Huawei LTE-FDD Baseband Unit WD2BBBUC-HERT BBU Model BBU3900

  • ID: 2932976
  • Report
  • 68 Pages
  • EJL Wireless Research
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FEATURED COMPANIES

  • Analog Devices
  • Fairchild Semiconductor
  • HiSilicon Technologies
  • Maxim Integrated Products
  • Micrel
  • NXP Semiconductors
  • MORE
Design Analysis Huawei Technologies FDD LTE Baseband Unit (BBU)

This report covers the design analysis of a Huawei Technologies FDD LTE. This unit is part of the DBS3900 system. The unit was manufactured between Q3-Q4 of 2011.

Key Findings:

- Modular chassis allows for single mode and multi-mode operation

- LBBPc card allows for capacity up to 2T2R 3 x 20MHz or 4T4R 3 x 10MHz

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Fairchild Semiconductor, HiSilicon Technologies, Integrated Device Technology, Maxim Integrated Products, Micrel, NXP Semiconductors, ON Semiconductor, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.

Features
Complete Part Number/Marking
Component Manufacturer Identification
Function Component Description

Package Type
Total Pages: 68
Total Tables: 23
Total Exhibits: 68

Important Note: There is NO component pricing contained within the report.

Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Analog Devices
  • Fairchild Semiconductor
  • HiSilicon Technologies
  • Maxim Integrated Products
  • Micrel
  • NXP Semiconductors
  • MORE


EXECUTIVE SUMMARY
Active/Passive Component Summary
Important Note:

CHAPTER 1: HUAWEI TECHNOLOGIES DBS3900 BTS SYSTEM
Overview of DBS3900 Product Offering

CHAPTER 2: BSBC MECHANICAL ANALYSIS
Mechanical Analysis
BSBC Backplane PCB

CHAPTER 3: FAN UNIT (UBFA)

CHAPTER 4: UPEUC

CHAPTER 5: LTE CONFIGURATION

CHAPTER 6: LMPT

CHAPTER 7: LBBP

APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES
Table 1: BSBC PCB Bill of Materials, Top
Table 2: BSBC PCB Bill of Materials, Bottom
Table 3: Fan Unit Bill of Materials
Table 4: Fan Unit PCB, Top Bill of Materials
Table 5: Fan Unit PCB, Bottom Bill of Materials
Table 6: UPEU Ethernet PCB Bill of Materials
Table 7: UPEU Main PCB Area A Bill of Materials
Table 8: UPEU Main PCB Area B Bill of Materials
Table 9: LMPT Top View Bill of Materials
Table 10: LMPT Top View Area A Bill of Materials
Table 11: LMPT Top View Area B Bill of Materials
Table 12: LMPT Bottom View Area B Bill of Materials
Table 13: LMPT Top View Area C Bill of Materials
Table 14: LMPT Bottom View Area C Bill of Materials
Table 15: LMPT Bottom View Bill of Materials
Table 16: LBBP Variant Specifications
Table 17: LBBP Variant Maximum Data Rate Support
Table 18: LBBP Top View Bill of Materials
Table 19: LBBP Bottom View Bill of Materials
Table 20: Passive Component Case Size Distribution by System Subsection
Table 21: Identified Passive Component Supplier Distribution by System Subsection
Table 22: Active/Passive Component Distribution by System Subsection
Table 23: Active Semiconductor/Component Vendor Distribution by System Subsection

EXHIBITS
Exhibit 1: BTS3900 DBS3900
Exhibit 2: BBU3900 BSBC Unit
Exhibit 3: BBU3900 Logical Structure for LTE Configuration
Exhibit 4: DBS3900 Configurations (Star/Cascade)
Exhibit 5: BSBC Configuration for LTE
Exhibit 6: BBU3900 Basic Configuration for LTE with cards
Exhibit 7: BBU3900 Typical 3x20MHz 2T2R Configuration for LTE with cards
Exhibit 8: BSBC Chassis, Front View
Exhibit 9: BSBC Chassis, Top View
Exhibit 10: BSBC Chassis, Bottom View
Exhibit 11: BSBC Chassis, Left View
Exhibit 12: BSBC Chassis, Right View
Exhibit 13 : BSBC Chassis, Back View
Exhibit 14: BSBC Chassis, Back View with Back plate Cover Removed
Exhibit 15: Backplane Connector PCB, Top View
Exhibit 16: Backplane Connector PCB, Bottom View
Exhibit 17: Backplane Connector Component Diagram, Top View
Exhibit 18: Fan Unit Panel Identification
Exhibit 19: Fan Unit, Top View
Exhibit 20: Fan Unit, Bottom View
Exhibit 21: Fan Unit, Right Side View
Exhibit 22: Fan Unit, Left Side View
Exhibit 23: Fan Unit Component Diagram
Exhibit 24: Fan Unit Cable Diagram
Exhibit 25: Fan Unit PCB, Top View, Component Diagram
Exhibit 26: Fan Unit PCB, Bottom View. Component Diagram
Exhibit 27: UPEU Panel Identification
Exhibit 28: UPEUc, Top View
Exhibit 29: UPEUc, Bottom View
Exhibit 30: UPEUc, Side View
Exhibit 31: UPEU Ethernet PCB, Top View
Exhibit 32: UPEU Ethernet PCB, Bottom View, Component Diagram
Exhibit 33: UPEU Main PCB with Heatsink (Top) and without (Bottom)
Exhibit 34: UPEU Main PCB, Top View
Exhibit 35: UPEU Main PCB, Bottom View
Exhibit 36: UPEU Main PCB Area A Component Diagram
Exhibit 37: UPEU Main PCB Area B Component Diagram
Exhibit 38: BBU3900 Basic Configuration (3x20MHz 2T2R) for LTE with LBBPc card
Exhibit 39: BBU3900 Basic Configuration (3x20MHz 2T2R) for LTE with LBBPb cards
Exhibit 40: LMPT Panel Identification
Exhibit 41: Working Principle of the LMPT Unit
Exhibit 42: LMPT Board, Top View
Exhibit 43: LMPTb System Block Diagram
Exhibit 44: LMPT Board Top View Analysis Map
Exhibit 45: LMPT Board Top View Component Diagram
Exhibit 46: LMPT Board Top View Area A Component Diagram
Exhibit 47: Area B GPS Processing Daughter Card, Top View Component Diagram
Exhibit 48: Area B GPS Processing Daughter Card, Bottom View Component Diagram
Exhibit 49: External GPS Cable
Exhibit 50: Internal GPS Cable
Exhibit 51: LMPT Area C Daughter Card Top View Component Diagram
Exhibit 52: LMPT Area C Daughter Card Bottom View Component Diagram
Exhibit 53: LMPT Board Bottom View Component Diagram
Exhibit 54: LMPT Faceplate
Exhibit 55: LBBPb Panel Identification
Exhibit 56: LBBPc Panel Identification
Exhibit 57: LBBPd Panel Identification
Exhibit 58: LBBPc System Block Diagram
Exhibit 59: LBBP Board, Top View
Exhibit 60: LBBP Top View Component Diagram

Note: Product cover images may vary from those shown
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4 of 4
- Analog Devices
- Fairchild Semiconductor
- HiSilicon Technologies
- Integrated Device Technology
- Maxim Integrated Products
- Micrel
- NXP Semiconductors
- ON Semiconductor
- STMicroelectronics
- Texas Instruments
- Vishay Semiconductors.
Note: Product cover images may vary from those shown
5 of 4
Note: Product cover images may vary from those shown
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