Freescale MPXY8300 MEMS TPMS Reverse Costing - Product Image

Freescale MPXY8300 MEMS TPMS Reverse Costing

  • ID: 1463428
  • Report
  • Region: Global
  • 104 Pages
  • System Plus Consulting
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Reverse costing & engineering process analysis of the Freescale MPXY8300A TPMS sensor

- Analyze the cost of projects at the R&D level
- Enhance the negotiation power of purchasing managers
- Benchmark competitor's products

Based on a complete teardown process the report provides an estimation of the production cost aswell as the selling price of the circuit.

This Freescale MPXY8300A TPMS component is used in cars, trucks or buses to detect under – inflated or over-inflated tires. It uses a Multi-Chip Pack age containing 4 separate dies: 2 capacitive MEMS devices (pressure sensor, 2-axis accelerometer with X and Z axis) and 2 Integrated Circuits (8-bit microcontroller, radio frequency transmitter).

This report provides complete teardown and cost estimation of the component with:

- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
Note: Product cover images may vary from those shown
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Glossary

Overview/Introduction
- Executive Summary
- Reverse Costing Methodology

Freescale Company Profile

Physical Analysis
- Synthesis of the physical analysis
- Physical analysis methodology
- Tire Pressure Monitoring System (TPMS)
- Multi-Chip Package
- Package characteristics & markings
- Package opening –Bondings Number
- Package opening –Encapsulation
- MCU markings
- MCU dimensions
- MCU minimal dimension and metal layers
- MCU process characteristics
- RFX markings
- RFX dimensions
- RFX minimal dimension and metal layers
- RFX process characteristics
- G-die markings & dimensions
- G-die : cap opening
- G-die : sensors dimensions
- G-die : x-axis structure
- G-die : x-axis process characteristics
- G-die : z-axis structure
- G-die : z-axis process characteristics
- G-die process characteristics
- P-die markings
- P-die dimensions
- P-die minimal dimension and metal layers
- P-die : sensors dimensions
- P-die : “Sense” sensor process characteristics
- P-die : “Reference” sensor process characteristics
- P-die process characteristics

Manufacturing Process Flow
- Overview
- MCU process flow
- RFX process flow
- G-die process flow : sensor wafer
- G-die process flow : cap wafer
- P-die process flow : ASIC
- P-die process flow : Sensor
- Description of the Wafer Fabrication Units

Cost Analysis
- Synthesis of the cost analysis
- Main steps of economic analysis
- Yields explanation
- MCU wafer cost
- MCU probe & dicing cost
- MCU die Cost
- RFX wafer cost
- RFX probe & dicing cost
- RFX die cost
- G-die wafer cost
- G-die wafer cost per step
- G-die probe & dicing cost
- G-die die cost
- P-die wafer cost
- P-die wafer cost per step
- P-die probe & dicing cost
- P-die die cost
- MPXY8300A packaging cost
- MPXY8300A final test cost
- MPXY8300A component manufacturing Cost
- Yield synthesis

Estimated Manufacturer Price Analysis
- Supply Chain Analysis
- Manufacturer ratios
- Estimated manufacturer Price

Conclusion
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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