Global Bonding Wire packaging material market 2016-2020

  • ID: 3769392
  • Report
  • Region: Global
  • 58 pages
  • TechNavio
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FEATURED COMPANIES

  • AMETEK
  • California Fine Wire
  • EMMTECH
  • Heraeus Deutschland
  • Inseto
  • MK Electron
  • MORE
About the Bonding Wire Packaging Material Market

Bonding wires can be made up of gold, copper, silver, and aluminum. The diameter of the wire ranges from 15 micrometer to several hundred micro-meters for high-powered applications. Bonding wires made of gold dominated the bonding wire packaging material market for decades. However, the industry is shifting toward the use of copper and other materials, which include silver as the new addition since 2010. The market share of gold in terms of volume used for bonding wire was more than 95% in 2007 and dropped to 40% in 2015 due to rising prices of gold. The remaining volume was replaced by copper and silver in 2015.

The analysts forecast the global bonding wire packaging material market will generate revenues of USD 2.9 billion in 2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global bonding wire packaging material market for 2016-2020. To calculate the market size, the report considers revenue generated from the consumption of bonding wires for packaging materials.

The market is divided into the following segments based on geography:

- APAC
- Europe
- North America
- ROW

The report, Global Bonding Wire Packaging Material Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- TANAKA Precious Metals
- Heraeus Deutschland
- California Fine Wire
- MK Electron

Other prominent vendors
- AMETEK
- EMMTECH
- Inseto
- Palomar Technologies
- RED Micro Wire
- SHINKAWA
- Sumitomo Metal Mining
- Tatsuta Electric Wire & Cable

Market drivers
- Rising need for miniaturization

Market challenges
- Migration to flip chip packaging technology

Market trends
- Migration to smaller diameter wires

Key questions answered in this report
- What will the market size be in 2020 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • AMETEK
  • California Fine Wire
  • EMMTECH
  • Heraeus Deutschland
  • Inseto
  • MK Electron
  • MORE
PART 01: Executive summary
  • Highlights
PART 02: Scope of the report
  • Definition
  • Source year and forecast period
  • Market coverage
  • Market size computation
  • Market segmentation
  • Geographical coverage
  • Vendor segmentation
  • Common currency conversion rates
  • Top vendor offerings
PART 03: Market research methodology
  • Research methodology
  • Economic indicators
PART 04: Introduction
  • Key market highlights
PART 05: Market landscape
  • Global semiconductor market overview
  • Wafer-level manufacturing equipment categories
  • Market overview
  • Market size and forecast
  • Five forces analysis
PART 06: Market segmentation by material type
  • Global bonding wire packaging material market by material type 2015
  • Global bonding wire packaging material market by material type 2020
  • Global bonding wire packaging material market by gold
  • Global bonding wire packaging material market by PCC
  • Global bonding wire packaging material market by copper
  • Global bonding wire packaging material market by silver
PART 07: Geographical segmentation
  • Global bonding wire packaging material market by geography 2015
  • Global bonding wire packaging material market by geography 2020
  • APAC
  • North America
  • Europe
  • ROW
PART 08: Key leading countries
  • Key leading countries in global bonding wire packaging material market
PART 09: Summary of key figures

PART 10: Market drivers
  • Growing transition to copper wire
  • Rising need for miniaturized semiconductor devices
PART 11: Impact of drivers

PART 12: Market challenges
  • Limitations of copper wire
  • Migration to flip chip packaging technology
PART 13: Impact of drivers and challenges

PART 14: Market trends
  • Silver bonding wire as upcoming alternative
  • Migration to smaller diameter wires
PART 15: Vendor landscape
  • Competitive scenario
  • Other prominent vendors
PART 16: Appendix
  • List of abbreviations
PART 17: About the Author

List of Exhbitis

Exhibit 01: Segmentation of global bonding wire packaging material market
Exhibit 02: Key regions
Exhibit 03: Common currency conversion rates
Exhibit 04: Product offerings
Exhibit 05: Chemical composition of semiconductor materials
Exhibit 06: Top ten semiconductor vendors 2015
Exhibit 07: Global semiconductor market structure 2015
Exhibit 08: Global semiconductor market structure 2015
Exhibit 09: Global semiconductor market trend 1990-2015 ($ billions)
Exhibit 10: Semiconductor IC manufacturing process
Exhibit 11: Front-end chip formation steps
Exhibit 12: Back-end chip formation steps
Exhibit 13: Wafer-level manufacturing equipment categories
Exhibit 14: Requirements of manufacturing equipment
Exhibit 15: Semiconductor industry value chain
Exhibit 16: Global bonding wire packaging material market 2015-2020 ($ billions)
Exhibit 17: Five forces analysis
Exhibit 18: Global bonding wire packaging material market by material type 2015
Exhibit 19: Global bonding wire packaging material market by material type in 2020
Exhibit 20: Global bonding wire packaging material market by gold ($ millions)
Exhibit 21: Global bonding wire packaging material market by PCC ($ billions)
Exhibit 22: Global bonding wire packaging material market by copper ($ millions)
Exhibit 23: Global bonding wire packaging material market by silver ($ millions)
Exhibit 24: Segmentation of silver wire application
Exhibit 25: Global bonding wire packaging material market by geography 2015
Exhibit 26: Global bonding wire packaging material market by geography 2020
Exhibit 27: Bonding wire packaging material market in APAC 2015-2020 ($ billions)
Exhibit 28: Bonding wire packaging material market in North America 2015-2020 ($ millions)
Exhibit 29: Bonding wire packaging material market in Europe 2015-2020 ($ millions)
Exhibit 30: Bonding wire packaging material market in ROW 2015-2020 ($ millions)
Exhibit 31: Key leading countries in global bonding wire packaging material market 2015
Exhibit 32: Key leading countries in global bonding wire packaging material market 2020
Exhibit 33: Material-type segments: Year-over-year revenue comparison ($ millions)
Exhibit 34: Geographical segments: Year-over-year revenue comparison ($ millions)
Exhibit 35: Impact of drivers
Exhibit 36: Impact of drivers and challenges
Exhibit 37: Other prominent vendors
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • AMETEK
  • California Fine Wire
  • EMMTECH
  • Heraeus Deutschland
  • Inseto
  • MK Electron
  • MORE
New Report Released: - Global Bonding Wire Packaging Material Market 2016-2020

The author of the report recognizes the following companies as the key players in the global bonding wire packaging material market: TANAKA Precious Metals, Heraeus Deutschland, California Fine Wire, and MK Electron.

Other Prominent Vendors in the market are: AMETEK, EMMTECH, Inseto, Palomar Technologies, RED Micro Wire, SHINKAWA, Sumitomo Metal Mining, and Tatsuta Electric Wire & Cable.

Commenting on the report, an analyst from the research team said: “One trend which will boost market growth is the migration to smaller diameter wires. The semiconductor industry is constantly evolving amid rapid advances in technology and miniaturization, which will lead to bonding wires with smaller diameters. Reduction in wire diameter is an effective way to reduce costs in the bonding wire packaging material market, as gold content accounts for the majority of bonding wire expense.”

According to the report, a key growth driver is the rising need for miniaturization. The increasing demand for miniaturization in the semiconductor industry has made bonding wires an important part of electronic assemblies. Fine and ultrafine bonding wires of gold, aluminum, copper, and palladium are used for the production of bonding wires. The uniformity of the wires with quality is in high demand. Vendors need to constantly upgrade their offerings with more advanced and compact packaging materials, such as bonding wires with smaller diameters, to cater to consumer requirements.

Further, the report states that one challenge that could impact market growth is the migration to flip chip packaging technology. A flip chip eliminates the primary technical limitations of wire bonding by providing an area-array interconnect and reducing interconnect inductance, which helps in higher frequency performance.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Note: Product cover images may vary from those shown
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- TANAKA Precious Metals
- Heraeus Deutschland
- California Fine Wire
- MK Electron
- AMETEK
- EMMTECH
- Inseto
- Palomar Technologies
- RED Micro Wire
- SHINKAWA
- Sumitomo Metal Mining
- Tatsuta Electric Wire & Cable.
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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