Semiconductor Micromachining. Techniques and Industrial Applications. Volume 2

  • ID: 2178354
  • Book
  • 408 Pages
  • John Wiley and Sons Ltd
1 of 4
Semiconductor Micromachining – Fundamentals and Technology – is a two volume work in which, for the first time, the various disciplines associated with the theory and practice of device fabrication are brought together in one comprehensive reference source. Volume 1 contains a detailed coverage of semiconductor electrochemistry and physics whilst Volume 2 describes the wide range of microengineering technologies with details of practical applications. The authors for each chapter have been carefully selected for their expertise and are acknowledged leaders in their respective fields. The purpose of this book is to enable workers in the area of semiconductor micromachining to have ready access to the basic literature, essential to provide a solid basis for the many different aspects of physics, chemistry, electronics and engineering involved with this technology. The main focus of the book is on structures based on silicon, the most common and versatile of the current range of commercially available semiconductors, but other materials such as III–V semiconductors are also considered. Together these two volumes provide an indispensable reference text for this fast growing area of applied science. It will be of value to a wide range of academic and industrial scientists, technologists and engineers who wish to expand their knowledge in this area of science and for whom thus far, there has been no convenient reference work. Volume 1: Fundamental Electrochemistry and Physics
Note: Product cover images may vary from those shown
2 of 4

Volume 2

Anisotrophy and the Micromachining of SiliconA. Campbell, et al.

Etch StopsS. Collins

Photonic Integrated Circuits, Technology and ConceptsR. Matz

Monolithically Integrated Sensors for Mechanical Quantities in Standard CMOS ProcessingH. Offereins, et al.

Silicon on InsulatorsC. Harendt and G. Roos

Integrated Sensors and ActuatorsN. Najaft

Smart SensorsN. Najaft and J. Moyne

Anodic Oxidation of Silicon as a Low–Temperature Passivation TechniqueG. Mende

Micromachined Optoelectronic Structures and DevicesP. Deimel

Wet and Dry Etching: A Comparison in the Context of Solid State Electronics ApplicationsK. Bachmann


Note: Product cover images may vary from those shown
3 of 4


4 of 4
S. A. Campbell
H. J. Lewerenz
Note: Product cover images may vary from those shown
5 of 4
Note: Product cover images may vary from those shown
Order Online - visit: