+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)

PRINTER FRIENDLY

Chemical-Mechanical Planarization: Volume 767. MRS Proceedings

  • ID: 2129525
  • Book
  • 348 Pages
  • Cambridge University Press
1 of 2
Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.
Note: Product cover images may vary from those shown
2 of 2

Loading
LOADING...

3 of 2
Duane S. Boning Massachusetts Institute of Technology.

Katia Devriendt
Michael R. Oliver
David J. Stein
Ingrid Vos
Note: Product cover images may vary from those shown
Adroll
adroll