Trends in Wireless Personal Area Networks Development: Assessment Technologies and Markets

  • ID: 1417972
  • Report
  • 153 Pages +
  • PracTel Inc
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This report reflects dynamics of WPAN developmental trends; and particular, addresses:

UWB WPAN.
The UWB industry is suffering from severe downturn. Several companies went out of business; other changed their profiles or merged. This is a result of:

- Severe competition and relatively high cost of this technology

- Uncertainty in the standards direction

- Unstable regulatory climate.

Currently, the industry concentrates on the following major applications:

- RTLS

- WUSB

- Military

- Radar.

In the analyzed time period, the UWB WPAN market will show little progress. It seems, though, that such a downturn is only temporary. There are indications of the regulatory stabilization (the FCC, in 2010, reaffirmed the UWB rights on existence (ET Docket No. 98-153 and ET Docket No. 04-352; effective by November 12, 2010); EU supports several UWB projects based on participation of leading vendors and research organizations). UWB value for WPAN is clear; and this technology will be given more opportunities to prove its place in the WPAN development.

ZigBee/802.15.4.
This technology is one of the leaders on the WPAN market; it can cover multiple applications that can be satisfied by low-to-middle rates transmission. The technology is standardized, but it still dynamically responds to the extended users’ requirements. It concentrates on applications that need networking of devices with extremely low power consumption, survivability and low cost. Examples of such applications include HANs, WSNs, and even remote control. The ZigBee Alliance is steadily developing new profiles, extending ZigBee specifics from Health Care to Smart Grid applications.

The ZigBee market shows all signs of progress that reflects this technology value for WPANs.

Visible Light Communications (VLC).
The report addresses the emerging VLC technology as one of potential leaders in the WPAN development with a wide range of characteristics suitable for variety of applications. The technology is still in the standardization stage (IEEE 802.15.7 and other). It promises to cover areas from several kilometers (with Kb/s speed); and supports communications with the speed of several hundred Mb/s at the smaller distances (4-10 meters). Its most attractive feature is that VLC, in many cases, can be built on the existing illumination infrastructures (for example, modulating LEDs.) Due to the fact that solid state lighting devices will prevail as a source of light in near future, office buildings, rooms, cars and other can use such added-value communications. First commercialized VLC products are expected in 2012-2014.

WPAN for Bandwidth - intensive Applications.
Rapid emerging of HDTV and related CE demand building WPANs with multiple Gb/s speeds to distribute uncompressed signals between various devices in a room or even in a house. Several WPAN technologies are emerging in this segment of the market. The most advanced are:

60 GHz radio. The report analyzes WirelessHD - IEEE 802.15.3c, ECMA and WiGig developments. The technologies may have a different basis (for example, WiGig is an extension of Wi-Fi), but all of them are united by the fact that they can support several Gb/s communications between CE devices that transmit uncompressed HD V/A. There are first commercial WirelessHD products on the market; with WiGig prototyping. The market is expected to reach sizable volume in 2012-2013.

WHDI (Amimon). WHDI is another technology to build bandwidth-intensive WPANs. These radios explore the 5 GHz band; and use sophisticated encoding of HD V/A signals. The WHDI products are in a market starting from 2008; there are multiple cooperation examples between Amimon and CE vendors. As the company stated, the technology can cover communications between CE devices located anywhere in a house.

The market segment for WPAN with bandwidth-intensive applications is still wide open, and it promises high rewards. The market is not restricted by technologies that are addressed in the report; there are other companies that are also introducing vendor-specific solutions.

The report analyzes all above technologies, their potentials and markets. The report is developed for a large audience of technical and managerial staff who is involved in the development of WPAN and related communications.

Target Audience:

This report is important to a wide population of researches, technical and sales staff involved in the developing of wireless services and products. It is recommended for both service providers and vendors that are working with related technologies. The report also helps to understand issues associated with relationship between WPAN communications and other technologies.

WPAN technologies are continuing to be developed, responding to demand for new applications that can satisfy diversified and dynamic users’ requirements. WPAN market segments are now spreading from a room environment, Home Area Networks and up to sophisticated military applications.

Research Methodology:

Considerable research was done using the Internet. Information from various Web sites was studied and analyzed. Evaluation of publicly available marketing and technical publications was conducted. Telephone conversations and interviews were held with industry analysts, technical experts and executives. In addition to these interviews and primary research, secondary sources were used to develop a more complete mosaic of the market landscape, including industry and trade publications, conferences and seminars.

The overriding objective throughout the work has been to provide valid and relevant information. This has led to a continual review and update of the information content.
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FEATURED COMPANIES

  • Agilent (Test platform)
  • ECMA
  • Laird (Modules)
  • Nanotron (Chipsets)
  • Pulse~ Link (chipsets)
  • SiBeam (Chipsets)
  • MORE
1.0 Introduction

1.1Beginning

1.2 Networking

1.3 Definition

1.3.1 Paradigm

1.3.2 4G and WPAN

1.4 Scope

1.5 Details

1.5.1 Bluetooth

1.5.2 IEEE 802.15.3a and UWB

1.5.3 Millimeter-Wave Technology

1.5.4 IEEE 802.15.4

1.5.5 VLC

1.6 WPAN Applications: Examples

1.6.1 Retailers

1.6.2 Route Delivery

1.6.3 Industrial Applications

1.6.4 Sharing Data in Meetings

1.6.5 Body-Centric Communication

1.6.6 Public Safety Communications (PSC)

1.6.7 Healthcare

1.6.8 Military

1.7 Research Methodology

1.8 Target Audience

2.0 WPAN and Radio Technologies

2.1 Ultra Wideband (UWB)

2.1.1 Downturn

2.1.2 General: History

2.1.3 Benefits

2.1.4 Definition

2.1.5 Rates

2.1.6 Spectrum Allocation

2.1.7 Regulations

2.1.8 Major Features

2.1.9 Standards

2.1.9.1 Multiband OFDM

2.1.9.2 DS-UWB

2.1.9.3 Groups

2.1.9.4 ECMA

2.1.9.5 WiNET

2.1.9.6 EC

2.1.10 Market Estimate

2.1.10.1 General

2.1.10.2 Geographical Segmentation

2.1.10.3 Forecast

2.1.11 UWB and WPAN

2.1.12 Industry

- Alereon (chipsets)

- Camero (radar, equipment for first responders)

- Gefen (Device)

- General Atomics (chipsets)

- Multispectral (Zebra)

- Pulse~ Link (chipsets)

- RealTek (IC)

- Sigma Designs (Chipset)

- Time Domain (chipsets-fusion of communications & radar)

- Ubisense (RFID-tracking)

- Wisair (WUSB-chipsets)

2.2 ZigBee-IEEE802.15.4

2.2.1 General

2.2.1.1 Major features

2.2.1.2 Major Traffic Types

2.2.2 Device Types

2.2.3 Protocol Stack

2.2.3.1 Physical and MAC Layers – IEEE802.15.4

2.2.3.1.1 Frame

2.2.4 Upper Layers

2.2.5 Interoperability

2.2.6 Security

2.2.7 Platform Considerations

2.2.7.1 Battery Life

2.2.8 Technology Benefits and Limitations

2.2.9 Standardization Process

2.2.9.1 ZigBee Alliance

2.2.9.1.1 Objectives

2.2.9.2 802.15.4- ZigBee Basis

2.2.9.3 IEEE 802.15.4 Radio

2.2.9.4 Application Specifics

2.2.10 ZigBee Role

2.2.11 Market

2.2.11.1 Expectations

2.2.11.2 Segments

2.2.11.3 Forecast

2.2.12 Industry

- Amber (RF Modules and Systems)

- Alektrona (Gateways)

- Atmel (Chipsets)

- Awarepoint (Health Care System)

- Cirronet-RFM (Modules Industrial Automation)

- Digi (Modules)

- Ember (Chipsets, SW)

- Helicomm (Modules)

- Jennic (Chipsets-Modules) - Acquired by NXP in 2010

- Freescale (Chipsets)

- Meshnetics (HW, SW)

- Laird (Modules)

- M&R Lawugger GmbH (SW, Modules)

- Nanotron (Chipsets)

- NXP Semiconductor

- Oki Semiconductor

- Panasonic (Modules)

- Radiocrafts (Modules)

- RadioPulse (Chips)

- Renesas (Platforms)

- ST (modules)

- SyChip

- Telegesis (Modules)

- TI (Chipsets)

2.3 Visible Light Communications

2.3.1 General

2.3.1.1 Free Space Optics and VLC

2.3.2 Details

2.3.2.1 Communications Channel

2.3.2.2 Transmitter

2.3.2.3 Receiver

2.3.2.4 Major Characteristics

2.3.2.4.1 Limiting Factors

2.3.2.5 LED Evolution

2.3.2.5.1 General

2.3.2.5.2 Development and Market

2.3.2.6 Applications

2.3.2.7 VLC Standards Development

2.3.2.7.1 The IEEE

2.3.2.7.1.1 Considerations

2.3.2.7.1.2 Project

2.3.2.7.2 Jeita (Japan Electronics and Information Technology Industries Association)

2.3.2.7.3 Visible Light Communications Consortium (VLCC)

2.3.2.7.3.1 General

2.3.2.7.3.2 Experimental Systems- VLCC Projects

2.3.3 Companies and Organizations

- ECMA

- Nakagawa Laboratories

- NEC

- Siemens

- Tamura

2.4 WPAN for Bandwidth-intensive Applications

2.4.1 New Industry

2.4.2 60 GHz Radio

2.4.2.1 General

2.4.2.2 Opportunities

2.4.2.3 Characteristics

2.4.2.4 Specifics

2.4.2.5 Benefits and Challenges

2.4.2.6 Specifics of Applications

2.4.3 mm-Wave Technologies

2.4.3.1 General

2.4.3.2 WirelessHD

2.4.3.2.1 Group

2.4.3.2.2 Goal

2.4.3.2.3 Details: WirelessHD Technology

2.4.3.2.4 Completion: Specification

2.4.3.2.5 Progress and Issues

2.4.3.2.6 Market Estimate

2.4.3.2.7 Industry

- Agilent (Test platform)

- Cables To Go (WiHD Device)

- LG

- SiBeam (Chipsets)

2.4.3.3 IEEE 802.15.3c-Physical Layer of WiHD

2.4.3.3.1 Current Status and Details

2.4.3.3.2 Benefits

2.4.3.3.3 IBM-MediaTek (Chipsets for 60 GHz – 802.15.3c)

2.4.3.4 Wi-Fi Extension- WiGig

2.4.3.5 ECMA

2.4.4 Amimon - WHDI

2.4.4.1 General

2.4.4.2 Principle

2.4.4.3 Industry

2.5 Comparison

3.0 Conclusions

List of Figures:

Figure 1: WPAN Place - IEEE

Figure 2: UWB Spectrum

Figure 3: DS-UWB Spectrum Characteristics

Figure 4: Spectrum Regulations-UWB

Figure 5: TAM: Global UWB IC Revenue ($B)

Figure 6: TAM: Global UWB IC (Unit M)

Figure 7: ZigBee Protocol Stack

Figure 8: ZigBee Compliant Platform

Figure 9: TAM: U.S. ZigBee Chipsets Sale ($B)

Figure 10: TAM: U.S. ZigBee Chipsets Sale (Mil Units)

Figure 11: ZigBee: Market Segments Distribution (2010)

Figure 12: ZigBee Market: Home Segment

Figure 13: ZigBee Market: Industry Segment

Figure 14: Illustration-VLC Channel

Figure 15: U.S. LED Bulbs for Illumination: Market Size ($B)

Figure 16: U.S. LED Bulbs for Illumination: Market Size (Mil Units)

Figure 17: Cost and Brightness- Light Sources

Figure 18: 60 GHz “Open” Spectrum

Figure 19: TAM: U.S. WiHD Equipment Sales ($M US)

Figure 20: TAM: US WiHD Equipment Sales (Channel Pair; Units 000)

Figure 21: IEEE802.15 Structure

List of Tables:

Table 1: MB-OFDM UWB Spectrum Designation

Table 2: Comparison: DS-UWB and MB-OFDM

Table 3: Parameters

Table 4: VLC Properties

Table 5: VLC, IR and RF Communications Applications Comparison

Table 6: Locations Technologies-VLC Place

Table 7: Use Cases

Table 8: Bandwidth Utilization Details

Table 9: HDV Formats and Required Speed

Table 10: Attenuation

Table 11: Properties

Table 12: WPAN Technologies
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- Agilent (Test platform)

- Cables To Go (WiHD Device)

- LG

- SiBeam (Chipsets)

- ECMA

- Nakagawa Laboratories

- NEC

- Siemens

- Tamura
- Amber (RF Modules and Systems)

- Alektrona (Gateways)

- Atmel (Chipsets)

- Awarepoint (Health Care System)

- Cirronet-RFM (Modules Industrial Automation)

- Digi (Modules)

- Ember (Chipsets, SW)

- Helicomm (Modules)

- Jennic (Chipsets-Modules) - Acquired by NXP in 2010

- Freescale (Chipsets)

- Meshnetics (HW, SW)

- Laird (Modules)

- M&R Lawugger GmbH (SW, Modules)

- Nanotron (Chipsets)

- NXP Semiconductor

- Oki Semiconductor

- Panasonic (Modules)

- Radiocrafts (Modules)

- RadioPulse (Chips)

- Renesas (Platforms)

- ST (modules)

- SyChip

- Telegesis (Modules)

- TI (Chipsets)

- Alereon (chipsets)

- Camero (radar, equipment for first responders)

- Gefen (Device)

- General Atomics (chipsets)

- Multispectral (Zebra)

- Pulse~ Link (chipsets)

- RealTek (IC)

- Sigma Designs (Chipset)

- Time Domain (chipsets-fusion of communications & radar)

- Ubisense (RFID-tracking)

- Wisair (WUSB-chipsets)
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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