Design Analysis Ericsson LTE DUL 20 01 Digital Baseband Unit

  • ID: 2529802
  • Report
  • Region: Global
  • 38 Pages
  • EJL Wireless Research
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FEATURED COMPANIES

  • Analog Devices
  • ETAL Group
  • Infineon Technologies
  • Maxim Integrated Products
  • Nihon Denpa Kogyo
  • Panasonic
  • MORE
This report covers the design analysis of an Ericsson LTE baseband digital unit. This unit is part of the RBS610x/6201/6301/6601 base station platform for Ericsson LTE. The unit was manufactured in Q1 2012.

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Broadcom, Ericsson, ETAL Group, Fairchild Semiconductor, Freescale Semiconductor, Infineon Technologies, Integrated Device Technology, Kemet, Lattice Semiconductor, Maxim Integrated Products, Micron Technology, Nichicon, Nihon Denpa Kogyo, NXP Semiconductors, ON Semiconductor, Panasonic, Pulse Engineering, Rakon, Sanyo Electric, STMicroelectronics, TDK-Epcos, Texas Instruments, Vishay Semiconductors.

Features:

- Complete Part Number/Marking
- Component Manufacturer Identification
- Function Component Description
- Package Type
- Total Tables: 7
- Total Exhibits: 41

Important Note: There is NO component pricing contained within the report.
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Analog Devices
  • ETAL Group
  • Infineon Technologies
  • Maxim Integrated Products
  • Nihon Denpa Kogyo
  • Panasonic
  • MORE
EXECUTIVE SUMMARY
Active/Passive Component Summary
Important Note:

CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM
Overview of RBS6101/6102/6201/6202/6301/6601 Product Offering

CHAPTER 2: DUL MECHANICAL ANALYSIS
Mechanical Analysis

CHAPTER 3: BASEBAND PROCESSING/CPRI/INTERFACE BOARD SUBSYSTEM
Semiconductor Heat Sinks

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

Table 1: DUL PCB Top Area A1 Bill of Materials
Table 2: DUL PCB Top Area A2 Bill of Materials
Table 3: DUL PCB Bottom Area B Bill of Materials
Table 4: Passive Component Case Size Distribution by System Subsection
Table 5: Identified Passive Component Supplier Distribution by System Subsection
Table 6: Active/Passive Component Distribution by System Subsection
Table 7: Active Semiconductor/Component Vendor Distribution by System Subsection

EXHIBITS

Exhibit 1: Ericsson RBS620x Macro Cell Indoor BTS System
Exhibit 2: Ericsson DUL System Block Diagram
Exhibit 3: DUL Unit, Front
Exhibit 4: DUL Unit, Back
Exhibit 5: DUL Unit, Left Side
Exhibit 6: DUL Unit, Top
Exhibit 7: DUL Unit, Bottom
Exhibit 8: DUL Top Shield, External View
Exhibit 9: DUL Top Shield, Internal View
Exhibit 10: DUL Bottom Shield, External View
Exhibit 11: DUL Bottom Shield, Internal View
Exhibit 12: DUL Bottom Shield, Front View
Exhibit 13: DUL Bottom Shield, Rear View
Exhibit 14: DUL 20 01 System, Exploded Side View
Exhibit 15: DUL PCB. Top View
Exhibit 16: DUL Baseband Processing/CPRI/Interface PCB Top, Area A
Exhibit 17: DUL Baseband Processing PCB Bottom, Area B
Exhibit 18: DUL PCB Top Area A1 Component Diagram
Exhibit 19: DUL PCB Top Area A2 Component Diagram
Exhibit 20: DUL Baseband Processing/CPRI/Interface Block Diagram
Exhibit 21: DUL PCB Bottom Area B Component Diagram
Exhibit 22: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Front View
Exhibit 23: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Side View
Exhibit 24: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Bottom View
Exhibit 25: Semiconductor IC Heat Sink Dimensions, 27mm
Exhibit 26: Semiconductor IC Heat Sink Dimensions, 35mm
Exhibit 27: Semiconductor IC Heat Sink Dimensions, 41mm
Exhibit 28: Passive Component Case Size Distribution
Exhibit 29: Identified Passive Component Market Share by Vendor
Exhibit 30: Active Semiconductor Component Share
Exhibit 31: High Pin Count IC vs. Discretes
Exhibit 32: Active Semiconductor Market Share by Vendor
Exhibit 33: High Pin Count (64+) Active Semiconductor Market Share by Vendor
Note: Product cover images may vary from those shown
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- Analog Devices
- Broadcom
- Ericsson
- ETAL Group
- Fairchild Semiconductor
- Freescale Semiconductor
- Infineon Technologies
- Integrated Device Technology
- Kemet
- Lattice Semiconductor
- Maxim Integrated Products
- Micron Technology
- Nichicon
- Nihon Denpa Kogyo
- NXP Semiconductors
- ON Semiconductor
- Panasonic
- Pulse Engineering
- Rakon
- Sanyo Electric
- STMicroelectronics
- TDK-Epcos
- Texas Instruments
- Vishay Semiconductors.
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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