 32nm process, and it is expected that it will meet 16nm around 2019 Designing a 45nm SoC costs USD20-50 million except labor cost, and the design of a 32nm...

October 2009
FROM
Global and Chinese Handset Rear Camera Industry Report 2014 Global and Chinese Handset Rear Camera Industry Report 2014 - Product Thumbnail Image

Global and Chinese Handset Rear Camera Industry Report 2014

The Global and Chinese Handset Rear Camera Industry Report 2014 is a professional and in-depth research report on the global Handset Rear Camera industry with a focus on the Chinese situation The report...

May 2014
FROM
Global and Chinese Handset Front Camera Industry Report 2014 Global and Chinese Handset Front Camera Industry Report 2014 - Product Thumbnail Image

Global and Chinese Handset Front Camera Industry Report 2014

The Global and Chinese Handset Front Camera Industry Report 2014 is a professional and in-depth research report on the global handset front camera industry with a focus on the Chinese situation The...

May 2014
FROM
Global ICT Industry and Market Report: 2013 Edition Global ICT Industry and Market Report: 2013 Edition - Product Thumbnail Image

Global ICT Industry and Market Report: 2013 Edition

The rigid economic conditions in 2012 stemming from the European debt crisis, slow recovery of mature economies, and less expected growth in the emerging markets had caused government and enterprise...

September 2013
FROM
IC Advanced Packaging Industry Report, 2009 IC Advanced Packaging Industry Report, 2009 - Product Thumbnail Image

IC Advanced Packaging Industry Report, 2009

The semiconductor industry is in the era of 32nm process, and it is expected that it will meet 16nm around 2019 Designing a 45nm SoC costs USD20-50 million except labor cost, and the design of a 32nm...

October 2009
FROM
Endoscopy Systems - Global Strategic Business Report Endoscopy Systems - Global Strategic Business Report - Product Thumbnail Image

Endoscopy Systems - Global Strategic Business Report

The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World Annual estimates and forecasts are provided for the period 2010...

July 2013
FROM
Global and China Advanced Packaging Industry Report, 2009-2010 Global and China Advanced Packaging Industry Report, 2009-2010 - Product Thumbnail Image

Global and China Advanced Packaging Industry Report, 2009-2010

In this report, advanced packaging refers to leadframe-free packaging, mainly CSP and BGA Advanced packaging is mainly applied in mobile phone, CPU, GPU, Chipset, digital camera, digital video camera,...

September 2010
FROM
Global and China Advanced Packaging Industry Report, 2009-2010 Global and China Advanced Packaging Industry Report, 2009-2010 - Product Thumbnail Image

Global and China Advanced Packaging Industry Report, 2009-2010

In this report, advanced packaging refers to leadframe-free packaging, mainly CSP and BGA Advanced packaging is mainly applied in mobile phone, CPU, GPU, Chipset, digital camera, digital video camera,...

September 2010
FROM
Optoelectronics - Global Strategic Business Report Optoelectronics - Global Strategic Business Report - Product Thumbnail Image

Optoelectronics - Global Strategic Business Report

This report analyzes the worldwide markets for Optoelectronics in Millions of US$ by the following Segments - Optical Equipment & Systems, and Optical Components. Major segments analyzed under the Optical...

July 2010
FROM
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