Infineon EWLP Package Reverse Costing

  • ID: 1463421
  • Report
  • Region: Global
  • 53 Pages
  • System Plus Consulting
1 of 3
The First Reverse Analysis Report of a Fan-out Wafer Level Package!

Reverse costing report of the enhanced Wafer Level BGA (eWLB) package used in the X-GOLD™ 213 circuit from Infineon, the first fan-out wafer level package in production.

eWLB is a Ball Grid Array package based on the emerging Fan-Out Wafer Level Package (FO-WLP) concept. All the packaging operations are done at the wafer level, and a fan-out area is provided, which extends the package size beyond the IC surface area to allow for higher ball counts. The ball pitch is 0.5mm and only one redistribution layer is used for this 217 balls 8x8mm package.

The eWLB is manufactured on 200mm wafers by Infineon who licensed the technology to ASE and STATS Chip PAC.

This report provides for a complete teardown of the XGOLD213™ eWLB package including:

- Detailed photos
- Material analysis
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost-breakdown
- Selling price estimation
Note: Product cover images may vary from those shown
2 of 3
Glossary

Overview / Introduction
- Executive Summary
- Reverse Costing Methodology

Fan-out package Principle
- Fan-in & Fan-out WLP
- Benefits of eWLB
- eWLB–Reconstitution Flow

Physical Analysis
- Physical Analysis Methodology
- Synthesis
- Mobile Phone & PCB
- Underfill
- Die in the package
- Pads and the redistribution layer
- The die Shift issue
- Fan-out
- Protective layer
- Redistribution layer
- Bumping process

Manufacturing Process Flow
- The Process Flow Main Steps
- eWLB

Process Flow
- Fan-out Wafer Molding
- Redistribution
- Bumping and Dicing

Cost Analysis
- Synthesis of the Cost Analysis
- Assumptions
-Packaging Yields
- eWLB

Wafer Cost
- Wafer Cost per Equipment Type
- Wafer Cost per Consumable Type
- eWLB

Package Cost Estimated Manufacturer Price Analysis
- Price definitions
- Manufacturers financial ratios
- Estimated manufacturer Price

Conclusion
Note: Product cover images may vary from those shown
3 of 3

Loading
LOADING...

4 of 3
Question Does this product include specific information regarding the materials, both direct and indirect, used in the manufacture of eWLB?
Answer Yes the materials used for the WL package are identified in the product. However the provider of these materials is not always known
Note: Product cover images may vary from those shown
Adroll
adroll