InvenSense MP67B - Reverse Costing Analysis

  • ID: 3096369
  • Report
  • Region: Global
  • 109 Pages
  • System Plus Consulting
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With 74.5 million units of iPhone sold during the last quarter 2014, InvenSense made a very good deal by replacing STMicroelectronics as the supplier of the gyroscope for the iPhone 6 and 6 Plus.

The MP67B is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis accelerometer) made for Apple. Compared to InvenSense’s standard 6-Axis device MPU-6500, specific modifications have been realized. The main ones consist in the package modification with the use of a LGA substrate compared to a QFN leadframe, and in the ASIC which has been redesigned.

The MP67B uses the same process as InvenSense’s second generation 6-axis device with a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefit of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.
Note: Product cover images may vary from those shown
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1. Overview / Introduction
– Executive Summary
– Reverse Costing Methodology

2. Company Profile
– InvenSense Profile
– iPhone 6 Teardown

3. Physical Analysis
– Synthesis of the Physical Analysis
– Physical Analysis Methodology

– Package View & Dimensions
– Package Opening
– Package Cross-Section

– View, Dimensions & Marking
– MEMS Removed
– MEMS Sensing Area: Gyroscope
– MEMS Sensing Area: X/Y-Axis Accelerometer
– MEMS Sensing Area: Z-Axis Accelerometer
– MEMS Cap– ASIC Delayering & Process
– Die Cross-Section: ASIC
– Die Cross-Section: MEMS (Pads Opening)
– Die Cross-Section: MEMS (Sealing)
– Die Cross-Section: Sensor (Electrical Contacts)
– Die Cross-Section: Sensor (Standoffs)
– Die Cross-Section: Sensor (Al-GE Bonding)
– Die Cross-Section: Sensor (Mobile Elements)
– Die Cross-Section: Cap

– Comparison with MPU-6

– Comparison with previous generation

5. Manufacturing Process Flow
– Global Overview
– ASIC Front-End Process
– MEMS Process Flow
– Wafer Fabrication Unit
– Packaging Process Flow
– Package Assembly Unit

6. Cost Analysis
– Synthesis of the cost analysis– Main steps of economic analysis
– Yields Hypotheses
– ASIC Front-End Cost
– MEMS Front-End Cost
– ASIC/MEMS Assembly Cost
– MEMS Front-End Cost per process steps
– Total Front-end Cost
– Back-End : Probe Test & Dicing
– Wafer & Die Cost
– Back-End : Packaging Cost
– Back-End : Packaging Cost per Process Steps
– Back-End : Final Test & Calibration Cost
– Component Cost

7. Estimated Price Analysis
– InvenSense Financial Ratios
– Component Estimated Price
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown