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Search for: "MEMS Packaging 2012"

MEMS Oscillators - Global Markets, Technologies & Competitors: 2012-2018 Analysis & Forecasts

This report is a detailed and comprehensive analysis of the world market for MEMS-based oscillators Both quantitative and qualitative analyses are presented by product type A detailed Technology Overview...

Published:  November 2014
Price:  From

Wolfson WM7121 & WM7132 - Top & Bottom Port MEMS Microphones Technology Analysis

Set of 2 Reports Highlighting MEMS And Packaging Technologies Of Wolfson Microphones Before its acquisition by Cirrus Logic for $467M in April 2014, Wolfson Microelectronics released a series of...

Published:  August 2014
Price: 

Wolfson WM7121 & WM7132 - Top & Bottom Port MEMS Microphones Reverse Costing Analysis

Set of 2 Reports Highlighting MEMS And Packaging Technologies Of Wolfson Microphones Before its acquisition by Cirrus Logic for $467M in April 2014, Wolfson Microelectronics released a series of analog...

Published:  August 2014
Price: 

Automotive MEMS Sensor Market by Type, Application, & Geography - Analysis & Forecast (2014 - 2020)

Automotive MEMS Sensor Market by Type (Inertial Sensor, Microphone, & Pressure Sensor), Application (ADAS, ECU, ESC, HVAC, Safety & Security, In-Car Navigation, OIS Camera, Microphone in Cabin, & TPMS),...

Published:  March 2015
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BioChips & BioMEMS report BioChips & BioMEMS (Bio Microelectromechanical Systems) - World Markets, Applications & Opportunities: 2013-2018 Analysis & Forecasts

This report is a detailed study analyzing current trends in the dynamic and growing market for BioChips and BioMEMS including DNA chips, lab-on-a-chip, biosensors, drug delivery systems, microfluidic...

Published:  July 2014
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Global MEMS Microphone Market: Trends and Opportunities (2014-2019)

The report titled “Global MEMS Microphone Market: Trends & Opportunities (2014-2019)” provides an in-depth analysis of the global MEMS microphone market with detailed analysis of market sizing and growth,...

Published:  May 2015
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Frequency Control Components - Global Markets, Applications & Competitors: 2013-2018

A detailed and comprehensive report analyzing current trends in the dynamic market for frequency control devices, including quartz crystals & oscillators, SAW devices, ceramic resonators, rubidium oscillators,...

Published:  November 2014
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Rubidium Frequency Control Devices (RbXOs) - Global Markets, End-Users & Competitors: 2013-2018 Analysis & Forecasts

This report is a detailed and comprehensive analysis of the world market for RbXOs. Both quantitative and qualitative analyses are presented by product type. A detailed Technology Overview provides...

Published:  October 2014
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Quartz Crystals & Oscillators-Global Markets, Applications & Competitors: 2013-2018 Analysis & Forecasts

This report is a detailed and comprehensive analysis of the world market for quartz crystals and oscillators - in particular quartz crystals, XOs, TCXOs, VCXOs, and OCXOs Both quantitative and qualitative...

Published:  November 2014
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SAW Resonators - Global Markets, End-Users & Competitors: 2013-2018 Analysis & Forecasts

This report is a detailed and comprehensive analysis of the world market for SAW devices - in particular SAW resonators and filters Both quantitative and qualitative analyses are presented by product...

Published:  November 2014
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RF Front Ends for Mobile Devices 2014

This 200-page market study includes 155 charts, block diagrams, and exhibits The files include shipment, pricing, revenue, and market share analysis on every aspect of the RF front end, including: Power...

Published:  May 2014
Price: 

Ceramic Resonators - Global Markets, End-Users & Competitors: 2013-2018 Analysis & Forecasts

This report is a detailed and comprehensive analysis of the world market for ceramic resonators - in particular passive and electromechanical Both quantitative and qualitative analyses are presented...

Published:  November 2014
Price:  From

Global Semiconductor Photolithography Equipment Market 2016-2020

About Semiconductor Photolithography Equipment Photolithography, also known as optical lithography or UV lithography, is a method of microprocessor and printed circuit board (PCB) fabrication. The...

Published:  January 2016
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Global Micro Electro Mechanical Systems (MEMS) Market Analysis and Forecasts to 2015

“Global Micro Electro Mechanical Systems(MEMS) Market Analysis and Forecasts to 2015” that provides key data, information and analysis on the global MEMS market The report provides key market data and...

Published:  December 2009
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Micro-Nano Technology XIV

Series: Key Engineering Materials Vols 562-565 Category: Selected, peer reviewed papers from the 14th Annual Conference and the 3rd International Conference of the Chinese Society of Micro-Nano Technology...

Published:  September 2013
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3D ICs Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019

'3D ICs (MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED) Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019' This report analyzes...

Published:  January 2014
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Global Semiconductor Packaging Materials Market 2015-2019

About Semiconductor Packaging Materials Semiconductor packaging materials comprise metals, plastic, and ceramic components. They not only protect the IC on the semiconductor die, but also interconnect...

Published:  February 2015
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Global and Chinese IC Advanced Packaging Equipment Industry Report, 2013-2014

Packaging equipment can fall into two categories: wafer level and die level. And the former is typically included in wafer equipment as it is used in the manufacturing of wafer. Wafer level packaging...

Published:  August 2014
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Global and Chinese IC Advanced Packaging Equipment Industry Report, 2013-2014.

Packaging equipment can fall into two categories: wafer level and die level. And the former is typically included in wafer equipment as it is used in the manufacturing of wafer. Wafer level packaging...

Published:  August 2014
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Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

About Semiconductor Packaging and Assembly Equipment For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing,...

Published:  January 2016
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