InvenSense ICS-43432 Microphone - Reverse Costing Analysis

  • ID: 3095449
  • Report
  • Region: Global
  • 107 Pages
  • System Plus Consulting
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Following the acquisition of MEMS Microphone Business Line of Analog Devices for 100M$ in October 2013, InvenSense releases its last high performances digital MEMS Microphone based on flexible membrane and capacitive common sensing principle.

The ICS-43432 is a digital microphone equipped with MEMS and amplification ASIC into a single chip. It is designed by CMOS process, it has I²S protocol interface and high SNR of 65dBA.

The MEMS transducer is a condenser microphone with a flexible poly-Si membrane and a rigid reference electrode manufactured on SOI substrate. Compared with state of the art MEMS Microphones, it presents a new design of the diaphragm with octagonal shape and centralfixation.

Assembled in a 6-pins LGA4.0x3.0x1.0mm package, the ICS-43432 is an high performance digital output microphone with bottom port targeted for consumers applications.
Note: Product cover images may vary from those shown
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1. Overview / Introduction
– Executive Summary
– Reverse Costing Methodology

2. Company Profile
– InvenSense
– Digital Microphones portfolio

3. Physical Analysis
– Synthesis of the Physical Analysis
– Device Design
– Physical Analysis Methodology
– Package Views & Dimensions
– Package Opening
– Package Cross-Section
– View & Dimensions
– Die Marking
– Die Delayering
– Die Process
– Die Cross-Section
– Process Characteristics
– View & Dimensions
– Marking
– Dicing
– Bond Pads
– Membrane & Backplate
– Central Support
– Anti-Stiction holes
– Cavity– Cross-Section
– MEMS Characteristics

4. Manufacturing Process Flow
– Global Overview
– ASIC Front
- End Process
– ASIC Wafer Fabrication Unit
– MEMS Process Flow– MEMS Wafer Fabrication Unit
– Packaging Process Flow– Package Assembly Unit

5. Cost Analysis
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Explanation
– Yields Hypotheses
– ASIC Front-End Cost
– ASIC Back-End 0 : Probe Test & Dicing– ASIC Wafer Cost
– ASIC Die Cost– MEMS Front-End Cost
– MEMS Front-End Cost per process steps
– MEMS Front-End: Equipment Cost per Family
– MEMS Front-End: Material Cost per Family
– MEMS Back-End 0 : Probe Test & Dicing
– MEMS Wafer Cost– MEMS Die Cost
– Back-End : Packaging Cost
– Back-End : Packaging Cost per Process Steps
– Back-End : Final Test Cost– Microphone Component Cost

6. Estimated price Analysis
– Manufacturer financial ration
– Microphone Component Price
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown