The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components.
Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.
- Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques- Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs- Discusses properties, preparation, and growth of silicon crystals and wafers- Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures- Geared towards practical applications rather than theory
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Impact of Silicon MEMS Section I: Silicon as MEMS Material 1. Properties of Silicon 2. Czochralski Growth of SiliconCrystals 3. Properties of Silicon Crystals 4. Silicon Wafers: Preparation and Properties 5. Epi Wafers: Preparation and Properties 6. Thin Films on Silicon 6.1 Thin films on Silicon: Silicon dioxide 6.2 Thin films on Silicon: Silicon nitride 6.3 Thin Films on Silicon: Poly-Si and SiGe 6.4 Thin films on Silicon: AlD 6.5 Thin Films on Silicon: Piezofilms 6.6 Thin Films on Silicon: Metal films 7. Thick-Film SOI Wafers: Preparation and Properties Section II: Modeling in MEMS 8. Multiscale Modeling Methods 9. Mechanical Properties of Silicon Microstuctures 10. Electrostatic and RF-properties of MEMS Structures 11. Optical Modeling of MEMS 12. Simulations of Etching Processes for MEMS Fabrication 13. Gas Damping in Vibrating MEMS Structures Section III: Measuring MEMS 14. Introduction to Measuring MEMS 15. Silicon Wafer and Thin Film Measurements 16. Optical Measurement of Static and Dynamic Displacement in MEMS 17. MEMS Residual Stress Characterization: Methodology and Perspective 18. Strength of Bonded Interfaces 19. Oxygen and Bulk Microdefects in Silicon Section IV: Micromachining Technologies in MEMS 20. MEMS Lithography 21. Deep Reactive Ion Etching 22. Wet Etching of Silicon 23. Porous Silicon Based MEMS 24. Surface Micromachining 25. Vapour Phase Etch Processes for Silicon MEMS 26. 2 3-D Printing for MEMS 27. Microfluidics and Biomems in Silicon Section V: Encapsulation of MEMS Components 28. Introduction to encapsulation of MEMS 29. Silicon Direct Bonding 30. Anodic Bonding 31. Glass Frit Bonding 32. Metallic Alloy Seal Bonding 33. Bonding of CMOS Processed Wafers 34. Wafer Bonding: Tools and Processes 35. Encapsulation by Film Deposition 36. Dicing of MEMS Devices 37. 3D Integration of MEMS 38. Via Technologies for MEMS 39. Outgassing and Gettering 40. Hermeticity Tests 41. MEMS Reliability 42. Appendix 1: Common Abbreviations and Acronyms 43. Appendix 2: Nanoindentation Characterization of Silicon and other MEMS Materials
Markku Tilli obtained a degree in Materials Science (Physical Metallurgy) at Helsinki University of Technology (HUT) in 1974. Since 1985 he has had various managing positions at Okmetic in research, development and customer support areas, now he holds a position of Senior Vice President, Research. His MEMS related activities started in 1982 when he developed a process to make double side polished silicon wafers for bulk micromachined sensors. Since then he has developed advanced new silicon wafer types for MEMS, including special epitaxial wafers, SOI and SOI wafers with buried cavities. His publication topics include oxygen precipitation in silicon, silicon crystal growth, wafer cleaning as well as silicon wafer manufacturing technologies and applications in MEMS.
Mervi Paulasto-Kröckel chairs Electronics integration and Reliability in the School of Electrical Engineering, Aalto University, Finland. She has broad experience in microelectronics packaging development specifically for automotive and power electronics market.
Teruaki Motooka received PhD degree in 1981 in Applied Physics from Kyushu University. He was a research scientist in the Central Research Laboratory, Hitachi Ltd. for 1971-1984, a visiting research assistant professor at University of Illinois at Urbana-Champaign, USA for 1984-1988, an associate professor in the Institute of Applied Physics at University of Tsukuba, Japan for 1988-1993, and became a full professor at Kyushu University in 1993. He retired from Kyushu University in 2010.
He has published more than 150 scientific papers on various international journals and these papers have been cited more than 2000 times.
Veikko Lindroos is Professor Emeritus, Physical Metallurgy and Materials Science, Aalto University, Finland. His research covers a broad spectrum of materials science and technology, such as metallic materials, silicon technology and MEMS materials magnetic, electronic and composite materials as well as shape memory effect and materials.