Design Analysis Nokia Solutions Networks FSME LTE Baseband Unit

  • ID: 3042488
  • Report
  • Region: Global
  • 85 pages
  • EJL Wireless Research
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FEATURED COMPANIES

  • Amphenol
  • Epson Toyocomm
  • Infineon Technologies
  • NXP Semiconductors
  • Samsung Semiconductors
  • Texas Instruments
  • MORE
This report covers the design analysis of a Nokia Solutions Networks FSME LTE digital baseband unit. This unit is part of the Flexi eNodeB system. The unit was manufactured in Q3 of 2010.

Key Findings:

- Separate sector cards for baseband processing

- Standard DSPs for high capacity LTE user support and throughput

- Advanced power management for ASICs, DSPs, and FPGAs

Component and semiconductor suppliers mentioned in this report include: Amphenol, AVX, Epson Toyocomm, Fairchild Semiconductor, Infineon Technologies, Molex, NXP Semiconductors, Pulse Electronics, Samsung Semiconductors, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.

Features:
Complete Part Number/Marking
Component Manufacturer Identification
Function Component Description

Note: Product cover images may vary from those shown
2 of 5

FEATURED COMPANIES

  • Amphenol
  • Epson Toyocomm
  • Infineon Technologies
  • NXP Semiconductors
  • Samsung Semiconductors
  • Texas Instruments
  • MORE
EXECUTIVE SUMMARY
Active/Passive Component Summary
Important Note:

CHAPTER 1: NOKIA FLEXI MULTIRADIO BTS SYSTEM
Overview of Nokia Flexi Product Offering

CHAPTER 2: FSME MECHANICAL ANALYSIS
Mechanical Analysis

CHAPTER 3: FLEXI POWER DISTRIBUTION AND FUSES MODULE (FPFB)

CHAPTER 4: FCM SUB SYSTEM

CHAPTER 5: FSP SUB SYSTEM

CHAPTER 6: FAN UNIT

APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES
Table 1: FPFB Bill of Materials
Table 2: FCM PCB Top Bill of Materials
Table 3: FCM PCB Top Missing Component Bill of Materials
Table 4: FCM PCB Bottom Bill of Materials
Table 5: FCM PCB Bottom Missing Component Bill of Materials
Table 6: FCM PCB Bottom Missing Connector Bill of Materials
Table 7: FSP Top Bill of Materials
Table 8: FSP Top View Missing Component Bill of Material
Table 9: FSP Bottom Bill of Materials
Table 10: FSP Bottom Missing Component Bill of Materials
Table 11: FSP Bottom Missing Component, Area A Bill of Materials
Table 12: FSP Bottom Missing Connector Bill of Materials
Table 13: Passive Component Case Size Distribution by System Subsection
Table 14: Identified Passive Component Supplier Distribution by System Subsection
Table 15: Active/Passive Component Distribution by System Subsection
Table 16: Active Semiconductor/Component Vendor Distribution by System Subsection

EXHIBITS
Exhibit 1: Nokia Flexi Macro Cell Indoor/Outdoor BTS System Cabinets, FCIA (L) and FCOA (R)
Exhibit 2: Flexi FSMx System Module w/Case, Front/Back Covers and External Cable Entry Covers
Exhibit 3: Nokia FSME System Block Diagram
Exhibit 4: FSME System Module Interfaces w/FPFB Power Module (L) and Transport Sub-module (R)
Exhibit 5: FSME Unit, Front
Exhibit 6: FSME Front Panel Interface Ports
Exhibit 7: FSME Unit, Front View
Exhibit 8: FSME Unit, Back View (Fan Unit Removed)
Exhibit 9: FSME Unit, Left Side View
Exhibit 10: FSME Unit, Right Side View
Exhibit 11: FSME Unit, Bottom View
Exhibit 12: FSME Unit, Top View
Exhibit 13: FSM Top Frame, External View
Exhibit 14: FSM Top Frame, Internal View w/PCBs
Exhibit 15: FSM Top Frame, Internal View w/o PCBs
Exhibit 16: FSM Bottom Shield, External View
Exhibit 17: FSM Bottom Frame, Internal View w/PCBs
Exhibit 18: FSM Bottom Frame, Internal View w/o PCBs
Exhibit 19: FSME System, Exploded Side View
Exhibit 20: FSME System, FCM+FSP Boards
Exhibit 21: FPFB Interface Diagram
Exhibit 22: FPFB Interface Panel w/Protective Covers
Exhibit 23: FPFB Interface Panel w/o Protective Covers
Exhibit 24: FPFB Top View (L) and Bottom View (R)
Exhibit 25: FPFB Cover, External View (L) and Internal View (R)
Exhibit 26: Aluminum Recycling Code
Exhibit 27: FPFB Internal View of Frame w/ PCB
Exhibit 28: FPFB Frame Internal View w/o PCB
Exhibit 29: FPFB Power Bus Bar Component Diagram
Exhibit 30: FPFB PCB Top View
Exhibit 31: FPFB PCB Top View Component Diagram
Exhibit 32: FPFB PCB Bottom View Component Diagram
Exhibit 33: FPFB Connector Card to System Module
Exhibit 34: FCM PCB Dimensions
Exhibit 35: FCM to FSP Connector Card Type 1
Exhibit 36: FCM to FSP Connector Card Type 2
Exhibit 37: FCM PCB Top View, Component Diagram
Exhibit 38: FCM PCB Top View, Areas A & B
Exhibit 39: FCM PCB Top View, Area A Component Diagram
Exhibit 40: FCM PCB Top View, Area B Component Diagram
Exhibit 41: FCM PCB Top View, Missing Components Diagram
Exhibit 42: FCM PCB Bottom View, Component Diagram
Exhibit 43: FCM PCB Bottom View, Missing Components Diagram
Exhibit 44: FCM PCB Bottom View, Missing Connector Component Diagram
Exhibit 45: FCM Block Diagram
Exhibit 46: FSP PCB Dimensions
Exhibit 47: FSP Top View, Component Diagram
Exhibit 48: FSP Top View, Missing Component Diagram
Exhibit 49: FSP Bottom View, Component Diagram
Exhibit 50: FSP Bottom View, Missing Component Diagram
Exhibit 51: FSP Bottom View, Missing Components, Area A
Exhibit 52: FSP Bottom View, Missing Connector Component Diagram
Exhibit 53: FSME FSP Baseband Processing Block Diagram
Exhibit 54: Plastic Recycling Code
Exhibit 55: Fan11 Unit, External View
Exhibit 56: Fan11 Unit, Internal View
Exhibit 57: Fan11 Unit, Bottom View
Exhibit 58: Fan11 Cable Connector Interface Plate, External View (L) and Internal View (R)
Exhibit 59: Passive Component Case Size Distribution
Exhibit 60: Identified Passive Component Market Share by Vendor
Exhibit 61: Active Semiconductor Component Share
Exhibit 62: High Pin Count IC vs. Discretes
Exhibit 63: Active Semiconductor Market Share by Vendor
Exhibit 64: High Pin Count (64+) Active Semiconductor Market Share by Vendor

Note: Product cover images may vary from those shown
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4 of 5
- Amphenol
- AVX
- Epson Toyocomm
- Fairchild Semiconductor
- Infineon Technologies
- Molex
- NXP Semiconductors
- Pulse Electronics
- Samsung Semiconductors
- STMicroelectronics
- Texas Instruments
- Vishay Semiconductors
Note: Product cover images may vary from those shown
5 of 5
Note: Product cover images may vary from those shown
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