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Contract Manufacturing Opportunities in Printed Electronics - 2013

  • ID: 2388157
  • Report
  • 287 Pages
  • New Venture Research
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  • 3M
  • Creative Materials
  • FUJIFILM Holdings Corp.
  • Kovio
  • Si-Cal
  • MORE
The worldwide printed electronics (PE) market has been over-hyped and inaccurately forecast for over a decade. Yet PE still holds much potential and is now starting to show promise and commercialization. New Venture Research (NVR) has been following this emerging market for the last five years and the contract electronic manufacturing services market for more than 20 years. As a result of our extensive industry contacts and recent field interviews in PE, NVR is in a position to put a realistic stake in the ground with regard to the leading PE market applications and their potential for future growth.

This latest report - Contract Manufacturing Opportunities in Printed Electronics - 2013 Edition — is a comprehensive market analysis of emerging PE technologies and applications, and leverages our in-depth database of contract electronics manufacturing services (EMS) suppliers and markets built up over the past two decades. EMS suppliers are the best positioned to capitalize on the most promising PE opportunities, of which we have identified over 40 leading application areas. This report analyzes the highest potential products by end customer that stand to win out over traditional semiconductor and material technologies. This is because PE is creating a standalone market of its own as well as displacing some traditional semiconductor electronics. Certain market applications have clear economic and commercial advantages over the next five years (the only period that can be reasonably forecast).

Chapter 3 begins with a technical analysis of the most popular material technologies including organic and inorganic thin film transistors and other forms of printable circuits. The chapter moves on to discuss the various kinds of equipment that are used to print and layer these thin films, especially ink jet and screen printer technology which are used for the majority of PE applications today. A summary of the total equipment market by revenue is provided for 2012. The section concludes with an examination of substrates and the field of e-paper and related displays.

Chapter 4 explores and analyzes the PE market for conductive inks and thin films. Currently, the vast majority of conductive materials are composed of silver flake along with corresponding dielectrics for insulation. Other materials such as carbon/graphene, copper, gold, platinum, and carbon nanotube/silver/copper nanowire are explored. A table of all the worldwide conductive inks is summarized in terms of revenue for 2012 along with a table of conductive inks by industry segment.

Chapter 5 identifies and explores the leading product applications for PE products among ten industry segments and in context with the entire contract manufacturing market. Leading product applications are analyzed for both traditional electronics assembly and advanced PE manufacturing production.

Chapter 6 forecasts the future for PE products for 40 different product applications, contrasting the highest potential PE products against traditional semiconductor electronics. All PE product applications are summarized in the final chapter, including a ranking of the strongest markets in descending order of growth. The highest growth markets are projected to expand over 125% CAGR, while others are as low as only 5% CAGR, from 2012-2017. Overall, the market for PE products will triple over the next five years, reaching nearly $10 billion in assembly revenue value by 2017.

Chapter 7 analyzes the leading PE companies and suppliers in three ways – equipment manufacturers, advanced materials/thin film providers, and solution/integration companies that develop technical solutions or can successfully integrate one or more PE technologies. In all, 185 PE companies are profiled in this report and are organized according to category.
Note: Product cover images may vary from those shown
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  • 3M
  • Creative Materials
  • FUJIFILM Holdings Corp.
  • Kovio
  • Si-Cal
  • MORE
Chapter 1: Introduction
- Objectives
- Organization
- Methodology

Chapter 2: Executive Summary
- EMS Market and Forecast
- PE Industry Market Forecast
- PE Market Application Forecast

Chapter 3: PE Technology Analysis
- Organic and Thin Film Technology
- Organic Transistors
-- Polymer Electronics
- Inorganic Materials and Composites
- Inorganic Transistors
- Printable Electronics
- PE Manufacturing Equipment
-- Flexography
-- Gravure
-- Inkjet
-- Off-set Lithography
-- Screen printing
-- Substrates
-- E-Paper and Displays

Chapter 4: PE Materials Market, 2012
- Conductive Inks
- Conductive Films
- Microcapsules
- Organic/inorganic transistors, polymers, et al
- Nanoparticles

Chapter 5: PE Market Applications, 2012
- The Worldwide Contract Manufacturing Services
- Market
- Consumer Electronics
- Displays and Lighting
-- Technical Issues
-- Display Applications
-- Non-Emissive Displays
- Medical
- Packaging
-- Technical Issues
-- Packaging/Label Applications
- Photovoltaic's (PV)
-- Technical Issues
-- PV Market Applications
- Printed Circuit Boards (PCBs)
- Radio Frequency Identification (RFID)
-- Technical Issues
-- RFID Market Applications
- Textiles/Clothing
- Transportation
- Other
- PE Market Summary

Chapter 6: PE Market Forecasts
- Worldwide Contract Manufacturing Services Market, 2011-2016
- PE for Consumer Electronics, 2012-2017
- PE for Displays and Lighting, 2012-2017
- PE for Medical Products, 2012-2017
- PE for Packaging, 2012-2017
- PE for Photovoltaics, 2012-2017
- PE for PCBs, 2012-2017
- PE for RFID, 2012-2017
- PE for Textiles/Clothing, 2012-2017
- PE for Transportation, 2012-2017
- PE for Other General Applications, 2012-2017
- PE Market Forecast Summary, 2012-2017
- PE Leading Applications in Descending Order of Growth, 2012-2017

List of Figures
Figure 3-1 Throughput vs. Resolution for Different Printing Processes
Figure 3-2 - Flexographic Print Technology
Figure 3-3 - Gravure Print Technology
Figure 3-4 - Inkjet Print Technology
Figure 3-5 – Industrial Inkjet Printer Applications for Printed Electronics
Figure 3-6 – Offset Lithography Print Technology
Figure 3-7 – Screen Printing Technology
Figure 3-8 – Summary of PE Screen Printer Technology Applications, 2012
Figure 5-1 PE Manufacturing Supply Chain, 2012
Figure 5-2 Examples of PE Applications for Consumer Electronics, 2012
Figure 5-3 – Examples of Flexible Electrophoretic and OLED PE Displays, 2012
Figure 5-4 – Examples of Medical PE Sensor Applications, 2012
Figure 5-5 – Examples of PE Packaging Applications, 2012
Figure 5-6 – Examples of PE PV Applications, 2012
Figure 5-7 – Examples of PE for PCB Applications, 2012
Figure 5-8 – Examples of PE for RFID Applications, 2012
Figure 5-9 – Examples of PE for Textile/Clothing Applications, 2012
Figure 5-10 – Examples of PE for Transportation Applications, 2012
Figure 5-11 – Example of PE for Other Applications, 2012
Note: Product cover images may vary from those shown
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Equipment Companies

- Agfa-Gevaert
- Applied Materials
- Canon
- Conductive Inkjet Tech.
- Dainippon Screen Printing
- DEK Printing Machines
- Dialog Semiconductor
- FUJIFILM Dimatix
- Fuji Xerox Co.
- Goss International Americas
- Haiku Tech
- Hewlett Packard
- Hisense
- Johnson Laminating & Coat
- Kammann Machines
- Konica Minolta
- Landa Corporation
- MacDermid Printing
- MAN Roland
- Mark Andy, Inc.
- Merck Millipore
- Midori Mark Co., Ltd.
- MuTracx
- NovaCentrix
- Ohio Gravure Technologies
- PixDro BV
- Preco, Inc.
- Printcolor Screen Ltd.
- Printechnologics
- Roth & Rau
- Schreiner PrinTronics
- Seiko Epson
- SiPix Imaging, Inc.
- SonoPlot
- Speedline Technologies
- ST Microelectronics
- Sung An Machinery
- Taiyo Ink Mfg. Co., Ltd.
- Thieme GmbH & Co.
- Tokyo Electron, Ltd.
- Toppan Printing Co.
- UniJet
- Universal Display Corporation
- Veeco Instruments
- Xaar
- Xerox Corporation

Materials Companies

- 3M
- Advanced Nano Products
- Agfa-Orgacon
- Applied Nanotech
- Asahi Glass Co.
- Asahi Kasei
- Beneq
- Blue Nano
- Cabot
- Cambrios
- Carestream Advanced
- Materials
- Cima Nanotech
- Corning
- Creative Materials
- Dai Nippon Printing
- DayStar Technologies
- Delta Optoelectronics
- Dow Chemical
- DuPont Microcircuit Mat.
- Eastman Kodak
- Electric Vinyl, Inc.
- Electronic Paper and Tech.
- elumin8
- Ercon
- Ferro Corp.
- FUJIFILM Holdings Corp.
- Fujikura
- Gwent Group
- H. C. Starck
- Heliatek GmbH
- Henkel
- Heraeus
- Hitachi Chemical
- Indium Corporation
- Infineon Technologies
- Inktec
- Int’l Solar Elect. Tech.
- Intrinsiq Materials
- Kimoto
- Konarka Technologies
- Kovio
- LG Philips LCD Co., Ltd.
- Liquid X Printed Metals
- Litrex
- Luminous Media, Ltd.
- MEMC Electronic Materials
- Microvision, Inc.
- Mirwec Films
- Nanogap
- NanoInk, Inc.
- NanoMas Technology
- Nissan Chemical Ind.
- Novaled AG
- Novalia
- Optomec
- OrganicID
- Ormecon GmbH
- Plextronics
- PolyIC GmbH & Co. KG
- Poly-Ink
- Samsung Electronics
- Soligie
- SouthWest
- NanoTechnologies
- Sumitomo Chemical
- Sun Chemical
- Toshiba Mobile Display
- ToyoChem
- Unidym, Inc.
- Victrex Polymer
- Vorbeck Materials

Solution/Integration Companies

- Add-Vision
- Ascend Solar
- Aveso
- Blue Spark
- Bosch Solar
- Calyxo
- Cambridge Display
- Canadian Solar
- China Sunenergy
- Cymbet
- Durel
- E Ink
- eMagin
- Energy Conversion Devices
- Enfucell
- EV Group
- Evonik
- Excellatron
- First Solar
- Flexcell
- Front Edge
- Frontier Industrial Technology
- Fuji Electric
- G24 Innovations
- Global Solar Energy
- GSI Technologies
- Imprint Energy
- Infinite Power Solutions
- Innovalight
- Kaneka
- KSW Microtec
- Liquavista
- Memtron Input Components
- Nanosolar
- NRG Solar
- Ormet Circuits, Inc.
- Parelec
- PChem
- Plastic Logic
- Power Paper, Ltd.
- PragmatIC Printing
- ReneSola, Ltd.
- Semprius
- Sensormatic
- Sharp Corporation
- Si-Cal
- Solarmer
- Solar Frontier
- Solexant
- Solicore
- Sontor GmbH
- Sumation Co., Ltd.
- T-Ink, Inc.
- Terepac
- Thin Film Electronics
Note: Product cover images may vary from those shown
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The publisher's forecasts are developed using a four-step approach. First, expectations of world economic growth are set based upon historical data and forecasts obtained from published International Monetary Fund (IMF) reports.

Next, a top-down forecast of electronics industry growth is built. This analysis is based primarily on historical data obtained from the Semiconductor Industry Association (SIA) and World Semiconductor Trade Statistics (WSTS). Because semiconductor content is at the core of electronics products, semiconductor data is a good triangulation point for total assembly value. This data is augmented with information on passive content and estimates of labor and overhead.

Then, a bottom-up forecast is developed for each of the products in each segment. This is accomplished by first creating a unit forecast for each product based on historical data and various industry-leader opinions regarding future growth prospects for each product. A model of the assembly value of each product is then built using teardown analyses and price-based models. The unit volume times the assembly value per unit equals the total assembly value for each product - often referred to as the cost of goods sold (COGS).

Finally, the first three steps are reiterated to achieve a coherent forecast. The forecasts developed by this process are presented in all their industry reports.