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Omnivision Wafer- Level Camera - WLP CIS + WL - Optic Reverse Costing

  • ID: 2077724
  • Report
  • December 2011
  • Region: Global
  • 110 Pages +
  • System Plus Consulting
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- Physical Analysis of the Camera and the CMOS Image Sensor
- Step by Step Reconstruction of the Process Flow
- Cost of Manufacturing and Estimation of Selling Price

System Plus Consulting is proud to publish the reverse costing report of the OVM7692 Camera Module supplied by Omnivision.

The module integrates a 1.75µm pixel VGA CMOS Image Sensor (CIS) ref. OV289AA from Omnivision. The CIS is Wafer-Level Packaged (WLP) using a Shellcase RT process licensed by Tessera. The optical module comes from VisEra technology and is manufactured with a wafer-level approach. This camera module is designed for mobile and netbook applications.

This report provides complete teardown of the camera module with:

- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
Note: Product cover images may vary from those shown
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- Executive Summary
- Reverse Costing Methodology

Companies Profiles
- Omnivision Profile
- TSMC Profile
- VisEra & Xintec profiles

Physical Analysis
- Physical Analysis Methodology
- Camera Module Views & Dimensions
- Camera X-Ray
- Camera Module Disassembly
- CIS Views & Dimensions
- CIS Marking
- CIS Pads
- CIS Microlenses
- CIS Pixels
- CIS Technology node
- Camera Module Cross-section
- Optical Module Cross-section
- CIS Packaging Cross-section
- CIS Cross-section

Manufacturing Process Flow
- Global Overview
- CIS Process Flow
- CIS Wafer-level packaging Process Flow
- Description of the CIS Wafer Fabrication Units
- WL-Optic Process Flow
- Description of the WL-Optic Wafer Fabrication Unit

Cost Analysis
- CIS Front-End Cost
- CIS WLP Cost
- CIS WLP Cost per Process Steps
- CIS WLP : Equipment Cost per Family
- CIS WLP : Material Cost per Family
- CIS Die Cost
- WL-Optic Front-End Cost
- WL-Optic Cost per Process Steps
- WL-Optic : Equipment Cost per Family
- WL-Optic : Material Cost per Family
- WL-Optic : Test, dicing and assembly
- WL-Optic Price
- Back-End : Final Assembly & Test
- Camera Module Cost (CIS + WLO + Test)

Estimated Price Analysis

Note: Product cover images may vary from those shown
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