The growing polyfunctionality of next-generation devices for optical, communication, military, automotive, medical, sensing and memory applications requires an ever-increasing passive-to-active ratio. Integration of passives is essential to ensure the continuing advancement and growth of information and communication technologies while maintaining or lowering the current cost and size of devices. This book, first published in 2007, discusses advances, the current status, and future challenges in the broad area of materials integration for passive components and smart systems. It focuses on packaging and embedded components and reviews low-temperature co-fired ceramic (LTCC) components and the role of interfaces and chemical compatibility and how they influence module design. The road from design to actual embedded circuit elements and applications on different substrates is discussed. Current miniaturization and integration strategies and processes for medical and RF systems-in-package are featured. It also highlights poster presentations and a wide variety of topics in smart device and system integration are presented. The book concludes with papers on MEMS and NEMS engineering and on magnetic components.
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