Radiation Hardened Electronic Devices and Components Market: By Components By Materials Verticals - Forecast 2017-2022

  • ID: 3063583
  • Report
  • Region: Global
  • 142 pages
  • IndustryARC
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Radiation Hardened Electronic Devices and Components involve production of electronic components by hardening through radiation. Insulating substrates such as SOI (Silicon on Insulators), SOS (Sapphire) are used primarily. The hardened components have a special purpose of withstanding otherwise damaging radiations (radiation immunity) particularly a serious problem in the design of components for artificial satellites, spacecraft, military aircraft, nuclear power stations, and nuclear weapons and other computing devices. The market is affected by the high operating costs and low volume nature of the space market. But defence and aerospace are the main driving force that has been holding the industry from collapsing over the past 10 years.

The market has been segmented by geography as North America, Europe, Asia, and Rest of the World (ROW). Market size and forecast is provided for each of these regions. A detailed qualitative analysis of the factors responsible for driving and restraining growth of the Radiation Hardened components is discussed in the report. Market shares of the key players for 2013 are provided. The prominent players profiled in this report are Honeywell Electronics, BAE Systems, ST Microelectronics and others.
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1. Rad-Hard And Rad-Tol Edc- Market Overview

2. Executive Summary

3. Rad-Hard Edc Market Landscape
3.1. Market Share Analysis
3.2. Comparative Analysis
3.2.1. Product Benchmarking
3.2.2. Patent Analysis
3.2.3. Top 5 Financials Analysis

4. Rad-Hard Edc Market Forces
4.1. Market Drivers
4.1.1. Reliability On Radiation-Hardened And Radiation-Tolerant Components
4.1.2. Demand For Commercial Airplanes On The Rise
4.1.3. Space And Military Budget Cuts Increasing Demand For Higher Rad-Hard And Rad-Tol Components.
4.2. Market Constraints
4.2.1. Increasing Liability To Damaging Radiation Effects Due To Decrease In Chip Sizes
4.3. Market Challenges
4.3.1. Increasing Cost Of See Testing Procedure
4.3.2. Inadequate See Testing Procedures
4.3.3. Reconfigurable Electronics On Priority List Of Space Agencies Across The World
4.4. Attractiveness Of Radiation Hardened Edc Industry
4.4.1. Power Of Suppliers
4.4.2. Power Of Customers
4.4.3. Threat Of New Entrants
4.4.4. Threat Of Substitution
4.4.5. Degree Of Competition

5. Rad-Hard Edc Market – Strategic Analysis
5.1. Value Chain Analysis
5.2. Pricing Analysis
5.3. Opportunities Analysis
5.4. Product/Market Life Cycle Analysis
5.5. Suppliers And Distributors

6. Rad Hard Edc Market By Products
6.1. Introduction
6.2. Analog And Mixed Signal/ Digital Electronic Devices
6.2.1. Rad-Hard A/D And D/A Converters
6.2.2. Rad-Hard Multiplexers
6.3. Discrete Semiconductors
6.4. Optoelectronics
6.5. Power Management
6.6. Sensors
6.7. Memory
6.8. Microprocessors And Microcontrollers
6.9. Fpgas
6.10. Asics
6.11. Others
6.11.1. Radiation Hardened Flip Flop
6.11.2. Radiation Hardened Cmos Structure Using An Implanted P Guard Structure

7. Rad Hard Edc Market By Materials
7.1. Silicon.
7.2. Silicon Carbide
7.3. Gallium Nitride
7.4. Hydrogenated Amorphous Silicon

8. Rad Hard Edc Market By Product-Type
8.1. Custom-Made
8.2. Commercial-Off-The-Shelf (Cots)

9. Rad Hard Edc Market By Industry Verticals
9.1. Introduction
9.2. Aerospace
9.3. Military
9.4. Space
9.5. Nuclear
9.6. Medical
9.7. Consumer Electronics
9.8. Others.

10. Rad Hard Edc Market - Geographic Analysis
10.1. Introduction
10.2. Americas
10.3. Europe
10.4. Apac
10.5. Row

11. Market Entropy
11.1. Introduction
11.1.1. New Product Launches
11.1.2. M&As, Collaborations, Jvs And Partnerships

12. Company Profiles
12.1. Aeroflex Inc.
12.2. Atmel Corporation
12.3. Bae Systems Plc
12.4. Crane Co.
12.5. Honeywell Aerospace
12.6. International Rectifier Corporation
12.7. Intersil Corporation
12.8. Linear Technology Corporation
12.9. Maxwell Technologies Inc.
12.10. Microsemi Corporation
12.11. Stmicroelectronics Nv
12.12. Texas Instruments Inc.
12.13. Xilinx Inc.
12.14. Micropac Industries Inc.
12.15. Ms Kennedy Corporation
12.16. Peregrine Semiconductor Corp
12.17. Semicoa Corporation
12.18. Teledyne Microelectronic Technologies, Inc.
12.19. 3D Plus SA.
12.20. Aitech Defense Systems Inc.
*More than 40 Companies are profiled in this Research Report, Complete List available on Request*
"*Financials would be provided on a best efforts basis for private companies"

13. Appendix
13.1. Abbreviations
13.2. Sources
13.3. Research Methodology
13.4. Expert Insights
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- The Rad Hard components market has been segmented and opportunities analysed based on the type of products like memory chips, processors, FPGAs and others.

- Other applications such as design of artificial satellites, spacecraft, military aircraft
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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