"For the first time, this book is taking a closer look at the signal integrity problems faced by both high–performance and cost–performance applications, digital and mixed–signal integrated circuits."
–Alina Deutsch, Research Staff Member
T.J. Watson Research Center, International Business Machines
"This book surveys the latest literature on electrical integrity analysis and design and is, therefore, an invaluable resource for anyone designing systems–on–a–chip."
–Kenneth L. Shepard, Professor
"This book offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity."
–Jake Buurma, Senior Vice President
Worldwide Research & Development, Cadence Design Systems, Inc.
"This collection of papers . . . is the most comprehensive syllabus of important results for researchers and designers on the topic. I highly recommend to read it and to pay attention to the messages given by the papers of the collection."
–Alberto Sangiovanni–Vincentelli, Professor
University of California Berkeley
"The editor has gathered together a collection of papers, both tutorial and advanced, that address a broad range of interconnect problems."
–Jacob White, Professor
Massachusetts Institute of Technology
Signal Integrity Effects in Custom IC and ASIC Designs compiles recent expert research papers in state–of–the–art IC (Integrated Circuits) design. It offers a detailed focus on all the major topics in understanding and modeling real–world IC signal integrity issues for CAD and IC design engineers, as well as graduate engineering students.
Practical, in–depth discussion of interconnect effects, inductance effects, power grid and distribution noise, and substrate noise and coupling is included. This specialized coverage provides the knowledge necessary to overcome serious problems in new, more complicated IC designs, such as:
∗ Wired and wireless communications ICs
∗ Large custom analog mixed–signal ICs
∗ ASIC designs from 0.12 microns and above
∗ Integrated custom IC blocks in ASIC (Applications–Specific Integrated Circuit) designs
From the Early Days of CMOS to Today.
Signal Integrity: A Problem for Design and CAD Engineers.
Signal Integrity Effects in Systme–on–Chip Designs – A Designer′s Perspective.
Part 1: Interconnect Crosstalk.
Harmony: Static Noise Analysis of Deep Submicron Digital Integrated Circuits.
FastCap: A Multipole Accelerated 3–D Capacitance Extraction Program.
Efficient Coupled Noise Estimation for On–Chip Interconnects.
Switching Window Computation for Static Timing Analysis in Presence of Crosstalk Noise.
Digital Sensitivity: Predicting Signal Interaction using Functional Analysis.
Crosstalk Reduction for VLSI.
Noise–aware Repeater Insertion and Wire Sizing For On–Chip Interconnect Hierarchical Moment–Matching.
Post Global Routing Crosstalk Synthesis.
Minimum Crosstalk Channel Routing.
Reducing Cross–Coupling among Interconnect Wires in Deep–Submicron Datapath Design.
A Postprocessing Algorithm for Crosstalk–driven Wire Perturbation.
Noise in Digital Dynamic CMOS Circuits.
Design of Dynamic Circuits with Enhanced Noise Tolerance.
Coupling–Driven Signal Encoding Scheme for Low–Power Interface Design.
High Frequency Simulation and Characterization of Advanced Copper Interconnects.
Static Noise Analysis for Digital Integrated Circuits in Partially–Depleted Silicon–On–Insulator Technology.
Synthesis of CMOS Domino Circuits for Charge Sharing Alleviation.
Part 2: Inductance Effects.
On–Chip Wiring Design Challenges for Gigahertz Operation.
IC Analyses Including Extracted Inductance Models.
FASTHENRY: A Multipole–Accelerated 3–D Inductance Extraction Program.
Full–Chip, Three–Dimensional, Shapes–Based RLC Extraction.
On–Chip Inductance Modeling and Analysis.
How to Efficiently Capture On–Chip Inductance Effects: Introducing a New Circuit Element K.
Figures of Merit to Characterize the Importance of On–Chip Inductance.
Layout–Techniques for Minimizing On–Chip Interconnect Self Inductance.
A Twisted–Bundle Layout Structure for Minimizing Inductive Coupling Noise.
Part 3: Power Grid and Distribution Noise.
Full–Chip Verification of UDSM Designs.
Power Supply Noise in Future IC′s: A Crystal Ball Reading.
A Floorplan–based Planning Methodology for Power and Clock Distribution in ASICs.
Power Supply Noise Analysis Methodology for Deep–Submicron VLSI Chip Design.
Analysis of Performance Impact Caused by Power Supply Noise in Deep Submicron Devices.
Full–Chip Signal Interconnect Analysis for Electromigration Reliability.
Power Dissipation Analysis and Optimization of Deep Submicron CMOS Digital Circuits.
Simulation and Optimization of the Power Distribution Network in VLSI Circuits.
Design Strategies and Decoupling Techniques for Reducing the Effects of Electrical Interference in Mixed–Mode IC′s.
Design and Analysis of Power Distribution Networks in Power PC Microprocessors.
Modeling the Power and Ground Effects of BGA Packages.
Effects of Power/Ground Via Distribution on the Power/Ground Performance of C4/BGA Packages.
Power Distribution Fidelity of Wirebond Compared to Flip Chip Devices in Grid Array Packages.
Forming Damped LRC Parasitic Circuits in Simultaneously Switched CMOS Output Buffers.
Part 4: Substrate Noise.
Experimental Results and Modeling Techniques for Substrate Noise in Mixed–Signal Integrated Circuits.
Principles of Substrate Crosstalk Generation in CMOS Circuits.
Experimental Comparison of Substrate Noise Coupling Using Different Wafer Types.
Modeling and Analysis of Substrate Coupling in Integrated Circuits.
Fast Methods for Extraction and Sparsification of Substrate Coupling.
SUBWAVE: A Methodology for Modeling Digital Substrate Noise Injection in Mixed–Signal ICs.
Substrate Modeling and Lumped Substrate Resistance Extraction for CMOS ESD/Latchup Circuit Simulation.
Analysis of Ground–Bounce Induced Substrate Noise Coupling in a Low Resistive Bulk Epitaxial Process: Design Strategies to Minimize Noise Effects on a Mixed–Signal Chip.
A Methodology for Measurement and Characterization of Substrate Noise in High Frequency Circuits.
Measurement of Digital Noise in Mixed–Signal Integrated Circuits.
Effects of Substrate Resistances on LNA Performance and a Bondpad Structure for Reducing the Effects in a Silicon Bipolar Technology.
A Study of Oscillator Jitter Due to Supply and Substrate Noise.
CMOS Technology Characterization for Analog and RF Design.
Noise Reduction Is Crucial to Mixed–Signal ASIC Design Success (Parts I & II).
About the Editor.