This comprehensive exploration of structural dynamics offers versatile methodologies for predicting shocks and vibrations in micro– and opto–electronic systems. In–depth discussion from a mechanical engineer′s viewpoint helps demonstrate how to correctly interpret and evaluate data to support the development of robust structures able to withstand high–level dynamic loading particularly in portable devices.
Structural Dynamics of Electronic and Photonic Systems promotes the execution of safer electronic–based products by covering the basic concepts and fundamentals of dynamics and vibration analysis, including the analytical and experimental procedures currently providing the most effective means for reducing structural failure resulting from such issues as handling and delivery. Some of the highlights in this book include:
Comprehensive and practical coverage of the physics and mechanics of the dynamic response and structural failure of the typical micro– and opto–electronic structural elements, assemblies, packages, devices, and systems
A thorough introduction to the existing test techniques and test methods
Guidelines for rugged design against shock and vibration including random vibrations, nonlinear problems, and the existing military and commercial standards
Examination of typical failure modes and mechanisms in electronics and photonics structures experiencing dynamic loading
This all–inclusive reference serves as an essential introduction to the field as well as a forward–thinking treatise on its future direction. It familiarizes readers with a diverse range of reliability–related problems encountered in electronic and photonic systems, and offers solution techniques that will prove invaluable for anyone pursuing or upgrading a career in this exciting and rapidly developing area of engineering.
1 Some Major Structural Dynamics–Related Failure Modes and Mechanisms in Micro– and Opto–Electronic Systems and Dynamic Stability of These Systems (David S. Steinberg).
2 Linear Response to Shocks and Vibrations (Ephraim Suhir).
3 Linear and Nonlinear Vibrations Caused by Periodic Impulses (Ephraim Suhir).
4 Random Vibrations of Structural Elements in Electronic and Photonic Systems (Ephraim Suhir).
5 Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations (David S. Steinberg).
6 Drop/Impact of Typical Portable Electronic Devices: Experimentation and Modeling (T. X. Yu and C. Y. Zhou).
7 Shock Test Methods and Test Standards for Portable Electronic Devices (C. Y. Zhou, T. X. Yu, S. W. Ricky Lee, and Ephraim Suhir).
8 Dynamic Response of Solder Joint Interconnections to Vibration and Shock (David S. Steinberg).
9 Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment (David S. Steinberg).
10 Correlation between Package–Level High–Speed Solder Ball Shear/Pull and Board–Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy (Fubin Song, S. W. Ricky Lee, Keith Newman, Bob Sykes, and Stephen Clark).
11 Dynamic Mechanical Properties and Microstructural Studies of Lead–Free Solders in Electronic Packaging (V. B. C. Tan, K. C. Ong, C. T. Lim, and J. E. Field).
12 Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration (T. E. Wong).
13 Vibration Considerations for Sensitive Research and Production Facilities (E. E. Ungar, H. Amick, and J. A. Zapfe).
14 Applications of Finite Element Analysis: Attributes and Challenges (Metin Ozen).
15 Shock Simulation of Drop Test of Hard Disk Drives (D. W. Shu, B. J. Shi, and J. Luo).
16 Shock Protection of Portable Electronic Devices Using a Cushion of an Array of Wires (AOW) (Ephraim Suhir).
17 Board–Level Reliability of Lead–Free Solder under Mechanical Shock and Vibration Loads (Toni T. Matilla, Pekka Marjamaki, and Jorma Kivilahti).
18 Dynamic Response of PCB Structures to Shock Loading in Reliability Tests (Milena Vujosevic and Ephraim Suhir).
19 Linear Response of Single–Degree–of–Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions? (Ephraim Suhir).
20 Shock Isolation of Micromachined Device for High–g Applications (Sang–Hee Yoon, Jin–Eep Roh, and Ki Lyug Kim).
21 Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods (X. Q. Shi, G. Y. Li, and Q. J. Yang).
22 Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies (Reza Ghaffarian).
23 Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse? (Ephraim Suhir and Luciano Arruda).
DAVID S. STEINBERG is associated with the University of California, Los Angeles, Extension and also at the University of Wisconsin–Extension. He retired from Litton GCS (now Northrop Grumman) after serving as their director of engineering. He is the author of seven popular textbooks related to the design, analysis, testing, and evaluation of sophisticated electronic equipment for reliable operation in severe vibration, shock, thermal, thermal cycling, acoustic, and pyrotechnic shock environments. His most popular textbooks are Vibration Analysis for Electronic Equipment, Cooling Techniques for Electronic Equipment, and Preventing Thermal Cycling and Vibration Failures in Electronic Equipment, published by Wiley. Dr. Steinberg is currently the President of Steinberg & Associates and has presented seminars, workshops, and consulted for many of the major suppliers of electronics components and equipment such as General Electric, General Motors, Intel, Cisco, Texas Instruments, Microsoft, Harris, Honeywell, Raytheon, Westinghouse, and many others.
T. X. YU is Professor Emeritus of Mechanical Engineering at the Hong Kong University of Science and Technology (HKUST). After graduating from Peking University, he got his PhD and ScD from Cambridge University. After teaching at Peking University and UMIST, he joined HKUST in 1995. Before his retirement in July 2010, he was chair professor of mechanical engineering, associate vice–president (R&D), and dean of Fok Ying Tung Graduate School at HKUST. His research interests include impact dynamics, plasticity, energy absorption, textile and cellular materials, and nano–composites. He has published three textbooks, three scientific monographs, 310 journal papers, 170 international conference papers, and four patents. He serves as Associate Editor for the International Journal of Impact Engineering and International Journal of Mechanical Sciences. He is a Fellow of ASME, IMechE, and HKIE.