IC Package Pitch, Leadframe Plating, And Substrate Markets - 2013 Edition

  • ID: 2685382
  • Report
  • 200 Pages
  • New Venture Research
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Integrated circuits (ICs) are placed in a package, which gives the semiconductor die the mechanical and electrical interface to the printed circuit board (PCB). Once packaged, the IC transforms from a 'die' into a 'chip'.

This 'IC Package Pitch, Leadframe Plating, And Substrate Markets' report, provides information which will help determine the size of a package, the test socket size, and the footprint of the device on a PCB, as well as provide information on material choices for leadframes, which affects the test companies, printed circuit board manufacturers, and others who delve into the interfaces with the package leadframe.

Scope of the Report

- Package Pitch

One of the functions of an IC package is to provide the mechanical connection to the printed circuit board (PCB). Whether the connection is a lead, ball, land pad, or pin, each of these elements will be spaced at a certain distance to the next interconnection to the board. The distance between the center of one lead or ball to the next is referred to as the pitch.

Chapter 4 of this report covers the package pitch of all the IC package families available, including DIP, SOT, SO, TSOP, DFN, CC, QFP, QFN, PGA, BGA, FBGA, and WLP, by I/O count ranges of 3-18, 20-32, 34-100, 102-304, 308-999, and 1,000 and up.

- Leadframe Plating Options

The leadframe is the skeleton of the IC package, providing the electrical and mechanical connection from the die to the PCB. Most leadframes are made out of copper, and it, and all materials used to create leadframes, do not solder to a PCB, so the leadframes must be plated with some type of solderable material to make the leadframe adhere to the PCB in a reflow oven. This material also protects the leadframe from oxidation, corrosion, and abrasion. Leadframes fall intoeither preplate or postplate options.

Preplate leadframes are plated well before die attach and assembly, by the leadframe manufacturer. Postplate leadframes are plated after die attach, interconnection, and overmolding, as part of the package assembly operations.

Chapter 5 covers the leadframe plating options, and issues associated with these choices.

- IC Package Substrates

Packages such as PGAs, BGAs, LGAs, and FBGAs all attach to a substrate, also known as an interposer. The substrate replaces the leadframe as the interposer between the die and the PCB. The substrate can be made from a variety of materials, including BT (bismaleimide triazine) resin, FR-4, FR-5, ceramic, and polyimide flex tape. The substrate generally has balls or pins on the underside that attach it to the PCB. The package is considered an LGA, or land grid array, if the substrate is placed on the PCB directly, without balls or pins.

Chapter 6 contains forecasts of the various substrate options by Package Family, Substrate Units, Substrate Area, and Substrate Revenue, from 2012-2017.

This analysis is an effective and economical tool for any company associated in the semiconductor industry to aid in assessing their own markets and potential areas of growth.
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Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: State of the Industry

- Economic Overview
- Industry Overview

Chapter 4: Forecasts by IC Package Pitch, by Package Family and by I/O count, 2012 - 2017

Package Type
- DIP
- SOT
- SO
- TSOP
- FN
- CC
- QFP
- QFN
- PGA
- BGA
- FBGA
- WLP

Chapter 5: IC Package Leadframe and Lead-free Issues

- Preplate
- Post plate
- Lead-free Issues: Tin Whiskers
- New Product Introductions
-- Lockheed Martin Space Systems Company
- Forecasts of the various plating options including Matte Tin, Tin Silver, Tin Copper, Tin Bismuth, Nickel Palladium, and Nickel Palladium Gold

Chapter 6: IC Package Substrates

- Ceramic
- Laminate
- HDIS
- Coreless
- Flex Tape
- Embedded
- Thermal Substrates
- Forecasts by Pitch, Units, Area, and Revenue
- New Product Introductions
-- Fujitsu Components America, Inc.
-- Intel Corporation
-- Shinko Electric Industries Co., Ltd.
-- Siliconware Precision Industries Co., Ltd.

Substrates are forecast by material type by package, and standardized for forecasting substrate area. The substrate revenue is also provided.

Appendix A: Web Address Guide
Appendix B: Glossary of Terms

List of Tables

Table 4-1 DIP 003-018 I/O Pitch Forecast Table 4-2 DIP 020-032 I/O Pitch Forecast Table 4-3 DIP 034-100 I/O Pitch Forecast Table 4-4 Total DIP Pitch Forecast
Table 4-5 SOT Pitch Forecast
Table 4-6 SO 004-018 I/O Pitch Forecast Table 4-7 SO 020-032 I/O Pitch Forecast Table 4-8 SO 034-100 I/O Pitch Forecast Table 4-9 Total SO Pitch Forecast
Table 4-10 TSOP 004-018 I/O Pitch Forecast Table 4-11 TSOP 020-032 I/O Pitch Forecast Table 4-12 TSOP 034-100 I/O Pitch Forecast Table 4-13 Total TSOP Pitch Forecast
Table 4-14 DFN 004-018 I/O Pitch Forecast Table 4-15 DFN 020-032 I/O Pitch Forecast Table 4-16 Total DFN Pitch Forecast
Table 4-17 CC 020-032 I/O Pitch Forecast Table 4-18 CC 034-100 I/O Pitch Forecast Table 4-19 Total CC Pitch Forecast
Table 4-20 QFP 032-100 I/O Pitch Forecast Table 4-21 QFP 104-304 I/O Pitch Forecast Table 4-22 Total QFP Pitch Forecast
Table 4-23 QFN 004-018 I/O Pitch Forecast Table 4-24 QFN 020-032 I/O Pitch Forecast Table 4-25 QFN 034-100 I/O Pitch Forecast Table 4-26 QFN 104-304 I/O Pitch Forecast Table 4-27 Total QFN Pitch Forecast
Table 4-28 PGA 104-304 I/O Pitch Forecasts Table 4-29 PGA 308-999 I/O Pitch Forecast Table 4-30 Total PGA Pitch Forecast
Table 4-31 BGA 034-100 I/O Pitch Forecast Table 4-32 BGA 1040304 I/O Pitch Forecast Table 4-33 BGA 308-999 I/O Pitch Forecast Table 4-34 BGA 1,000+ I/O Pitch Forecast Table 4-35 Total BGA Pitch Forecast
Table 4-36 FBGA 004-018 I/O Pitch Forecast Table 4-37 FBGA 020-032 I/O Pitch Forecast Table 4-38 FBGA 034-100 I/O Pitch Forecast Table 4-39 FBGA 104-304 I/O Pitch Forecast Table 4-40 FBGA 308-999 I/O Pitch Forecast Table 4-41 FBGA 1,000+ I/O Pitch Forecast Table 4-42 Total FBGA Pitch Forecast
Table 4-43 WLP 004-018 I/O Pitch Forecast Table 4-44 WLP 020-032 I/O Pitch Forecast Table 4-45 WLP 034-100 I/O Pitch Forecast Table 4-46 WLP 104-304 I/O Pitch Forecast Table 4-47 Total WLP Pitch Forecast
Table 4-48 Total IC Package Pitch Forecast
Table 5-1 DIP Plating Forecast Table 5-1 DIP Plating Forecast Table 5-2 SOT Plating Forecast Table 5-3 SO Plating Forecast Table 5-4 TSOP Plating Forecast Table 5-5 DFN Plating Forecast Table 5-6 CC Plating Forecast Table 5-7 QFP Plating Forecast Table 5-8 QFN Plating Forecast
Table 5-9 Total IC Leadframe Plating Forecast
Table 6-1 PGA Units by I/O Pitch, 2012—2017
Table 6-2 BGA Pitch, 2012—2017
Table 6-3 FBGA Pitch, 2012—2017
Table 6-4 PGA Substrates, 2012—2017
Table 6-5 BGA Substrates, 2012—2017
Table 6-6 FBGA Substrates, 2012—2017
Table 6-7 Substrate Unit Summary, 2012—2017
Table 6-8 Average Substrate Area by Package Type, 2012–2017
Table 6-9 Substrate Area by Package Type, 2012–2017
Table 6-10 Substrate Area Summary, 2012–2017
Table 6-11 Average Substrate Price, 2012–2017
Table 6-12 Substrate Revenue by Package Type, 2012–2017
Table 6-13 Substrate Revenue Summary, 2012–2017

List of Figures

Figure 4-1 DIP 003-018 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-2 DIP 020-032 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-3 DIP 034-100 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-4 Total DIP Pitch Forecast, 2012 vs. 2017
Figure 4-5 SOT Pitch Forecast, 2012 vs. 2017
Figure 4-6 SO 004-018 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-7 SO 020-032 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-8 SO 034-100 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-9 Total SO Pitch Forecast, 2012 vs. 2017
Figure 4-10 TSOP 004-018 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-11 TSOP 020-032 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-14 TSOP 034-100 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-13 Total TSOP Pitch Forecast, 2012 vs. 2017
Figure 4-14 DFN 004-018 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-15 DFN 020-032 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-16 Total DFN Pitch Forecast, 2012 vs. 2017
Figure 4-17 CC 020-032 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-18 CC 034-100 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-19 Total CC Pitch Forecast, 2012 vs. 2017
Figure 4-20 QFP 032-100 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-21 QFP 104-304 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-22 Total QFP Pitch Forecast, 2012 vs. 2017
Figure 4-23 QFN 004-018 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-22 QFN 020-032 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-25 QFN 034-100 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-26 QFN 104-304 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-27 Total QFN Pitch Forecast, 2012 vs. 2017
Figure 4-28 PGA 104-304 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-29 PGA 308-999 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-30 Total PGA Pitch Forecast, 2012 vs. 2017
Figure 4-31 BGA 034-100 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-32 BGA 104-304 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-33 BGA 308-999 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-34 BGA 1,000+ I/O Pitch Forecast, 2012 vs. 2017
Figure 4-35 Total BGA Pitch Forecast, 2012 vs. 2017
Figure 4-36 FBGA 004-018 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-38 FBGA 034-100 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-39 FBGA 104-304 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-40 FBGA 308-999 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-41 FBGA 1,000+ I/O Pitch Forecast, 2012 vs. 2017
Figure 4-42 Total FBGA Pitch Forecast, 2012 vs. 2017
Figure 4-43 WLP 004-018 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-44 WLP 020-032 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-43 WLP 034-100 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-46 WLP 104-304 I/O Pitch Forecast, 2012 vs. 2017
Figure 4-47 Total WLP Pitch Forecast, 2012 vs. 2017
Figure 4-48 Total IC Package Pitch Forecast, 2012 vs. 2017
Figure 4-37 FBGA 020-032 I/O Pitch Forecast, 2012 vs. 2017
Figure 5-1 Whisker Grain in Bright Tin on Copper Figure 5-2 Schematic—Whisker Grain Morphology Figure 5-3 Kirkendall Effect for Sn/Cu Couple
Figure 5-4 Kirkendall Stress Effect for Sn/Cu Couple
Figure 5-5 Compressive Stress Model
Figure 5-7 DIP Plating, 2012—2017
Figure 5-8 SOT Plating, 2012—2017
Figure 5-9 SO Plating, 2012—2017
Figure 5-10 TSOP Plating, 2012—2017
Figure 5-11 DFN Plating, 2012—2017
Figure 5-12 CC Plating, 2012—2017
Figure 5-13 QFP Plating, 2012—2017
Figure 5-14 QFN Plating, 2012—2017
Figure 5-15 Total IC Leadframe Plating, 2012—2017
Figure 6-1 Cored vs. Coreless Substrate
Figure 6-2 Pre-Molded Leadframe Process Flow
Figure 6-3 Wire bond type rLBGA Package Structure
Figure 6-4 Flip Chip type rLBGA Package Structure
Figure 6-5 Routable Lead-frame Top view
Figure 6-6 PGA Substrates, 2012 vs. 2017
Figure 6-7 BGA Substrates, 2012 vs. 2017
Figure 6-8 FBGA Substrates, 2012 vs. 2017
Figure 6-9 Substrate Unit Summary, 2012 vs. 2017
Figure 6-10 Substrate Area Summary, 2012 vs. 2017
Figure 6-11 Substrate Revenue Summary, 2012 vs. 2017
Note: Product cover images may vary from those shown
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- Fujitsu Components America, Inc.
- Intel Corporation
- Shinko Electric Industries Co., Ltd.
- Siliconware Precision Industries Co., Ltd.
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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