The global thermal interface material market was valued at $4.7 billion in 2021, and is projected to reach $10.8 billion by 2031, growing at a CAGR of 8.8% from 2022 to 2031.
Thermal interface materials (TIMs) are a group of thermal management products that are applied between two interface surfaces or components in order to improve the thermal coupling. Thermal grease, thermal adhesives, gap filler, phase change materials, and thermal pads are types of thermal interface materials available in the market.
Combination of conductive filler and silicone-free thermal greases are gaining importance across the electronic sector, as this type of thermal grease offers improved thermal management. Thermal grease tends to spread out as a thin layer after application across flat surfaces. Formation of thin layer over two electronic flat surfaces ensures minimal thermal resistance between the applied surface that further offers proper thermal management. In addition, use of mounting hardware and spring forces during application of thermal greases increases thermal management characteristics of the grease. Other applications of thermal grease include CPUs & GPUs, industrial electronics, and energy & power. CPUs and GPUs processing power mainly depends upon thermal density and proper thermal management between processors and air voids. Remote heat pipes, heat sink assemblies, liquid cooling loops, and liquid cold plates are crucial parts used in CPUs and GPUs. These parts require proper thermal management in order to ensure maximum processor power. Use of thermal greases between heat pipe, heat sink assemblies, liquid cooling loops, and liquid cold plates aids thermal density and augments the processing power of CPUs and GPUs. All these factors are driving the demand of the global market.
Thermal pads, thermal grease, thermal adhesive, and phase change materials are widely used thermal interface materials. However, there are certain limitations associated with use of thermal interface materials across pre-defined applications. For instance, thermal pads are used to fill the large voids between the heat sink and its components. However, the production process of thermal pads intended to be used across miniature devices is restricted. In addition, high costs associated with use of thermal pad across most demanding applications hampers the market growth.
On the contrary, adhesives or thermal conductive adhesives are formulated to offer proper thermal management in heat-generating components. In addition, this thermal interface material serves as a bonding product between two electronic parts. Thermally conductive adhesives are mainly used for facilitating thermal management and removing the use of space-restrictive mechanical fasteners. Strong bond between heat sinks and electronic components is crucial, as it reduces the use of screws and clips. Thermally conductive adhesives are strong adhesion products used for effective thermal management and adhesion of electronic components. Pad, liquid, and laminates are different thermal conductive adhesive forms available in the market.
Adhesive thermal interface material is proven to offer reliable, long-lasting bonding capability, and effective heat dissipation in electronic devices, which drives the demand of the global market. Film form of thermal conductive adhesives are used for large surface area bonding and thermal management in complex electronic parts. This thermal interface material (TIM) can form void-free bond-lines owing to its uniform structure, which make it ideal TIM across the electronics industry. Heat sinks and heat-sensitive electronic components require the use of mechanical fasteners and clips. Thermally conductive adhesives are ideal for mounting heat-sensitive electronic components and heat sinks to printed circuit boards. Conductive adhesives serve as multi-functional thermal interface material and eliminate use of traditional mechanical fasteners & clips. Thus, there is growing demand for thermally conductive adhesives across the electronics industry. All these factors are expected to offer new growth opportunities in the global thermal interface material market.
The thermal interface material market analysis is segmented on the basis of type, application, and region. By type, the market is divided into greases & adhesives, tapes & films, gap filler metallic TIMs, phase change materials, and others. The applications covered in the report include computers, telecom, medical devices, industrial machinery, consumer durables, and automotive electronics. By region, the global thermal interface material market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
Key players of the thermal interface material industry include Laird Technologies Inc., DuPont, Honeywell International Inc. (Honeywell), Henkel Corporation, Zalman, 3M, Indium Corporation, Wakefield Thermal Solutions, Inc., Parker-Hannifin Corporation, and Momentive.
Thermal interface materials (TIMs) are a group of thermal management products that are applied between two interface surfaces or components in order to improve the thermal coupling. Thermal grease, thermal adhesives, gap filler, phase change materials, and thermal pads are types of thermal interface materials available in the market.
Combination of conductive filler and silicone-free thermal greases are gaining importance across the electronic sector, as this type of thermal grease offers improved thermal management. Thermal grease tends to spread out as a thin layer after application across flat surfaces. Formation of thin layer over two electronic flat surfaces ensures minimal thermal resistance between the applied surface that further offers proper thermal management. In addition, use of mounting hardware and spring forces during application of thermal greases increases thermal management characteristics of the grease. Other applications of thermal grease include CPUs & GPUs, industrial electronics, and energy & power. CPUs and GPUs processing power mainly depends upon thermal density and proper thermal management between processors and air voids. Remote heat pipes, heat sink assemblies, liquid cooling loops, and liquid cold plates are crucial parts used in CPUs and GPUs. These parts require proper thermal management in order to ensure maximum processor power. Use of thermal greases between heat pipe, heat sink assemblies, liquid cooling loops, and liquid cold plates aids thermal density and augments the processing power of CPUs and GPUs. All these factors are driving the demand of the global market.
Thermal pads, thermal grease, thermal adhesive, and phase change materials are widely used thermal interface materials. However, there are certain limitations associated with use of thermal interface materials across pre-defined applications. For instance, thermal pads are used to fill the large voids between the heat sink and its components. However, the production process of thermal pads intended to be used across miniature devices is restricted. In addition, high costs associated with use of thermal pad across most demanding applications hampers the market growth.
On the contrary, adhesives or thermal conductive adhesives are formulated to offer proper thermal management in heat-generating components. In addition, this thermal interface material serves as a bonding product between two electronic parts. Thermally conductive adhesives are mainly used for facilitating thermal management and removing the use of space-restrictive mechanical fasteners. Strong bond between heat sinks and electronic components is crucial, as it reduces the use of screws and clips. Thermally conductive adhesives are strong adhesion products used for effective thermal management and adhesion of electronic components. Pad, liquid, and laminates are different thermal conductive adhesive forms available in the market.
Adhesive thermal interface material is proven to offer reliable, long-lasting bonding capability, and effective heat dissipation in electronic devices, which drives the demand of the global market. Film form of thermal conductive adhesives are used for large surface area bonding and thermal management in complex electronic parts. This thermal interface material (TIM) can form void-free bond-lines owing to its uniform structure, which make it ideal TIM across the electronics industry. Heat sinks and heat-sensitive electronic components require the use of mechanical fasteners and clips. Thermally conductive adhesives are ideal for mounting heat-sensitive electronic components and heat sinks to printed circuit boards. Conductive adhesives serve as multi-functional thermal interface material and eliminate use of traditional mechanical fasteners & clips. Thus, there is growing demand for thermally conductive adhesives across the electronics industry. All these factors are expected to offer new growth opportunities in the global thermal interface material market.
The thermal interface material market analysis is segmented on the basis of type, application, and region. By type, the market is divided into greases & adhesives, tapes & films, gap filler metallic TIMs, phase change materials, and others. The applications covered in the report include computers, telecom, medical devices, industrial machinery, consumer durables, and automotive electronics. By region, the global thermal interface material market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
Key players of the thermal interface material industry include Laird Technologies Inc., DuPont, Honeywell International Inc. (Honeywell), Henkel Corporation, Zalman, 3M, Indium Corporation, Wakefield Thermal Solutions, Inc., Parker-Hannifin Corporation, and Momentive.
Key Benefits For Stakeholders
- This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the thermal interface material market analysis from 2021 to 2031 to identify the prevailing thermal interface material market opportunities.
- The market research is offered along with information related to key drivers, restraints, and opportunities.
- Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
- In-depth analysis of the thermal interface material market segmentation assists to determine the prevailing market opportunities.
- Major countries in each region are mapped according to their revenue contribution to the global market.
- Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
- The report includes the analysis of the regional as well as global thermal interface material market trends, key players, market segments, application areas, and market growth strategies.
Key Market Segments
By Type
- Tapes and Films
- Gap Fillers Metallic TIMs
- Phase Change Materials
- Others
- Greases and Adhesives
By Application
- Computers
- Telecom
- Medical Devices
- Industrial Machinery
- Consumer Durables
- Automotive Electronics
By Region
- North America
- U.S.
- Canada
- Mexico
- Europe
- Germany
- UK
- France
- Spain
- Italy
- Rest of Europe
- Asia-Pacific
- China
- India
- Japan
- South Korea
- Australia
- Rest of Asia-Pacific
- LAMEA
- Brazil
- Saudi Arabia
- South Africa
- Rest of LAMEA
Key Market Players
- Laird Technologies Inc.
- DuPont
- Honeywell International Inc.
- Henkel Corporation
- Zalman
- 3M
- Indium Corporation
- Wakefield Thermal, Inc.
- Parker Hannifin Corporation
- Momentive
Table of Contents
CHAPTER 1: INTRODUCTION1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research Methodology
1.4.1. Secondary research
1.4.2. Primary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. Key findings of the study
2.2. CXO Perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top investment pockets
3.3. Porter’s five forces analysis
3.4. Market dynamics
3.4.1. Drivers
3.4.1.1. Growing demand for thermal interface materials for miniature device packaging
3.4.1.2. Growing demand for thermal interface materials in automotive electronics
3.4.2. Restraints
3.4.2.1. Disadvantages associated with use of thermal interface materials
3.4.3. Opportunities
3.4.3.1. Growing demand for thermal interface materials in medical electronics
3.5. COVID-19 Impact Analysis on the market
3.6. Value Chain Analysis
3.7. Key Regulation Analysis
3.8. Patent Landscape
3.9. Regulatory Guidelines
CHAPTER 4: THERMAL INTERFACE MATERIAL MARKET, BY TYPE
4.1 Overview
4.1.1 Market size and forecast
4.2. Greases and Adhesives
4.2.1 Key market trends, growth factors and opportunities
4.2.2 Market size and forecast, by region
4.2.3 Market share analysis by country
4.3. Tapes and Films
4.3.1 Key market trends, growth factors and opportunities
4.3.2 Market size and forecast, by region
4.3.3 Market share analysis by country
4.4. Gap Fillers Metallic TIMs
4.4.1 Key market trends, growth factors and opportunities
4.4.2 Market size and forecast, by region
4.4.3 Market share analysis by country
4.5. Phase Change Materials
4.5.1 Key market trends, growth factors and opportunities
4.5.2 Market size and forecast, by region
4.5.3 Market share analysis by country
4.6. Others
4.6.1 Key market trends, growth factors and opportunities
4.6.2 Market size and forecast, by region
4.6.3 Market share analysis by country
CHAPTER 5: THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION
5.1 Overview
5.1.1 Market size and forecast
5.2. Computers
5.2.1 Key market trends, growth factors and opportunities
5.2.2 Market size and forecast, by region
5.2.3 Market share analysis by country
5.3. Telecom
5.3.1 Key market trends, growth factors and opportunities
5.3.2 Market size and forecast, by region
5.3.3 Market share analysis by country
5.4. Medical Devices
5.4.1 Key market trends, growth factors and opportunities
5.4.2 Market size and forecast, by region
5.4.3 Market share analysis by country
5.5. Industrial Machinery
5.5.1 Key market trends, growth factors and opportunities
5.5.2 Market size and forecast, by region
5.5.3 Market share analysis by country
5.6. Consumer Durables
5.6.1 Key market trends, growth factors and opportunities
5.6.2 Market size and forecast, by region
5.6.3 Market share analysis by country
5.7. Automotive Electronics
5.7.1 Key market trends, growth factors and opportunities
5.7.2 Market size and forecast, by region
5.7.3 Market share analysis by country
CHAPTER 6: THERMAL INTERFACE MATERIAL MARKET, BY REGION
6.1 Overview
6.1.1 Market size and forecast
6.2 North America
6.2.1 Key trends and opportunities
6.2.2 North America Market size and forecast, by Type
6.2.3 North America Market size and forecast, by Application
6.2.4 North America Market size and forecast, by country
6.2.4.1 U.S.
6.2.4.1.1 Key market trends, growth factors and opportunities
6.2.4.1.2 Market size and forecast, by Type
6.2.4.1.3 Market size and forecast, by Application
6.2.4.2 Canada
6.2.4.2.1 Key market trends, growth factors and opportunities
6.2.4.2.2 Market size and forecast, by Type
6.2.4.2.3 Market size and forecast, by Application
6.2.4.3 Mexico
6.2.4.3.1 Key market trends, growth factors and opportunities
6.2.4.3.2 Market size and forecast, by Type
6.2.4.3.3 Market size and forecast, by Application
6.3 Europe
6.3.1 Key trends and opportunities
6.3.2 Europe Market size and forecast, by Type
6.3.3 Europe Market size and forecast, by Application
6.3.4 Europe Market size and forecast, by country
6.3.4.1 Germany
6.3.4.1.1 Key market trends, growth factors and opportunities
6.3.4.1.2 Market size and forecast, by Type
6.3.4.1.3 Market size and forecast, by Application
6.3.4.2 UK
6.3.4.2.1 Key market trends, growth factors and opportunities
6.3.4.2.2 Market size and forecast, by Type
6.3.4.2.3 Market size and forecast, by Application
6.3.4.3 France
6.3.4.3.1 Key market trends, growth factors and opportunities
6.3.4.3.2 Market size and forecast, by Type
6.3.4.3.3 Market size and forecast, by Application
6.3.4.4 Spain
6.3.4.4.1 Key market trends, growth factors and opportunities
6.3.4.4.2 Market size and forecast, by Type
6.3.4.4.3 Market size and forecast, by Application
6.3.4.5 Italy
6.3.4.5.1 Key market trends, growth factors and opportunities
6.3.4.5.2 Market size and forecast, by Type
6.3.4.5.3 Market size and forecast, by Application
6.3.4.6 Rest of Europe
6.3.4.6.1 Key market trends, growth factors and opportunities
6.3.4.6.2 Market size and forecast, by Type
6.3.4.6.3 Market size and forecast, by Application
6.4 Asia-Pacific
6.4.1 Key trends and opportunities
6.4.2 Asia-Pacific Market size and forecast, by Type
6.4.3 Asia-Pacific Market size and forecast, by Application
6.4.4 Asia-Pacific Market size and forecast, by country
6.4.4.1 China
6.4.4.1.1 Key market trends, growth factors and opportunities
6.4.4.1.2 Market size and forecast, by Type
6.4.4.1.3 Market size and forecast, by Application
6.4.4.2 India
6.4.4.2.1 Key market trends, growth factors and opportunities
6.4.4.2.2 Market size and forecast, by Type
6.4.4.2.3 Market size and forecast, by Application
6.4.4.3 Japan
6.4.4.3.1 Key market trends, growth factors and opportunities
6.4.4.3.2 Market size and forecast, by Type
6.4.4.3.3 Market size and forecast, by Application
6.4.4.4 South Korea
6.4.4.4.1 Key market trends, growth factors and opportunities
6.4.4.4.2 Market size and forecast, by Type
6.4.4.4.3 Market size and forecast, by Application
6.4.4.5 Australia
6.4.4.5.1 Key market trends, growth factors and opportunities
6.4.4.5.2 Market size and forecast, by Type
6.4.4.5.3 Market size and forecast, by Application
6.4.4.6 Rest of Asia-Pacific
6.4.4.6.1 Key market trends, growth factors and opportunities
6.4.4.6.2 Market size and forecast, by Type
6.4.4.6.3 Market size and forecast, by Application
6.5 LAMEA
6.5.1 Key trends and opportunities
6.5.2 LAMEA Market size and forecast, by Type
6.5.3 LAMEA Market size and forecast, by Application
6.5.4 LAMEA Market size and forecast, by country
6.5.4.1 Brazil
6.5.4.1.1 Key market trends, growth factors and opportunities
6.5.4.1.2 Market size and forecast, by Type
6.5.4.1.3 Market size and forecast, by Application
6.5.4.2 Saudi Arabia
6.5.4.2.1 Key market trends, growth factors and opportunities
6.5.4.2.2 Market size and forecast, by Type
6.5.4.2.3 Market size and forecast, by Application
6.5.4.3 South Africa
6.5.4.3.1 Key market trends, growth factors and opportunities
6.5.4.3.2 Market size and forecast, by Type
6.5.4.3.3 Market size and forecast, by Application
6.5.4.4 Rest of LAMEA
6.5.4.4.1 Key market trends, growth factors and opportunities
6.5.4.4.2 Market size and forecast, by Type
6.5.4.4.3 Market size and forecast, by Application
CHAPTER 7: COMPETITIVE LANDSCAPE
7.1. Introduction
7.2. Top winning strategies
7.3. Product Mapping of Top 10 Player
7.4. Competitive Dashboard
7.5. Competitive Heatmap
7.6. Top player positioning, 2021
CHAPTER 8: COMPANY PROFILES
8.1 Laird Technologies Inc.
8.1.1 Company overview
8.1.2 Key Executives
8.1.3 Company snapshot
8.1.4 Operating business segments
8.1.5 Product portfolio
8.1.6 Business performance
8.1.7 Key strategic moves and developments
8.2 DuPont
8.2.1 Company overview
8.2.2 Key Executives
8.2.3 Company snapshot
8.2.4 Operating business segments
8.2.5 Product portfolio
8.2.6 Business performance
8.2.7 Key strategic moves and developments
8.3 Honeywell International Inc.
8.3.1 Company overview
8.3.2 Key Executives
8.3.3 Company snapshot
8.3.4 Operating business segments
8.3.5 Product portfolio
8.3.6 Business performance
8.3.7 Key strategic moves and developments
8.4 Henkel Corporation
8.4.1 Company overview
8.4.2 Key Executives
8.4.3 Company snapshot
8.4.4 Operating business segments
8.4.5 Product portfolio
8.4.6 Business performance
8.4.7 Key strategic moves and developments
8.5 Zalman
8.5.1 Company overview
8.5.2 Key Executives
8.5.3 Company snapshot
8.5.4 Operating business segments
8.5.5 Product portfolio
8.5.6 Business performance
8.5.7 Key strategic moves and developments
8.6 3M
8.6.1 Company overview
8.6.2 Key Executives
8.6.3 Company snapshot
8.6.4 Operating business segments
8.6.5 Product portfolio
8.6.6 Business performance
8.6.7 Key strategic moves and developments
8.7 Indium Corporation
8.7.1 Company overview
8.7.2 Key Executives
8.7.3 Company snapshot
8.7.4 Operating business segments
8.7.5 Product portfolio
8.7.6 Business performance
8.7.7 Key strategic moves and developments
8.8 Wakefield Thermal, Inc.
8.8.1 Company overview
8.8.2 Key Executives
8.8.3 Company snapshot
8.8.4 Operating business segments
8.8.5 Product portfolio
8.8.6 Business performance
8.8.7 Key strategic moves and developments
8.9 Parker Hannifin Corporation
8.9.1 Company overview
8.9.2 Key Executives
8.9.3 Company snapshot
8.9.4 Operating business segments
8.9.5 Product portfolio
8.9.6 Business performance
8.9.7 Key strategic moves and developments
8.10 Momentive
8.10.1 Company overview
8.10.2 Key Executives
8.10.3 Company snapshot
8.10.4 Operating business segments
8.10.5 Product portfolio
8.10.6 Business performance
8.10.7 Key strategic moves and developments
List of Tables
Table 1. Global Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 2. Thermal Interface Material Market for Greases and Adhesives, by Region, 2021-2031 (Revenue, $Million)
Table 3. Thermal Interface Material Market for Tapes and Films, by Region, 2021-2031 (Revenue, $Million)
Table 4. Thermal Interface Material Market for Gap Fillers Metallic Tims, by Region, 2021-2031 (Revenue, $Million)
Table 5. Thermal Interface Material Market for Phase Change Materials, by Region, 2021-2031 (Revenue, $Million)
Table 6. Thermal Interface Material Market for Others, by Region, 2021-2031 (Revenue, $Million)
Table 7. Global Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 8. Thermal Interface Material Market for Computers, by Region, 2021-2031 (Revenue, $Million)
Table 9. Thermal Interface Material Market for Telecom, by Region, 2021-2031 (Revenue, $Million)
Table 10. Thermal Interface Material Market for Medical Devices, by Region, 2021-2031 (Revenue, $Million)
Table 11. Thermal Interface Material Market for Industrial Machinery, by Region, 2021-2031 (Revenue, $Million)
Table 12. Thermal Interface Material Market for Consumer Durables, by Region, 2021-2031 (Revenue, $Million)
Table 13. Thermal Interface Material Market for Automotive Electronics, by Region, 2021-2031 (Revenue, $Million)
Table 14. Thermal Interface Material Market, by Region, 2021-2031 (Revenue, $Million)
Table 15. North America Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 16. North America Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 17. North America Thermal Interface Material Market, by Country, 2021-2031 (Revenue, $Million)
Table 18. U.S. Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 19. U.S. Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 20. Canada Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 21. Canada Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 22. Mexico Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 23. Mexico Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 24. Europe Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 25. Europe Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 26. Europe Thermal Interface Material Market, by Country, 2021-2031 (Revenue, $Million)
Table 27. Germany Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 28. Germany Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 29. UK Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 30. UK Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 31. France Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 32. France Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 33. Spain Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 34. Spain Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 35. Italy Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 36. Italy Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 37. Rest of Europe Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 38. Rest of Europe Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 39. Asia-Pacific Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 40. Asia-Pacific Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 41. Asia-Pacific Thermal Interface Material Market, by Country, 2021-2031 (Revenue, $Million)
Table 42. China Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 43. China Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 44. India Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 45. India Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 46. Japan Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 47. Japan Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 48. South Korea Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 49. South Korea Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 50. Australia Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 51. Australia Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 52. Rest of Asia-Pacific Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 53. Rest of Asia-Pacific Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 54. LAMEA Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 55. LAMEA Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 56. LAMEA Thermal Interface Material Market, by Country, 2021-2031 (Revenue, $Million)
Table 57. Brazil Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 58. Brazil Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 59. Saudi Arabia Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 60. Saudi Arabia Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 61. South Africa Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 62. South Africa Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 63. Rest of LAMEA Thermal Interface Material Market, by Type, 2021-2031 (Revenue, $Million)
Table 64. Rest of LAMEA Thermal Interface Material Market, by Application, 2021-2031 (Revenue, $Million)
Table 65. Laird Technologies Inc.: Key Executives
Table 66. Laird Technologies Inc.: Company Snapshot
Table 67. Laird Technologies Inc.: Operating Segments
Table 68. Laird Technologies Inc.: Product Portfolio
Table 69. Laird Technologies Inc.: Net Sales
Table 70. Laird Technologies Inc.: Key Stratergies
Table 71. Dupont: Key Executives
Table 72. Dupont: Company Snapshot
Table 73. Dupont: Operating Segments
Table 74. Dupont: Product Portfolio
Table 75. Dupont: Net Sales
Table 76. Dupont: Key Stratergies
Table 77. Honeywell International Inc.: Key Executives
Table 78. Honeywell International Inc.: Company Snapshot
Table 79. Honeywell International Inc.: Operating Segments
Table 80. Honeywell International Inc.: Product Portfolio
Table 81. Honeywell International Inc.: Net Sales
Table 82. Honeywell International Inc.: Key Stratergies
Table 83. Henkel Corporation: Key Executives
Table 84. Henkel Corporation: Company Snapshot
Table 85. Henkel Corporation: Operating Segments
Table 86. Henkel Corporation: Product Portfolio
Table 87. Henkel Corporation: Net Sales
Table 88. Henkel Corporation: Key Stratergies
Table 89. Zalman: Key Executives
Table 90. Zalman: Company Snapshot
Table 91. Zalman: Operating Segments
Table 92. Zalman: Product Portfolio
Table 93. Zalman: Net Sales
Table 94. Zalman: Key Stratergies
Table 95. 3M: Key Executives
Table 96. 3M: Company Snapshot
Table 97. 3M: Operating Segments
Table 98. 3M: Product Portfolio
Table 99. 3M: Net Sales
Table 100. 3M: Key Stratergies
Table 101. Indium Corporation: Key Executives
Table 102. Indium Corporation: Company Snapshot
Table 103. Indium Corporation: Operating Segments
Table 104. Indium Corporation: Product Portfolio
Table 105. Indium Corporation: Net Sales
Table 106. Indium Corporation: Key Stratergies
Table 107. Wakefield Thermal, Inc.: Key Executives
Table 108. Wakefield Thermal, Inc.: Company Snapshot
Table 109. Wakefield Thermal, Inc.: Operating Segments
Table 110. Wakefield Thermal, Inc.: Product Portfolio
Table 111. Wakefield Thermal, Inc.: Net Sales
Table 112. Wakefield Thermal, Inc.: Key Stratergies
Table 113. Parker Hannifin Corporation: Key Executives
Table 114. Parker Hannifin Corporation: Company Snapshot
Table 115. Parker Hannifin Corporation: Operating Segments
Table 116. Parker Hannifin Corporation: Product Portfolio
Table 117. Parker Hannifin Corporation: Net Sales
Table 118. Parker Hannifin Corporation: Key Stratergies
Table 119. Momentive: Key Executives
Table 120. Momentive: Company Snapshot
Table 121. Momentive: Operating Segments
Table 122. Momentive: Product Portfolio
Table 123. Momentive: Net Sales
Table 124. Momentive: Key Stratergies
List of Figures
Figure 1. Segmentation of Thermal Interface Material Market, 2021-2031
Figure 2. Thermal Interface Material Market, 2021-2031
Figure 3. Top Investment Pockets, by Region
Figure 4. Porter Five-1
Figure 5. Porter Five-2
Figure 6. Porter Five-3
Figure 7. Porter Five-4
Figure 8. Porter Five-5
Figure 9. Thermal Interface Material Market: Drivers, Restraints and Opportunities
Figure 10. Value Chain Analysis
Figure 11. Key Regulation Analysis
Figure 12. Patent Analysis by Company
Figure 13. Patent Analysis by Country
Figure 14. Regulatory Guidelines
Figure 15. Thermal Interface Material Market, by Type, 2021 (%)
Figure 16. Comparative Share Analysis of Greases and Adhesives Thermal Interface Material Market, 2021 and 2031 (%)
Figure 17. Comparative Share Analysis of Tapes and Films Thermal Interface Material Market, 2021 and 2031 (%)
Figure 18. Comparative Share Analysis of Gap Fillers Metallic Tims Thermal Interface Material Market, 2021 and 2031 (%)
Figure 19. Comparative Share Analysis of Phase Change Materials Thermal Interface Material Market, 2021 and 2031 (%)
Figure 20. Comparative Share Analysis of Others Thermal Interface Material Market, 2021 and 2031 (%)
Figure 21. Thermal Interface Material Market, by Application, 2021 (%)
Figure 22. Comparative Share Analysis of Computers Thermal Interface Material Market, 2021 and 2031 (%)
Figure 23. Comparative Share Analysis of Telecom Thermal Interface Material Market, 2021 and 2031 (%)
Figure 24. Comparative Share Analysis of Medical Devices Thermal Interface Material Market, 2021 and 2031 (%)
Figure 25. Comparative Share Analysis of Industrial Machinery Thermal Interface Material Market, 2021 and 2031 (%)
Figure 26. Comparative Share Analysis of Consumer Durables Thermal Interface Material Market, 2021 and 2031 (%)
Figure 27. Comparative Share Analysis of Automotive Electronics Thermal Interface Material Market, 2021 and 2031 (%)
Figure 28. Thermal Interface Material Market by Region, 2021
Figure 29. U.S. Thermal Interface Material Market, 2021-2031 ($Million)
Figure 30. Canada Thermal Interface Material Market, 2021-2031 ($Million)
Figure 31. Mexico Thermal Interface Material Market, 2021-2031 ($Million)
Figure 32. Germany Thermal Interface Material Market, 2021-2031 ($Million)
Figure 33. UK Thermal Interface Material Market, 2021-2031 ($Million)
Figure 34. France Thermal Interface Material Market, 2021-2031 ($Million)
Figure 35. Spain Thermal Interface Material Market, 2021-2031 ($Million)
Figure 36. Italy Thermal Interface Material Market, 2021-2031 ($Million)
Figure 37. Rest of Europe Thermal Interface Material Market, 2021-2031 ($Million)
Figure 38. China Thermal Interface Material Market, 2021-2031 ($Million)
Figure 39. India Thermal Interface Material Market, 2021-2031 ($Million)
Figure 40. Japan Thermal Interface Material Market, 2021-2031 ($Million)
Figure 41. South Korea Thermal Interface Material Market, 2021-2031 ($Million)
Figure 42. Australia Thermal Interface Material Market, 2021-2031 ($Million)
Figure 43. Rest of Asia-Pacific Thermal Interface Material Market, 2021-2031 ($Million)
Figure 44. Brazil Thermal Interface Material Market, 2021-2031 ($Million)
Figure 45. Saudi Arabia Thermal Interface Material Market, 2021-2031 ($Million)
Figure 46. South Africa Thermal Interface Material Market, 2021-2031 ($Million)
Figure 47. Rest of LAMEA Thermal Interface Material Market, 2021-2031 ($Million)
Figure 48. Top Winning Strategies, by Year
Figure 49. Top Winning Strategies, by Development
Figure 50. Top Winning Strategies, by Company
Figure 51. Product Mapping of Top 10 Players
Figure 52. Competitive Dashboard
Figure 53. Competitive Heatmap of Top 10 Key Players
Figure 54. Top Player Positioning, 2021
Figure 55. Laird Technologies Inc..: Net Sales ($Million)
Figure 56. Dupont.: Net Sales ($Million)
Figure 57. Honeywell International Inc..: Net Sales ($Million)
Figure 58. Henkel Corporation.: Net Sales ($Million)
Figure 59. Zalman.: Net Sales ($Million)
Figure 60. 3M.: Net Sales ($Million)
Figure 61. Indium Corporation.: Net Sales ($Million)
Figure 62. Wakefield Thermal, Inc..: Net Sales ($Million)
Figure 63. Parker Hannifin Corporation.: Net Sales ($Million)
Figure 64. Momentive.: Net Sales ($Million)
Executive Summary
According to the report titled, “Thermal Interface Material Market," The thermal interface material market was valued at $4.7 billion in 2021, and is estimated to reach $10.8 billion by 2031, growing at a CAGR of 8.8% from 2022 to 2031.Thermal interface materials (TIMs) are a group of thermal management products that are applied between two interface surfaces or components in order to improve the thermal coupling. Thermal grease, thermal adhesives, gap filler, phase change materials, and thermal pads are types of thermal interface materials available in the market.
Thermal interface phase change materials are used widely across high heat dissipation electronic application across aerospace & military, consumer electronics, automotive, and industrial end use-industries. Phase change materials are used as an alternative over thermal greases. Traditionally, thermal greases are used as thermal interface material between power devices and their respective heat sinks. However, high heat dispensable characteristics of thermal interface phase change material make it prominent TIM. The non-thixotropic characteristic of phase change material allows easy handling and application process during high volume electronic production drives the demand of the global market. Thermal interface phase change material is capable of completely filling the voids and eliminating air gaps. In addition, these thermal interface materials are proven to displace trapped air between electronic components that are dissipating power. Use of phase change materials for void filling improvises heat sink performance and enhances electronic component reliability. These are the major growth factors.
Moreover, phase change materials tend to melt after reaching elevated temperature and form minimum bond-line thickness (MBLT) between the voids or surfaces. This further ensures proper thermal management between two electronic surfaces. Formation of MBLT results in zero thermal contact resistance owing to minimal thermal resistance path. All these factors are t important and are considerable factors for using thermal interface material in advanced electronic components. As phase change materials tend to alter physical phase upon reaching required melt temperature make them viable and advanced thermal interface material available in the global market.
The thermal interface material market is segmented on the basis of type, application, and region. By type, the market is divided into greases & adhesives, tapes & films, gap filler metallic TIMs, phase change materials, and others. The applications covered in the report include computers, telecom, medical devices, industrial machinery, consumer durables, and automobile electronics. On the basis of region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
Key players in thermal interface material industry include Laird Technologies Inc., DuPont, Honeywell International Inc. (Honeywell), Henkel Corporation, Zalman, 3M, Indium Corporation, Wakefield Thermal Solutions, Inc., Parker-Hannifin Corporation, and Momentive.
Key Findings of the Study:
The phase change material segment is estimated to display the highest growth rate, in terms of revenue, registering a CAGR of 9.3% from 2022 to 2031.Automotive electronics application is anticipated to register the highest CAGR of 9.2% during the forecast period.
The Asia-Pacific region is estimated to display the highest growth rate, in terms of revenue and accounted for a major share of 49% in 2021.
Companies Mentioned
- Laird Technologies Inc.
- DuPont
- Honeywell International Inc.
- Henkel Corporation
- Zalman
- 3M
- Indium Corporation
- Wakefield Thermal, Inc.
- Parker Hannifin Corporation
- Momentive
Methodology
The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.
They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.
They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:
- Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
- Scientific and technical writings for product information and related preemptions
- Regional government and statistical databases for macro analysis
- Authentic news articles and other related releases for market evaluation
- Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast
Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.
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Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 256 |
| Published | December 2022 |
| Forecast Period | 2021 - 2031 |
| Estimated Market Value ( USD | $ 4.7 billion |
| Forecasted Market Value ( USD | $ 10.8 billion |
| Compound Annual Growth Rate | 8.7% |
| Regions Covered | Global |
| No. of Companies Mentioned | 10 |
