Materials Science of Thin Films. Edition No. 2

  • ID: 1767841
  • Book
  • 794 Pages
  • Elsevier Science and Technology
1 of 4
This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field.

Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.
Note: Product cover images may vary from those shown
2 of 4
Foreword to First Edition
A Historical Perspective
Chapter 1 A Review of Materials Science
1.1. Introduction
1.2. Structure
1.3. Defects in Solids
1.4. Bonds and Bands in Materials
1.5. Thermodynamics of Materials
1.6. Kinetics
1.7. Nucleation
1.8. An Introduction to Mechanical Behavior
1.9. Conclusion
Chapter 2 Vacuum Science and Technology
2.1. Introduction
2.2. Kinetic Theory of Gases
2.3. Gas Transport and Pumping
2.4. Vacuum Pumps
2.5. Vacuum Systems
2.6. Conclusion
Chapter 3 Thin-Film Evaporation Processes
3.1. Introduction
3.2. The Physics and Chemistry of Evaporation
3.3. Film Thickness Uniformity and Purity
3.4. Evaporation Hardware
3.5. Evaporation Processes and Applications
3.6. Conclusion
Chapter 4 Discharges, Plasmas, and Ion-Surface Interactions
4.1. Introduction
4.2. Plasmas, Discharges, and Arcs
4.3. Fundamentals of Plasma Physics
4.4. Reactions in Plasmas
4.5. Physics of Sputtering
4.6. Ion Bombardment Modification of Growing Films
4.7. Conclusion
Chapter 5 Plasma and Ion Beam Processing of Thin Films
5.1. Introduction
5.2. DC, AC, and Reactive Sputtering Processes
5.3. Magnetron Sputtering
5.4. Plasma Etching
5.5. Hybrid and Modified PVD Processes
5.6. Conclusion
Chapter 6 Chemical Vapor Deposition
6.1. Introduction
6.2. Reaction Types
6.3. Thermodynamics of CVD
6.4. Gas Transport
6.5. Film Growth Kinetics
6.6. Thermal CVD Processes
6.7. Plasma-Enhanced CVD Processes
6.8. Some CVD Materials Issues
6.9. Safety
6.10. Conclusion
Chapter 7 Substrate Surfaces and Thin-Film Nucleation
7.1. Introduction
7.2. An Atomic View of Substrate Surfaces
7.3. Thermodynamic Aspects of Nucleation
7.4. Kinetic Processes in Nucleation and Growth
7.5. Experimental Studies of Nucleation and Growth
7.6. Conclusion
Chapter 8 Epitaxy
8.1. Introduction
8.2. Manifestations of Epitaxy
8.3. Lattice Misfit and Defects in Epitaxial Films
8.4. Epitaxy of Compound Semiconductors
8.5. High-Temperature Methods for Depositing Epitaxial Semiconductor Films
8.6. Low-Temperature Methods for Depositing Epitaxial Semiconductor Films
8.7. Mechanisms and Characterization of Epitaxial Film Growth
8.8. Conclusion
Chapter 9 Film Structure
9.1. Introduction
9.2. Structural Morphology of Deposited Films and Coatings
9.3. Computational Simulations of Film Structure
9.4. Grain Growth, Texture, and Microstructure Control in Thin Films
9.5. Constrained Film Structures
9.6. Amorphous Thin Films
9.7. Conclusion
Chapter 10 Characterization of Thin Films and Surfaces
10.1. Introduction
10.2. Film Thickness
10.3. Structural Characterization of Films and Surfaces
10.4. Chemical Characterization of Surfaces and Films
10.5. Conclusion
Chapter 11 Interdiffusion, Reactions, and Transformations in Thin Films
11.1. Introduction
11.2. Fundamentals of Diffusion
11.3. Interdiffusion in Thin Metal Films
11.4. Compound Formation and Phase Transformations in Thin Films
11.5. Metal-Semiconductor Reactions
11.6. Mass Transport in Thin Films under Large Driving Forces
11.7. Conclusion
Chapter 12 Mechanical Properties of Thin Films
12.1. Introduction
12.2. Mechanical Testing and Strength of Thin Films
12.3. Analysis of Internal Stress
12.4. Techniques for Measuring Internal Stress in Films
12.5. Internal Stresses in Thin Films and Their Causes
12.6. Mechanical Relaxation Effects in Stressed Films
12.7. Adhesion
12.8. Conclusion
Note: Product cover images may vary from those shown
3 of 4


4 of 4
Ohring, Milton
Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.
Note: Product cover images may vary from those shown
5 of 4
Note: Product cover images may vary from those shown