+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)


Bosch Sensortec BMG160 3-Axis MEMS Gyroscope Reverse Costing Analysis

  • ID: 2686135
  • Report
  • Region: Global
  • 100 Pages
  • System Plus Consulting
1 of 2
The first MEMS gyroscope of Bosch for Consumer Applications Employing a New Wafer Bonding Process

More than 10 years after the release of its MEMS gyroscopes for automotive, Bosch Sensortec release its first 3-Axis gyroscope for consumer applications.
In a market largely dominated by STMicroelectronics and InvenSense, Bosch Sensortec was the first to release a 3-axis MEMS gyroscope in a 3x3mm² package in order to gain market shares. Although the manufacturing process (Epi-poly surface micromachining) is similar to the one of automotive gyro, new processes for the capping and the wafer bonding has been adopted. Indeed, the classic "glass-frit" wafer bonding has been abandoned in favor of an eutectic bonding.

This report provides a complete teardown of the MEMS gyro with:

- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth manufacturing cost analysis
- Selling price estimation
Note: Product cover images may vary from those shown
2 of 2


Bosch Company Profile

Physical Analysis

- Physical Analysis Methodology
- Package
-- Package Characteristics & Markings
-- Package Opening
-- Wire bonding process
-- Package Cross-Section
-- ASIC Dimensions & Markings
-- ASIC Delayering
-- ASIC Cross-Section
-- ASIC Process Characteristics
-- MEMS Dimensions & Markings
-- MEMS bonding pads
-- MEMS Cap Opening
-- MEMS Cap
-- MEMS Sensing Area
-- MEMS Cross-section

Manufacturing Process Flow

- ASIC Process Flow
- Description of the ASIC Wafer Fabrication Unit
- MEMS Sensor Process Flow
- MEMS Cap Process Flow
- MEMS Wafer Bonding Process Flow
- Description of the MEMS Wafer Fabrication Unit
- Packaging Process Flow

Cost Analysis

- Main Steps of Economic Analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test, Thinning & Dicing
- ASIC Die Cost
- MEMS Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End : Equipment Cost per Family
- MEMS Front-End : Material Cost per Family
- MEMS Back-End 0 : Probe Test & Dicing
- MEMS Die Cost (Front End + Back End 0)
- Back-End : Packaging Cost
- Back-End : Final test & Calibration Cost
- Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis
Note: Product cover images may vary from those shown
3 of 2