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Next Generation Memory Market: Technology Application Industry & Geography - Forecast 2017-2022

  • ID: 3339472
  • Report
  • Region: Global
  • 230 pages
  • IndustryARC
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Traditional memory technologies have limitations in scalability and storage. There is a need for next generation memory technologies with upgraded architecture and lower power consumption. Next generation memory technologies are becoming necessary due to the increasing demand for newer memory solutions with improved performance and reduced power consumption. Next generation memory systems are more advanced than traditional DRAM, SRAM and flash memories in terms of data transmission speed, storage capacity, scalability and cost. Thus, consumers and end users are increasingly utilizing next generation memory systems such as D-RAM and M-RAM in their products thereby propelling the market.

The Next generation memory technologies market has been segmented according to the different technologies used in the next generation memory solutions. These technologies are segmented under volatile and non-volatile memory technologies. Non-volatile technologies are further segmented into ReRAM, F-RAM, M-RAM, and PC-RAM; whereas, volatile technologies are segmented into D-RAM, T-RAM, T-TRAM, S-RAM and Z-RAM.

According to its applications, next generation memory technologies are categorized into Cache Memory and Enterprise Storage, Mass storage, Embedded MCU and Smart card. Increasing scalability and speed of these memories is set to drive its adoption in the mass storage as well as in the enterprise storage markets.

Also, according to the end user industries, next generation memory technologies are sub-segmented into Consumer electronics, Industrial Automation, Automotive, Aerospace, Defense and Others. D-RAM memory is exhibiting high penetration in mobile consumer electronics market.

Next generation memory technologies market is represented according to different geographies such as APAC, Europe, Americas and RoW as well as key countries of this market.
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1. Next generation Memory technologies market Overview

2. Executive Summary

3. Next generation Memory technologies market Landscape
3.1. Market Share Analysis
3.2. Comparative Analysis
3.2.1. Product Benchmarking
3.2.2. End user profiling
3.2.3. Patent Analysis
3.2.4. Top 5 Financials Analysis

4. Next generation Memory technologies market Forces
4.1. Market Drivers
4.2. Market Constraints
4.3. Market Challenges
4.4. Attractiveness of the Memory technologies Industry
4.4.1. Power of Suppliers
4.4.2. Power of Customers
4.4.3. Threat of New entrants
4.4.4. Threat of Substitution
4.4.5. Degree of Competition

5. Next generation Memory technologies Market – Strategic Analysis
5.1. Value Chain Analysis
5.2. Pricing Analysis
5.3. Opportunities Analysis
5.4. Product/Market Life Cycle Analysis
5.5. Suppliers and Distributors

6. Next generation Memory Technologies Market – By Technology
6.1. Introduction
6.2. Nonvolatile Next generation Memory Technologies
6.2.1. Memristor or Resistive Random Access Memory (ReRAM)
6.2.2. Phase-Change Random-Access Memory (PC-RAM)
6.2.3. Magnetoresistive Random-Access Memory (M-RAM)
6.2.4. Ferroelectric Ram (F-RAM)
6.2.5. Others
6.3. Volatile Next generation Memory Technologies
6.3.1. Dynamic Random Access Memory (D-RAM)
6.3.1.1. T-RAM
6.3.1.2. T-TRAM
6.3.1.3. Others
6.3.2. Static Random Access Memory (S-RAM)
6.3.2.1. Z-RAM

7. Next generation Memory Technologies Market - by Application
7.1. Cache Memory and Enterprise Storage
7.2. Mass storage
7.3. Embedded MCU and Smart card

8. Next generation memory technologies Market– By End user
8.1. Consumer electronics
8.2. Industrial Automation
8.3. Automotive
8.4. Aerospace
8.5. Defense
8.6. Others

9. Next generation memory technologies Market -Geographic Analysis
9.1. Introduction
9.2. Americas
9.2.1. North America
9.2.2. Brazil
9.2.3. Argentina
9.2.4. Mexico
9.3. Europe
9.3.1. UK
9.3.2. France
9.3.3. Germany
9.3.4. Italy
9.4. APAC
9.4.1. China
9.4.2. Japan
9.4.3. South Korea
9.4.4. Australia
9.5. ROW

10. Market Entropy
10.1. New Product Launches
10.2. M&As, Collaborations, JVs and Partnerships

11. Company Profiles (Overview, Financials, SWOT Analysis, Developments, Product Portfolio)
11.1. Toshiba Corporation
11.2. Sankdisk Corporation
11.3. Intel Corporation
11.4. Fujitsu ltd
11.5. Samsung Electronics
11.6. Adesto Technologies
11.7. Micron Technology Inc.
11.8. SK Hynix Inc.
11.9. IBM Corporation
11.10. Cypress Semiconductor Corporation
11.11. Everspin Technologies Inc.
11.12. Avalanche Technologies Inc.
11.13. Crossbar Inc.
11.14. Winbond Electronics Corporation
11.15. ASUS
11.16. Corsair Memory
11.17. Samsung Electronics
11.18. Transcend
11.19. Sony
11.20. Kingston Technology
*More than 40 Companies are profiled in this Research Report, Complete List available on Request*
"*Financials would be provided on a best efforts basis for private companies"

12. Appendix
12.1. Abbreviations
12.2. Sources
12.3. Research Methodology
12.4. Bibliography
12.5. Compilation of Expert Insights
12.6. Disclaimer
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