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Materials Reliability Issues in Microelectronics: Volume 225. MRS Proceedings

  • ID: 2129098
  • Book
  • 354 Pages
  • Cambridge University Press
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With the increased complexity of modern integrated circuits, it is important that reliability problems be attacked properly with the appropriate tools. This volume recognizes that almost all reliability problems are materials problems, and helps to put 'reliabilty physics' on a firm scientific foundation. Topics include: electromigration; stress effects on reliability; stress and packaging; metallization; device, oxide and dielectric reliability; new investigative techniques; corrosion.
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James R. Lloyd
Frederick G. Yost
Paul S. Ho IBM T J Watson Research Center, New York.
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