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Heat Management in Integrated Circuits. Materials, Circuits and Devices- Product Image
Heat Management in Integrated Circuits. Materials, Circuits and Devices- Product Image

Heat Management in Integrated Circuits. Materials, Circuits and Devices

  • ID: 3527885
  • Book
  • December 2015
  • IET Books

As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the system to dissipate the generated heat. Thermal effects are forcing chip designers to apply conservative design margins, creating sub-optimal results. At a larger scale, cooling is the second most costly item in the electricity bills of well-designed high-performance computing and data centers, costing 30-50% of the total. Thermal monitoring and management in integrated circuits is therefore becoming increasingly important.

This book covers thermal monitoring and management in integrated circuits, with a focus on devices and materials that are intimately integrated on-chip as opposed to in-package or on-board. The devices and circuits discussed include various designs used for the purpose of converting temperature to a digital measurement and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. Topics covered include an overview of heat in integrated circuits and systems, on-chip temperature sensing, dynamic thermal management, active cooling, and mitigating thermal events at the system-level and above.

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- Chapter 1: Heat in integrated circuits and systems
- Chapter 2: On-chip temperature sensing
- Chapter 3: Dynamic thermal management
- Chapter 4: Active cooling
- Chapter 5: Mitigating thermal events at the system level and above
- Chapter 6: Emerging directions in thermal-aware systems
- Appendix A: Relevant units and metrics
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Seda Ogrenci-Memik Associate Professor.
Northwestern University, Electrical Engineering and Computer Science Department, USA.

Seda Ogrenci-Memik is an Associate Professor at the Electrical Engineering and Computer Science Department of Northwestern University, Illinois, where her research interests include thermal-aware design and management of high performance systems, embedded and reconfigurable computing, and thermal sensing technologies. Dr Ogrenci-Memik has served as technical program chair, committee member, organizing committee member, and track chair of several conferences, including ICCAD, DAC, DATE, EUC, FPL, GLSVLSI, and ISVLSI and she has served on the Editorial Board of IEEE Transactions on VLSI.

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