ST LSM330 6-axis MEMS Inertial Module 3D Accelerometer + 3D Gyroscope

  • ID: 2228905
  • Report
  • Region: Global
  • 140 Pages
  • System Plus Consulting
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System Plus Consulting is proud to publish the reverse costing report of the new 6-axis MEMS Inertial Module supplied by STMicroelectronics.

The LSM330D is a system-in-package featuring a 3axis accelerometer and a 3-axis gyroscope. With a 3x5.5x1mm size, it belongs to the smallest inertial modules for consumer applications. It is manufactured with the same ST THELMA process used for more than 1.5billon MEMS devices.

The LSM330D is targeted for consumer applications: GPS navigation systems, Impact recognition and logging, Gaming.

This report provides complete teardown of the MEMS IMU with:

- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
Note: Product cover images may vary from those shown
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Glossary

Overview/Introduction

- Executive Summary
- Reverse Costing Methodology

ST Company Profile

- Product Range
- Business Model

Physical analysis

- Physical Analysis Methodology
- Package Characteristics & Markings
- Package Opening
- Accelerometer & Gyroscope

ASIC – Dimensions
ASIC – Markings
ASIC – Delayering
ASIC – Cross-Section
MEMS – Dimensions
MEMS – Markings
MEMS – Bond Pads Opening
MEMS – Cap Opening
MEMS – Cap
MEMS – Sensing Area
MEMS – Cross-section

- ST 3-Axis Accelerometers MEMS Dies Comparison
- ST 3-Axis Gyroscopes MEMS Dies Comparison

Manufacturing Process Flow

- Overview
- ASIC/MEMS Process Flows
- Description of the Wafer Fabrication Units

Cost Analysis

- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Yields Explanation
- Yields Hypotheses
- ASICs Front-End Cost
- ASICs Back-End 0 Cost (Probe Test and Dicing)
- ASICs Dies Cost (Front End + Back End 0)
- MEMSs Front-End Cost
- MEMSs Front-End Cost per Process Steps
- MEMSs Front-End: Equipment Cost per Family
- MEMSs Front-End: Material Cost per Family
- Back-End 0: Probe Test and Dicing Cost
- Back-End 0: Dies Cost (Front End + Back End 0)
- Back-End 1: Packaging Cost
- Back-End 1: Final Test & Calibration Cost
- LSM330D Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

- Manufacturer Financial Ratios
- LSM330D Estimated Selling Price

Conclusion
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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