Mechanical Behavior of Materials and Structures in Microelectronics: Volume 226. MRS Proceedings

  • ID: 2129099
  • Book
  • 472 Pages
  • Cambridge University Press
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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
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Part I - Metals;

Part II - Organic Materials;

Part III - Semiconductors;

Part IV - Thin Films and Coatings;

Part V - Stress-Strain and Fracture Analyses;

Part VI - Reliability Issues.
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Ephraim Suhir AT&T Bell Laboratories, New Jersey.

Robert C. Cammarata The Johns Hopkins University.

Deborah D. L. Chung State University of New York, Buffalo.

Masahiro Jono Osaka City University, Japan.
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