Electronic Packaging Materials Science X: Volume 515. MRS Proceedings

  • ID: 2129334
  • Book
  • 262 Pages
  • Cambridge University Press
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Advanced packaging applications are demanding increasingly more innovative materials sets in order to ensure overall package reliability. In addition, as we migrate towards higher-density inter-connects, the assembly operation will require new processes and process materials to guarantee both performance and manufacturability. This book explores the questions of materials, processes and reliability for high-density package solutions. The book is strengthened by invited and contributed papers from a host of national and international experts. Topics include: interfacial adhesion behavior; flip-chip interconnections; high-density substrates; thermomechanical behavior and packaging reliability issues.
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Daniel J. Belton
Michael Gaynes
Elizabeth G. Jacobs
Raymond Pearson Lehigh University, Pennsylvania.

Tien Wu
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