Thin Films: Volume 875. Stresses and Mechanical Properties XI. MRS Proceedings

  • ID: 2129585
  • Book
  • 449 Pages
  • Cambridge University Press
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This book has a long tradition of representing current topics in thin-film properties and how they are related to the performance and reliability of thin-film structures. Several emerging and well-developed technologies rely on understanding the behavior of these structures. This book provides a forum for an exchange of ideas among researchers who are interested in the mechanical behavior of thin films, broadly applied to their materials choice or methodology. The book focuses on stress-related phenomena in thin films for a wide range of materials. Of particular interest are studies that explore the frontiers of thin-film materials science with regard to materials selection or size scale. Topics include: elasticity in thin films; characterizing thin films by nanoindentation; mechanical behavior of nanostructured films; mechanical properties of thin; thin-film plasticity; thin-film plasticity; thin-film plasticity; novel testing techniques; in situ characterization techniques; adhesion and fracture of thin films; fatigue and stress in interconnect and metallization; deformation, growth and microstructure in thin films and thin-film processing.
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Thomas E. Buchheit
Andrew M. Minor
Ralph Spolenak ETH Zentrum, Switzerland.

Kazuki Takashima Kumamoto University, Japan.
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