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Sensirion SHTC1 Humidity and Temperature Sensor - Reverse Costing Analysis

  • ID: 2599773
  • Report
  • Region: Global
  • 91 Pages
  • System Plus Consulting
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A Humidity And Temperature Sensor Made From A Tiny Die Using Sensirion'S Cmosens® Process.
This Sensor Is Targeting Portable Devices And Can Be Found In The Samsung Galaxy S4 Smartphone.

Humidity and temperature sensors are equipping more and more portable devices. These components sense the humidity and the temperature of the atmosphere. New specific Android APIs have been developed to use this sensor for mobile weather station, sports, cosmetic – sense humidity of skin, etc.

Sensirion SHTC1 humidity and temperature-sensing device is manufactured using a proprietary MEMS technology, called “CMOSens®”, which allows the sensor and the signal processing circuitry on a single integrated circuit without perturbation for a high accuracy.

The sensing element in the SHTC1 is a capacitor with an organic dielectric. The organic dielectric absorbs or desorbs the humidity thereby modifying the electrical permittivity of the dielectric.

The new technology allow a shrink of 3 of the die surface and of the sensor surface, for only a loss of 0.5% accuracy The sensor is packaged in a 2x2x0.8mm QFN.

This report provides a complete teardown of the MEMS gyro with:

- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth manufacturing cost analysis
- Supply chain evaluation
- Selling price estimation
Note: Product cover images may vary from those shown
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1. Overview / Introduction
– Executive Summary
– Reverse Costing Methodology

2. Company Profile

3. Physical Analysis
– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– Samsung Galaxy S4
– Package Characteristics & Markings
– Package Opening & Bonding Number
– Protective Layer
– Capacitive Layer
– ASIC Dimensions
– ASIC Minimal Dimension and Metal Layers
– ASIC Transistor Details
– Capacitive Sensor
– Heater
– Capacitive Fingers

4. Manufacturing Process Flow
– Overview
– ASIC Process Flow
– Humidity & Temperature Sensor Process Flow
– Package Process Flow
– Description of the Wafer Fabrication Units

5. Cost Analysis
– Synthesis of the Cost Analysis
– Main Steps of Economic Analysis
– Supply Chain Analysis
– Yields Explanation
– ASIC Wafer Cost Hypothesis
– ASIC Wafer Cost
– Humidity & Temp. Sensor Wafer Cost Hypothesis
– Humidity & Temp. Sensor Wafer Cost
– Humidity & Temp Sensor Wafer : Equipment Cost per Family
– Humidity & Temperature Sensor Wafer : Material Cost per Family
– Humidity & Temp Sensor Probe Cost
– Humidity & Temp Sensor Dicing Cost
– Humidity & Temp Sensor Die cost
– SHTC1 Packaging Cost Hypothesis
– SHTC1 Packaging Process Flow
– SHTC1 Packaging Cost Details
– SHTC1 Final Test Cost
– SHTC1 Component Manufacturing Cost
– Yield Synthesis
– SHTC1 Cost Analysis Evolution

6. Estimated Manufacturer Price Analysis
– Manufacturers ratios
– Estimated manufacturer Price

Note: Product cover images may vary from those shown
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