Freescale MAG3110 3-axis Electronic Compass Reverse Costing Analysis

  • ID: 2152770
  • Report
  • Region: Global
  • 100 Pages +
  • System Plus Consulting
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- Physical Analysis of the Devices
- Step by Step Reconstruction of the Process Flow
- Cost of Manufacturing and Estimation of Selling Price

System Plus Consulting is proud to publish the reverse costing report of the 3-axis electronic compass supplied by Freescale Semiconductor.

The MAG3110 is a 3-axis digital magnetometer using Magnetic Tunnel Junction (MTJ) principle. The manufacturing of the sensor is realized by Everspin
Technologies, a leader in MRAM products. Compatible with SMD process, the component is provided in a standard 2x2x0.85mm DFN 10-pin package.

The MAG3110 is suitable for various applications including Electronic Compass, Dead-reckoning assistance for GPS backup and Location-based
Services.

This report provides complete teardown of the sensor with:

- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
Note: Product cover images may vary from those shown
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Glossary

Overview/Introduction
- Executive Summary
- Reverse Costing Methodology

Companies Profile
- Freescale/Everspin Profil
- MAG3110 Characteristics
- Business Model

Physical analysis
- Physical Analysis Methodology
- Package Characteristics & Markings
- Package X-Ray
- Package Cross-Section
- Package Opening
- ASIC Dimensions
- ASIC Markings
- ASIC Cross-Section
- Sensor Dimensions
- Sensor Markings
- Sensor Cross-section
- X(Y)-Axes Sensors Cross-section
- X(Y)-Axes Sensors Delayering
- X(Y)-Axes MTJ Structure Cross-Section
- Z-Axis Sensor Delayering
- Z-Axis Sensor Cross-Section

Manufacturing Process Flow
- Overview
- ASIC Process
- Sensor Process
- Description of the Wafer Fabrication Units

Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Yields Explanation
- Yields Hypotheses
- Die per wafer & Probe Test
- ASIC Front-End : Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
- ASIC Die Cost
- Sensor Front-End : Hypotheses
- Sensor Front-End Cost
- Sensor Back-End 0 : Probe Test & Dicing
- Sensor Die Cost (Front End + Back End 0)
- Back-End 1 : Packaging Cost
- Back-End 1 : Final test & Calibration Cost
- MAG3110 Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

Conclusion
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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