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The Array IC Packaging Market 2013 Edition

  • ID: 2760422
  • Report
  • 110 Pages
  • New Venture Research
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Small form factor, high speed and performance, and high bandwidth capability with low battery consumption are desired traits for many packaging solutions for integrated circuits (ICs). High demand for handheld and high performance electronic devices is the driving factor behind the IC packaging needs.

IC packages with an array layout, as opposed to a perimeter layout, allow for more I/O density in a smaller form factor, meeting the needs outlined above. Thus demand for array IC packages is on the rise, as additional I/O connections are fit beneath the package than traditional leadframe packages, providing them with form factor benefits. BGA and FBGA package solutions also reach into I/O levels which are un- reachable by traditional leadframe packages, as the sub- strate can be enlarged to fit a large number of solder balls, land pads, or columns beneath it to attach to the PCB.

This new report, The Array IC Packaging Market - 2013 Edition, encompasses the array IC packages BGA, LGA, CGA, FBGA, FLGA, Fan-in QFN, WLP and Fan-out WLPs. Array IC packages can accommodate additional I/O connections beneath the package to connect to the printed circuit board (PCB) when compared to leadframe packages with only a single row of interconnections around the periphery of the package. This enables:

- A smaller footprint on the PCB
- Shorter traces through the package to the PCB, thus higher speed and improved performance
- Higher bandwidth capability
- Less power consumption, particularly important in battery-operated devices

Chapter 4 of this report covers BGAs and FBGAs solutions. BGAs and FBGAs do not have to have solder balls beneath the package substrate as the package can have just land pads or columns instead of balls for the second level interconnection, which connects the package to the printed circuit board. Forecasts in terms of units and revenue are provided for BGA, LGA, CGA, FBGA, and FLGA package solutions including a wide range of I/O counts of 3-18, 20-32, 34-100, 102-304, 308-999, and 1,000 and up.

Chapter 5 examines the Quad Flatpack No-lead, or QFN market, with emphasis on the Fan-in QFN. The Fan-in QFN has additional rows on this leadframe package, turning it into a leadframe version of an array IC package, and one that can reach even further into the market which would otherwise be covered by the larger QFP, but with a smaller form factor. Additional rows are 'Fanned-in' from the traditional perimeter-style leadframe, making this chip scale package unique.

Chapter 6 contains information on Wafer-Level Packages, or WLPs, which are the smallest package solution on the market, being die sized. This unique package is formed while the die is still part of an uncut wafer, the only package to be created or assembled in this manner. WLPs are array packages by nature, but since all the solder balls or bumps then must fit beneath the die itself, this limits the number of I/O which is on these packages.

The solution to this is the Reconfigured or Fan-out Wafer- Level Packages (Fan-out WLPs), for which the available surface available for I/O interface to the PCB is expanded beyond the perimeter of the die by virtue of a backside overmold. All these processes are done on an uncut wafer, so that manufacturing efficiencies are maximized.

The Array IC Packaging Market - 2013 Edition will provide you with an effective and economical tool for assessing the future of this market.
Note: Product cover images may vary from those shown
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Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: State of the Industry

- Economic Overview
- Industry Overview

Chapter 4: BGA/LGA/CGA and FBGA/FLGA Package Solutions, 2012 - 2017

Package Types:


- New Product Introductions
- Kyocera, SLC Technologies and IBM
- Forecasts for BGA, LGA, CGA, FBGA and FLGA Package Solutions

Chapter 5: Quad Flat Pack and Fan-in QFN Packages

- Overview
- Product Introductions
- Market Forecasts for QFN Fan-in QFN Packages

Chapter 6: Wafer-Level Packages and Fan-out WLPs

- WLP or Flip Chip on Board? The Layers
- Benefits of WLP
- Wafer Applied Underfill
- Wafer Testing
- Compliance to the PCB
- Issues and Solutions
- Cost Reduction for WLPs
- Current Applications
- Versatility of the WLP
- Fan-out WLP Challenges
- New Product Introductions
- -- Deca Technologies
-- J-Devices Corporation
-- STATS ChipPAC Ltd.
-- Teramikros, Inc.

Appendix A: Web Address Guide
Appendix B: Glossary of Terms

List of Tables

Table 4-1 BGA / LGA 34-100 I/O Package Units, 2012-2017
Table 4-2 BGA / LGA / CGA 104-304 I/O Package Units, 2012-2017
Table 4-3 BGA / LGA 308-999 I/O Package Units, 2012-2017
Table 4-4 BGA / LGA 1,000+ I/O Package Units, 2012-2017
Table 4-5 BGA / LGA / CGR Package Units, 2012-2017
Table 4-6 FBGA / FLGA 4-18 I/O Package Units, 2012-2017
Table 4-7 FBGA / FLGA 20-32 I/O Package Units, 2012-2017
Table 4-8 FBGA / FLGA 34-100 I/O Package Units, 2012-2017
Table 4-9 FBGA / FLGA 104-304 I/O Pack- age Units, 2012-2017
Table 4-10 FBGA / FLGA 308-999 I/O Pack- age Units, 2012-2017
Table 4-11 FBGA / FLGA 1,000 + I/O Pack- age Units, 2012-2017
Table 4-12 FBGA / FLGA 1,000 + I/O Units by Percent, 2012
Table 4-13 FBGA / FLGA Package Units, 2012-2017
Table 5-1 Fan-in QFN/QFP Units, 2012-2017
Table 5-2 Fan-in QFN Units, 2012-2017
Table 6-1 WLP Forecast, 2012-2017
Table 6-2 Fan-out WLP Forecast, 2012-2017

List of Figures

Figure 4-1 CSP on Test Card
Figure 4-2 BGA / LGA 34-100 I/O Units, 2012
Figure 4-3 BGA / LGA / CGA 104-304 I/O Units, 2012
Figure 4-4 BGA / LGA 308-999 I/O Units, 2012
Figure 4-5 BGA / LGA 1.000+ I/O Units, 2012
Figure 4-6 BGA / LGA / CGR Units, 2012 vs. 2017
Figure 4-7 FBGA / FLGA 4-18 I/O Units, 2012
Figure 4-8 FBGA / FLGA 20-32 I/O Units, 2012
Figure 4-9 FBGA / FLGA 34-100 I/O Units, 2012
Figure 4-10 FBGA / FLGA 104-304 I/O Units, 2012
Figure 4-11 FBGA / FLGA 308-999 I/O Units, 2012
Figure 4-12 FBGA / FLGA 1,000 + I/O Units, 2012
Figure 5-1 QFN and Fan-in QFN Units
Figure 5-2 QFN and Fan-in QFN Revenue
Figure 6-1 Process Steps of Redistribution
Figure 6-2 Adaptive Patting Process Flow
Figure 6-3 Adaptive Pattern Design
Figure 6-4 Fan-out Package With Adaptive Pattern
Figure 6-5 WFOP Final Package
Figure 6-6 WFOP Package Drawing
Figure 6-7 WFOP Solder Ball Attachment
Figure 6-8 3-D Stacked Version of the WFOP
Figure 6-9 Two Layer RDL Stack-up
Figure 6-10 WLP and Fan-out WLP Unit Growth
Figure 6-11 WLP and Fan-out WLP Revenue Growth
Note: Product cover images may vary from those shown
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The publisher's forecasts are developed using a four-step approach. First, expectations of world economic growth are set based upon historical data and forecasts obtained from published International Monetary Fund (IMF) reports.

Next, a top-down forecast of electronics industry growth is built. This analysis is based primarily on historical data obtained from the Semiconductor Industry Association (SIA) and World Semiconductor Trade Statistics (WSTS). Because semiconductor content is at the core of electronics products, semiconductor data is a good triangulation point for total assembly value. This data is augmented with information on passive content and estimates of labor and overhead.

Then, a bottom-up forecast is developed for each of the products in each segment. This is accomplished by first creating a unit forecast for each product based on historical data and various industry-leader opinions regarding future growth prospects for each product. A model of the assembly value of each product is then built using teardown analyses and price-based models. The unit volume times the assembly value per unit equals the total assembly value for each product - often referred to as the cost of goods sold (COGS).

Finally, the first three steps are reiterated to achieve a coherent forecast. The forecasts developed by this process are presented in all their industry reports.