This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.
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Nondestructive SEM for Surface and Subsurface Wafer Imaging
Surface Inspection-Research and Development
Wafer Level Reliability for High-Performance VLSI Design
Wafer Level Reliability Testing: an Idea Whose Time Has Come
Micro-Focus X-Ray Imaging
Measurement of Opaque Film Thickness
Intelligent Laser Soldering Inspection and Process Control
Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits
Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement
""Whole Wafer"" Scanning Electron Microscopy