Epcos T4060 MEMS Microphone Reverse Costing Analysis

  • ID: 2090568
  • Report
  • Region: Global
  • System Plus Consulting
1 of 3
- Physical Analysis of the Devices
- Step by Step Reconstruction of the Process Flow
- Cost of Manufacturing and Estimation of Selling Price

System Plus Consulting is proud to publish the reverse costing report of the T4060 MEMS microphone from EPCOS.

Manufactured in the EPCOS CSMP™ “Chip Size MEMS Package” technology, the component offers a full integration of a MEMS transducer and an amplification ASIC in a tiny 4-pin package (2,65mm x 1.81mm x 0,95mm). The MEMS transducer is a condenser microphone with a flexible poly-Si membrane and a rigid reference electrode designed and manufactured by EPCOS. The T4060 is targeted for high-end consumer applications: mobile phones, MP3 players and digital cameras.

This report provides complete teardown of the MEMS with:

- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
Note: Product cover images may vary from those shown
2 of 3

- Executive Summary
- Reverse Costing Methodology

EPCOS Company Profile
- TDK-EPC Profile

Physical analysis
- Physical Analysis Methodology: Package Characteristics & Markings, Package X-Ray, Package Cross-Section, Package Opening
- Microphone - ASIC: ASIC Dimension, ASIC Minimal Dimension and Metal, ASIC Process Characteristics
- Microphone - MEMS: MEMS Dimension, MEMS Back-Plate, MEMS Membrane, MEMS Cross Section, MEMS Process Characteristics

Manufacturing Process Flow
- Overview
- ASIC/MEMS Process Flows
- Description of the Wafer Fabrication Units

Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Supply Chain Analysis
- Manufacturers financial ratios
- Yields Explanation
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 Cost (Probe Test and Dicing)
- ASIC Die Cost (Front End + Back End 0)
- MEMS Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End: Equipment Cost per Family
- MEMS Front-End: Material Cost per Family
- Back-End 0: Packaging, Probe Test and Dicing Cost
- Back-End 0 Cost per Process Steps
- Back-End 0: Dies Cost (Front End + Back End 0)
- Back-End 1: Final Test & Calibration Cost
- T4060 Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis
Note: Product cover images may vary from those shown
3 of 3


4 of 3
Note: Product cover images may vary from those shown