Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers.
Part I: Introduction
1. Data center architectures
2. Optical interconnects: Fundamentals
3. Key requirements for optical interconnects within data centers
Part II: Materials and Components
4. Indium phosphide (InP) for optical interconnects
5. Photonic crystal cavities for optical interconnects
6. Types and performance of high performing multi-mode polymer waveguides for optical interconnects
7. Design and fabrication of multimode polymer waveguides for optical interconnects
8. Silicon photonics for multi-mode transmission
9. Scalable three-dimensional optical interconnects for data centers
10. Electronic drivers/TIAs for optical interconnects
Part III: Circuit Boards
11. Electrical and photonic off-chip interconnection and system integration
12. Electro-optical circuit boards with single- or multi-mode optical interconnects
13. International and industrial standardization of optical circuit board technologies
14. Requirements for process automation of optical interconnect technologies
Part IV: Using Optical Interconnects to Improve Network Architectures in Data Centers
15. The role of optical interconnects in the design of data center architectures
Tolga Tekin received the Ph.D. degree in electrical engineering and computer science from the Technical University of Berlin, Berlin, Germany, in 2004. He was a Research Scientist with the Optical Signal Processing Department, Fraunhofer HHI, where he was engaged in advanced research on optical signal processing, 3R-regeneration, all-optical switching, clock recovery, and integrated optics. He was a Postdoctoral Researcher on components for O-CDMA and terabit routers with the University of California. He worked at Teles AG on phased-array antennas and their components for skyDSL. At the Fraunhofer Institute for Reliability and Microintegration (IZM) and at Technical University of Berlin, he then led projects on microsystems, 3-D heterogeneous integration, optical interconnects and silicon photonics packaging. He is engaged in photonic integrated system-in-package, millimeter-wave photonics, photonic interconnects and 5G research activities. He is group manager of Photonics and Plasmonics Systems in the System Integration and Interconnection Technologies Department at Fraunhofer IZM. He is coordinator of European flagship project 'PhoxTroT' on optical interconnects for data centers. He is Senior Member of IEEE and co-chair of 'Photonics - Communication, Sensing, Lighting' Technical Committee in the IEEE Components, Packaging and Manufacturing Technology Society.
Nikos Pleros Lecturer, Department of Informatics, Aristotle University of Thessaloniki, Greece.
Nikos Pleros is a Lecturer at the Department of Informatics (CSD), Aristotle University of Thessaloniki (AUTH), Greece, since September 2007 and a collaborative faculty member at the Information Technologies Institute, Center for Research and Technology Hellas (CERTH).
Richard Pitwon Lead Photonics Engineer, Seagate Technology, UK.
Richard Pitwon is Leader of Photonics Research and Development group at Seagate Systems responsible for design and development of advanced embedded photonic interconnect solutions for future Cloud and Exascale data centre architectures.
Andreas Hakansson Project Manager, Fraunhofer IZM, Germany.
Andreas Hakansson is a Researcher at Fraunhofer Institute for Reliability and Microintegration IZM · Department of System Integration and Interconnection Technologies (SIIT) · Photonic & Plasmonic Systems, Germany