Design Analysis Ericsson W-CDMA/HSPA+ DUW 30 01 Digital Baseband Unit

  • ID: 2332301
  • Report
  • Region: Global
  • 50 Pages
  • EJL Wireless Research
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FEATURED COMPANIES

  • Bourns
  • Freescale Semiconductor
  • lattice Semiconductor
  • National Semiconductor
  • ON Semiconductor
  • Rakon
  • MORE
This report covers the design analysis of an Ericsson W-CDMA/HSPA+ baseband digital unit. This unit is part of the RBS610x/6201/6301/6601 base station platform for Ericsson W-CDMA. The unit was manufactured in Q2 2011.

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Bourns, Broadcom, Coilcraft, Epson-Toyocom, ETAL Fairchild Semiconductor, Freescale Semiconductor, Hynix, Infineon Technologies, Integrated Device Technology, Lantiq, lattice Semiconductor, LSI Logic, Maxim Integrated Products, Micron Technology, National Semiconductor, Nihon Denpa Kogyo, Nippon Chemi-Con, NXP Semiconductors, ON Semiconductor, PMC-Sierra, Panasonic, Pulse Engineering, Rakon, Sanyo Electric, Semtech, Spansion, STMicroelectronics, TDK-Epcos, Texas Instruments, Vishay Semiconductors & Xilinx.

Features:

- Complete Part Number/Marking
- Component Manufacturer Identification
- Function Component Description
- Package Type

Total Tables: 8

Total Exhibits: 39

Important Note: There is NO component pricing contained within the report.
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Bourns
  • Freescale Semiconductor
  • lattice Semiconductor
  • National Semiconductor
  • ON Semiconductor
  • Rakon
  • MORE
EXECUTIVE SUMMARY
Active/Passive Component Summary
Important Note

CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM
Overview of RBS6101/6102/6201/6202/6301/6601 Product Offering

CHAPTER 2: DUW MECHANICAL ANALYSIS
Mechanical Analysis

CHAPTER 3: BASEBAND PROCESSING BOARD SUBSYSTEM
Semiconductor Heat Sinks

CHAPTER 4: BOARD PROCESSOR AND RF/IF INTERFACE BOARD SUBSYSTEM
Semiconductor Heat Sinks

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

Table 1: DUW Baseband Processor PCB Top Bill of Materials
Table 2: DUW Baseband Processor PCB Bottom Bill of Materials
Table 3: DUW Board Processor and RF/IF Top Bill of Materials
Table 4: DUW Board Processor and RF/IF Bottom Bill of Materials
Table 5: Passive Component Case Size Distribution by System Subsection
Table 6: Identified Passive Component Supplier Distribution by System Subsection
Table 7: Active/Passive Component Distribution by System Subsection
Table 8: Active Semiconductor/Component Vendor Distribution by System Subsection

EXHIBITS

Exhibit 1: Ericsson RBS620x Macro Cell Indoor BTS System
Exhibit 2: Ericsson DUW System Block Diagram
Exhibit 3: DUW Unit, Front
Exhibit 4: DUW Unit, Back
Exhibit 5: DUW Unit, Side
Exhibit 6: DUW Unit, Top
Exhibit 7: DUW Unit, Bottom
Exhibit 8: DUW Frame, Top View
Exhibit 9: DUW Frame, Bottom View
Exhibit 10: DUW Frame, Rear View
Exhibit 11: DUW Top Shield, External View
Exhibit 12: DUW Top Shield, Internal View
Exhibit 13: DUW Bottom Shield, External View
Exhibit 14: DUW Bottom Shield, Internal View
Exhibit 15: DUW Bottom Shield, Rear View
Exhibit 16: DUW 30 System, Exploded Side View
Exhibit 17: DUW Processor PCB. Top View
Exhibit 18: DUW Baseband Processing PCB Component Diagram 1, Top View
Exhibit 19: DUW Baseband Processing PCB Component Diagram 2, Top View
Exhibit 20: DUW Baseband Processing PCB Component Diagram, Bottom View
Exhibit 21: DUW Baseband Processing Block Diagram
Exhibit 22: Semiconductor IC Heat Sink Dimensions (23mm, 27mm, 35mm)
Exhibit 23: Semiconductor IC Heat Sink Dimensions, 27mm
Exhibit 24: Semiconductor IC Heat Sink Dimensions, 35mm
Exhibit 25: DUW Board Processor and RF/IF PCB. Top View
Exhibit 26: DUW Board Processor and RF/IF PCB. Top View Component Diagram 1
Exhibit 27: DUW Board Processor and RF/IF PCB. Top View Component Diagram 1
Exhibit 28: DUW Board Processor and RF/IF Block Diagram
Exhibit 29: Baseband to RF/IF Connection
Exhibit 30: DUW Board Processor and RF/IF PCB. Bottom View Component Diagram
Exhibit 31: Semiconductor IC Heat Sink Dimensions (23mm, 27mm, 35mm)
Exhibit 32: Semiconductor IC Heat Sink Dimensions, 35mm
Exhibit 33: Semiconductor IC Heat Sink Dimensions, 41mm
Exhibit 34: Passive Component Case Size Distribution
Exhibit 35: Identified Passive Component Market Share by Vendor
Exhibit 36: Active Semiconductor Component Share
Exhibit 37: High Pin Count IC vs. Discretes
Exhibit 38: Active Semiconductor Market Share by Vendor
Exhibit 39: High Pin Count (64+) Active Semiconductor Market Share by Vendor
Note: Product cover images may vary from those shown
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- Bourns
- Broadcom
- Coilcraft
- Epson-Toyocom
- ETAL Fairchild Semiconductor
- Freescale Semiconductor
- Hynix
- Infineon Technologies
- Integrated Device Technology
- Lantiq
- lattice Semiconductor
- LSI Logic
- Maxim Integrated Products
- Micron Technology
- National Semiconductor
- Nihon Denpa Kogyo
- Nippon Chemi-Con
- NXP Semiconductors
- ON Semiconductor
- PMC-Sierra
- Panasonic
- Pulse Engineering
- Rakon
- Sanyo Electric
- Semtech
- Spansion
- STMicroelectronics
- TDK-Epcos
- Texas Instruments
- Vishay Semiconductors & Xilinx.
Note: Product cover images may vary from those shown
5 of 4
Note: Product cover images may vary from those shown
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