Thin Films: Stresses and Mechanical Properties IX: Volume 695. MRS Proceedings

  • ID: 2129478
  • Book
  • 534 Pages
  • Cambridge University Press
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This book, the ninth in a popular series from the Materials Research Society, is strengthened by invited and contributed papers covering a wide range of subjects, from processing-microstructure-mechanical property relationships, strain effects and self-organization in thin films, nanoscale defects and thermomechanical behavior of materials, to novel nanscale materials testing. While the collection continues the series theme of materials science related modeling and characterization of mechanical properties of materials, special focus is given to: strain relaxation and strengthening mechanisms; defects formation; mechanical properties and nanoscale testing; adhesion and fracture; thin-film applications in MEMS; computational modeling and experiments; and film deposition, microstructure, evolution and intrinsic stress.
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Cengiz S. Ozkan University of California, Riverside.

L. Ben Freund Brown University, Rhode Island.

Robert C. Cammarata The Johns Hopkins University.

Huajian Gao Max-Planck-Institut für Metallforschung, Germany.
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