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Organic Thin Film Transistor Integration. A Hybrid Approach

  • ID: 2183516
  • Book
  • April 2011
  • Region: Global
  • 270 Pages
  • John Wiley and Sons Ltd
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Research on organic electronics (or plastic electronics) is driven by the need to create low–cost electronic devices that are lightweight, mechanically robust and structurally flexible. With the remarkable improvement in the performance of organic electronic materials during the past decade, organic electronics now appeal to innovative, practical, and broad–based applications requiring large–area coverage, lightweight and mechanical flexibility, which range from large–area and flexible displays to sensors, images, electronic identification and security tracking devices. This book presents a comprehensive investigation of the production and application of a variety of polymer based transistor devices and circuits. It begins with a detailed overview of Organic Thin Film Transistors (OTFTs) and discusses the various possible fabrication methods reported so far. This is followed by two major sections on the choice, optimization and implementation of the gate dielectric material. Details of the effects of processing on the efficiency of the contacts are then provided. The book concludes with a chapter on the integration of such devices to produce a variety of OTFT based circuits and systems.

From the contents:

  • Introduction
  • Organic Thin Film Transistors (OTFT): Overview
  • OTFT Integration Strategies
  • Gate Dielectric by Plasma Enhanced Chemical Vapor Deposition (PECVD)
  • Dielectric Interface Engineering
  • Contact Interface Engineering
  • OTFT Circuits and Systems
  • Outlook and Future Challenges
Note: Product cover images may vary from those shown
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1. Introduction

1.1 Organic Electronics: History and Market

2. Organic Thin Film Transistors (OTFT): Overview

2.1 Organic Semiconductor Overview

2.2 OTFT Operation and Characteristics

2.3 OTFT Device Architecture

2.4 OTFT Device Material Selection

2.5 Summary

3. OTFT Integration Strategies

3.1 Technological Challenge inOTFT Integration

3.2 Overview of Processing and Fabrication Techniques

3.3 OTFT Fabrication Schemes

3.4 Summary

4. Gate Dielectric by Plasma Enhanced Chemical Vapor Deposition (PECVD)

4.1 Overview of Gate Dielectrics

4.2 Experimental Details and Characterization Methods

4.3 Material Characterization of PECVD SiNx Films

4.4 Electrical Characterization of OTFTs with PECVD Gate Dielectrics

4.5 Summary

5. Dielectric Interface Engineering

5.1 Background

5.2 Experimental Details

5.3 Impact of Dieletric Surface Treatments

5.4 Impact of Oxygen Plasma Exposure Conditions

5.5 Summary

6. Contact Interface Engineering

6.1 Background

6.2 Experimental Details

6.3 Impact of Contact Surface Treatment by Thiol SAM

6.4 Impact of Execution Sequence of Surface Treatment

6.5 Summary

7. OTFT Circuits and Systems

7.1 OTFT Requirements for Circuit Applications

7.2 Applications

7.3 Circuit Demonstration

7.4 Summary, Contributions, and Outlook

8. Outlook and Future Challenges

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Flora Li
Arokia Nathan
Yiliang Wu
Beng S. Ong
Note: Product cover images may vary from those shown