Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies

  • ID: 2691711
  • Report
  • Region: Global
  • 262 Pages
  • The Information Network
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In this report we identify and forecast areas of semiconductor-related technologies where a small or mid-sized company can compete. These high-tech applications segmented as those are fabricated on 300mm wafers and those built on non-300mm wafers.

The small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience.

Note: Product cover images may vary from those shown
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Chapter 1 Introduction

Chapter 2 Niche Markets for PROCESSES for 300mm Wafers

2.1 Introduction
2.2 Wafer Level Processing (WLP)
2.2.1 Introduction
2.2.2 Flip Chip/WLP Processing Issues and Trends
- Wafer Bumping
- Wafer Level Packaging
- Pad Redistribution
- Wafer Bumping Costs
2.2.3 Lithography Issues And Trends
2.2.4 UBM Etch Issues And Trends
2.2.5 Metallization Issues and Trends
- Gold Bumping Metallization
- Solder Bumping Metallization
2.2.6 Analysis of WLP Market
2.3 3-D TSV
2.3.1 Insight Into Critical Issues
2.3.2 Cost Structure
2.3.3 Critical Processing Technologies
2.3.4 Evaluation Of Critical Development Segments
2.3.5 TSV Device Forecast
2.4 Non-volatile Memory Devices MRAM, RRAM and FeRAM
2.4.1 Processing Requirements for MRAMs
2.4.2 Processing Requirements for RRAMs
2.4.3 Processing Requirements for FeRAMs
2.4.4 Roadmap for Commercialization
2.5 Ultrathin Wafers
2.5.1 Applications for Ultrathin Wafers
2.5.2 Substrate Thinning
2.5.3 Backside Metallization Requirements
2.5.4 Surface Stress Relief
2.5.5 Ultrathin Wafer Market

Chapter 3 Niche Markets for EQUIPMENT for SUB 300mm Wafers

3.1 Introduction
3.2 MEMs
3.2.1 The MEMS Market Infrastructure
3.2.2 Forecast Of The Key Applications And Markets
- MEMS Device Market Forecast
- MEMS System Market Forecast
3.2.3 Markets for Equipment and Materials Suppliers
3.3 HB-LEDs
3.3.1 Recent Progress in High Brightness LED Technology and Applications
3.3.2 Processing Equipment
3.3.3 Materials of Construction
3.3.4 OLED Manufacturing
3.3.5 Outlook for the Worldwide OLED Market
3.3.6 Outlook for the Worldwide HB-LED Market
3.4 Compound Semiconductors
3.4.1 GaAs Devices
3.4.2 Equipment Trends
3.4.3 Wafer Sizes
3.4.4 GaAs IC Market Forecast
3.4.5 Competing Against SiGe
3.5 Thin Film Read/Write Heads for HDD
3.5.1 Trends in HDDs
3.5.2 Recording Head Market Forecast
3.5.3 Head Processing
3.5.4 Head Fabrication - CMP, Deposition, Lithography
3.5.5 CMP Challenges
3.5.6 Lithography Challenges
3.6 Bulk Acoustic Wave (BAW)
3.6.1 Basic Elements of the BAW Device
3.6.2 AlN Layer Quality Requirements
3.6.3 Equipment Requirements for BAW and FBAR Filtering Devices
3.6.4 Bulk Acoustic Wave (BAW) Market

List of Tables:
2.1 Common UBM Stacks For Solder And Gold Bumping
2.2 Solder Bumping Guidelines
2.3 ITRS Pin Counts For Different Applications
2.4 Pillar-WLP CSP Guidelines
2.5 Pad Redistribution Guidelines
2.6 UBM Film Etchants
2.7 Common UBM Stacks For Gold And Solder Bumping
2.8 WLP Demand By Device (Units)
2.9 WLP Demand By Device (Wafers)
2.10 Forecast Of TSV Devices By Wafers
3.1 MEMS Device Markets
3.2 MEMS System Markets
3.3 MEMS Equipment Markets
3.4 Color, Wavelength Material Of LED
3.5 Comparison of LED, HB-LED, UHB-LED Characteristics
3.6 Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap
3.7 Process Control Metrics
3.8 Production Method for Various LEDs
3.9 GaAs IC Market Forecast
3.10 Comparison Of Piezoelectric Materials For BAW Applications

List of Figures:
2.1 Solder Bumping Process
2.2 Pillar-WLPCSP Process
2.3 Pad Redistribution Process
2.4 Via First (iTSV) Cost Of Ownership
2.5 Via First (iTSV) Cost Of Ownership Front And Back Side
2.6 Via First (iTSV) Process Flow
2.7 iTSV Versus pTSV Cost Of Ownership
2.8 Effect Of TSV Depth And Diameter On Cost
2.9 Illustration Of Bosch Process
2.10 Process And Equipment Flow For EMC3D Consortium Members
2.11Various TSV Integration Schemes
2.12 Forecast OF TSV Devices By Wafers
3.1 Operation of LED
3.2 Market drivers for LED Biz and Applications
3.3 SSL vs. Classical Technologies
3.4 LED Performance vs. Traditional Light Sources
3.5 Pareto Analysis Of SSL Manufacturing Costs
3.6 Nanoimprint Lithography System
3.7 Regular LED (white) Front-End Steps
3.8 Schematic of AMOLED
3.9 Active Matrix OLED Capacity and Demand Forecast
3.10 LED Market by Sector
3.11 Worldwide LED Market Forecast
3.12 Schematic of GaAs MESFET
3.13 Schematic of GaAs HEMT Device
3.14 Schematic of GaAs HBT Device
3.15 Schematic of GaAs HBT Device
3.16 pHEMT MMIC Process Flow Chart
3.17 0.15 Micron 3MI Process Cross Section
3.18 InGaP HBT Process
3.19 Worldwide SiGe Market Forecast
3.20 Hard Disk Drive Roadmap
3.21 Decrease In Average Price Of Storage
3.22 Heads Per Drive
3.23 Increase In Areal Density
3.24 Market Forecast Of Recording Head Consumption
3.25 Heads Per Drive Forecast
3.26 Thin Film Head Structure
3.27 Critical Features In Thin Film Head Structure
3.28 Spin Valve Head Structure
3.29 Cross-Sectional View TFH Stacks
3.30 Cross-Sectional View Of A TFH Design
3.31 CMP Slurry System For Tfh Wafer Polishing
3.32 Critical Feature Trends In Thin Film Heads
3.33 Application Space For Rf Filters
3.34 FBAR Diagram
3.35 BAW-SMR Diagram
3.36 RF Front-End Filters In Mobile Devices

Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown