Handbook of Wafer Bonding

  • ID: 2105749
  • Book
  • 425 Pages
  • John Wiley and Sons Ltd
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The focus behind this book on wafer bonding is the fast paced changes in the research and development in three–dimensional (3D) integration, temporary bonding and micro–electro–mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry–near research organizations, this handbook and reference presents dependable, first–hand information on bonding technologies.

Part I sorts the wafer bonding technologies into four categories – Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.

This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
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TECHNOLOGIES

A. Adhesive and Anodic Bonding

Glass Frit Wafer Bonding

Wafer Bonding Using Spin–On Glass as Bonding Material

Polymer Adhesive Wafer Bonding

Anodic Bonding

B. Direct Wafer Bonding

Direct Wafer Bonding

Plasma–Activated Bonding

C. Metal Bonding

Au/Sn Solder

Eutectic Au–In Bonding

Thermocompression Cu–Cu Bonding of Blanket and Patterned Wafers

Wafer–Level Solid–Liquid Interdiffusion Bonding

D. Hybrid Metal/Dielectric Bonding

Hybrid Metal/Polymer Wafer Bonding Platform

Cu/SiO2 Hybrid Bonding

Metal/Silicon Oxide Hybrid Bonding

APPLICATIONS

Microelectromechanical Systems

Three–Dimensional Integration

Temporary Bonding for Enabling Three–Dimensional Integration and Packaging

Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three–Dimensional Integrated Systems

Thin Wafer Support System for above 250°C Processing and Cold De–bonding

Temporary Bonding: Electrostatic
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Peter Ramm
James Jian–Qiang Lu
Maaike M. V. Taklo
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