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Search for: "MEMS Packaging 2012"

Wolfson WM7121 & WM7132 - Top & Bottom Port MEMS Microphones Technology Analysis

Set of 2 Reports Highlighting MEMS And Packaging Technologies Of Wolfson Microphones Before its acquisition by Cirrus Logic for $467M in April 2014, Wolfson Microelectronics released a series of...

Published:  August 2014
Price: 

Wolfson WM7121 & WM7132 - Top & Bottom Port MEMS Microphones Reverse Costing Analysis

Set of 2 Reports Highlighting MEMS And Packaging Technologies Of Wolfson Microphones Before its acquisition by Cirrus Logic for $467M in April 2014, Wolfson Microelectronics released a series of analog...

Published:  August 2014
Price: 

BioChips & BioMEMS report BioChips & BioMEMS (Bio Microelectromechanical Systems) - World Markets, Applications & Opportunities: 2013-2018 Analysis & Forecasts

This report is a detailed study analyzing current trends in the dynamic and growing market for BioChips and BioMEMS including DNA chips, lab-on-a-chip, biosensors, drug delivery systems, microfluidic...

Published:  July 2014
Price:  From

MEMS Oscillators - Global Markets, Technologies & Competitors: 2012-2018 Analysis & Forecasts

This report is a detailed and comprehensive analysis of the world market for MEMS-based oscillators Both quantitative and qualitative analyses are presented by product type A detailed Technology Overview...

Published:  November 2014
Price:  From

Automotive MEMS Sensor Market by Type, Application, & Geography - Analysis & Forecast (2014 - 2020)

Automotive MEMS Sensor Market by Type (Inertial Sensor, Microphone, & Pressure Sensor), Application (ADAS, ECU, ESC, HVAC, Safety & Security, In-Car Navigation, OIS Camera, Microphone in Cabin, & TPMS),...

Published:  March 2015
Price:  From

Frequency Control Components - Global Markets, Applications & Competitors: 2013-2018

A detailed and comprehensive report analyzing current trends in the dynamic market for frequency control devices, including quartz crystals & oscillators, SAW devices, ceramic resonators, rubidium oscillators,...

Published:  November 2014
Price:  From

Global MEMS Microphone Market: Trends and Opportunities (2014-2019)

The report titled “Global MEMS Microphone Market: Trends & Opportunities (2014-2019)” provides an in-depth analysis of the global MEMS microphone market with detailed analysis of market sizing and growth,...

Published:  May 2015
Price:  From

Rubidium Frequency Control Devices (RbXOs) - Global Markets, End-Users & Competitors: 2013-2018 Analysis & Forecasts

This report is a detailed and comprehensive analysis of the world market for RbXOs. Both quantitative and qualitative analyses are presented by product type. A detailed Technology Overview provides...

Published:  October 2014
Price:  From

Quartz Crystals & Oscillators-Global Markets, Applications & Competitors: 2013-2018 Analysis & Forecasts

This report is a detailed and comprehensive analysis of the world market for quartz crystals and oscillators - in particular quartz crystals, XOs, TCXOs, VCXOs, and OCXOs Both quantitative and qualitative...

Published:  November 2014
Price:  From

SAW Resonators - Global Markets, End-Users & Competitors: 2013-2018 Analysis & Forecasts

This report is a detailed and comprehensive analysis of the world market for SAW devices - in particular SAW resonators and filters Both quantitative and qualitative analyses are presented by product...

Published:  November 2014
Price:  From

Ceramic Resonators - Global Markets, End-Users & Competitors: 2013-2018 Analysis & Forecasts

This report is a detailed and comprehensive analysis of the world market for ceramic resonators - in particular passive and electromechanical Both quantitative and qualitative analyses are presented...

Published:  November 2014
Price:  From

Global Semiconductor Packaging Materials Market 2015-2019

About Semiconductor Packaging Materials Semiconductor packaging materials comprise metals, plastic, and ceramic components. They not only protect the IC on the semiconductor die, but also interconnect...

Published:  February 2015
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Global Semiconductor Photolithography Equipment Market 2016-2020

About Semiconductor Photolithography Equipment Photolithography, also known as optical lithography or UV lithography, is a method of microprocessor and printed circuit board (PCB) fabrication. The...

Published:  January 2016
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Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

About Semiconductor Packaging and Assembly Equipment For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing,...

Published:  January 2016
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Global and Chinese IC Advanced Packaging Equipment Industry Report, 2013-2014

Packaging equipment can fall into two categories: wafer level and die level. And the former is typically included in wafer equipment as it is used in the manufacturing of wafer. Wafer level packaging...

Published:  August 2014
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Global and Chinese IC Advanced Packaging Equipment Industry Report, 2013-2014. (Chinese Version)

Packaging equipment can fall into two categories: wafer level and die level. And the former is typically included in wafer equipment as it is used in the manufacturing of wafer. Wafer level packaging...

Published:  August 2014
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Global and Chinese IC Advanced Packaging Industry Report, 2013-2014 (Chinese Version)

Typically, an independent packaging and testing vendor is known as OSAT In 1997, the OSAT industry scale was no more than USD5 1 billion or so, making up 19 6% of the semiconductor industry, in sharp...

Published:  August 2014
Price:  From

Global and Chinese IC Advanced Packaging Industry Report, 2013-2014

Typically, an independent packaging and testing vendor is known as OSAT In 1997, the OSAT industry scale was no more than USD5 1 billion or so, making up 19 6% of the semiconductor industry, in sharp...

Published:  August 2014
Price:  From

RF Front Ends for Mobile Devices 2014

This 200-page market study includes 155 charts, block diagrams, and exhibits The files include shipment, pricing, revenue, and market share analysis on every aspect of the RF front end, including: Power...

Published:  May 2014
Price: 

Global and China Advanced Packaging Industry Report, 2009-2010 (Chinese Version)

In this report, advanced packaging refers to leadframe-free packaging, mainly CSP and BGA Advanced packaging is mainly applied in mobile phone, CPU, GPU, Chipset, digital camera, digital video camera,...

Published:  September 2010
Price:  From
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