MEMS Packaging. Materials, Circuits and Devices - Product Image

MEMS Packaging. Materials, Circuits and Devices

  • ID: 3527766
  • Book
  • IET Books
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Written as a collective work by 14 outstanding microsystems packaging specialists from US industries, government laboratories and universities, MEMS Packaging provides a comprehensive view of the prevalent practices and enabling techniques in the assembly, packaging and testing of MEMS and microsystems. The book also addresses aspects of microassembly and testing technologies that are often overlooked.

Aimed at professional engineers, scientists and technologists from industry, research laboratories and universities, the book examines every aspect of the assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in the key industries of life sciences, telecommunication and aerospace engineering. The authors cover key topics such as bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, RF telecommunications and aerospace applications.

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- Chapter 1: Fundamentals of MEMS packaging
- Chapter 2: Joining and bonding technologies
- Chapter 3: Sealing technologies
- Chapter 4: Packaging of microsystems
- Chapter 5: Automated micro assembly
- Chapter 6: Testing and design for test
- Chapter 7: MEMS packaging in the life sciences
- Chapter 8: RF and optical packaging telecommunications and other applications
- Chapter 9: Aerospace applications
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Tai-Ran Hsu Professor.
San Jose State University, USA.

Professor Tai-Ran Hsu received his PhD in mechanical engineering from McGill University, Canada. He worked extensively in the power plant equipment and nuclear industries before moving into academia. He is currently Professor and Director of Microsystems Design and Packaging Laboratory at San Jose State University, and has published over 120 technical papers and five books in FE, CAD and MEMS design, manufacture and packaging.

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