Worldwide Electronic Smart Packaging Market - Technologies (RFID, NFC, BLE and EAS), Applications, End-Users, By Regions - Drivers, Opportunities, Trends, and Forecasts, 2016-2022

  • ID: 3788404
  • Report
  • Region: Global
  • 127 Pages
  • Infoholic Research LLP
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The Worldwide Electronic Smart Packaging Market Will Witness a CAGR of 45.5% During the Forecast Period 2016-2022

FEATURED COMPANIES

  • 3M Co.
  • Bemis Company Inc.
  • PakSense
  • PST Sensors
  • Saralon GmbH
  • Smartrac N.V.
  • MORE
"Worldwide Electronic Smart Packaging Market - Technologies (RFID, NFC, BLE and EAS), Applications (Printed Sensor, Printed Touch, Printed Light, Printed RFID and Printed Antennas), End-Users (Food, Beverage, Healthcare, Personal Care, Logistics and Machineries), By Regions - Drivers, Opportunities, Trends, and Forecasts, 2016-2022"

At present, the traditional packaging is being replaced by smart packaging system for its improved shelf life and quality. The smart packaging interacts internally and externally with the environment and performs more than one function such as monitoring freshness, safety, information on quality and others. There are different types of packaging such as electronic, electrical, mechanical/chemical. It is expected that the electronic smart packaging will grow faster in the coming years.

The electronic smart packaging has become a trending topic for all industries and customers in protecting their products, goods, etc. The electronic method is already being used in packaging products but their usage is less and cost-effective. Now with key enabling technology, printed electronics are boosting the potential opportunities for smart packaging by lowering the costs. According to this research, it is estimated that the “Worldwide Electronic Smart Packaging” market will witness a CAGR of 45.5% during the forecast period 2016-2022. In the future, the smart packaging market will witness a rapid growth and is expected to grow tremendously, due to the use of printed electronics in packaging. Printed electronics is a key in enabling smart packaging innovations and a fast-growing market for the industries.

In the recent years, the smart packaging has become a fast growing segment across the world. The printed electronics has evolved as a new technology in smart packaging, where companies have started investing in electronics in packaging. Some of the players included in the report are Thin Film Electronics, Smartrac NV, Bemis Company, Sealed Air and PakSense. It is expected that electronic smart packaging will drive the market in the upcoming years for its less cost, flexibility and additional functionality on the packaging. The smart packaging market is segmented by technologies, applications, end-users and geographic regions. High growth is expected in Europe and North America in the next 3-4 years.

The study covers and analyzes the “Worldwide Electronic Smart Packaging” market. Bringing out the complete key insights of the industry, the report aims to provide an opportunity for players to understand the latest trends, current market scenario, government initiative, and technologies related to the market. In addition, helps the venture capitalist in understanding the companies better and take informed decisions.
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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • 3M Co.
  • Bemis Company Inc.
  • PakSense
  • PST Sensors
  • Saralon GmbH
  • Smartrac N.V.
  • MORE
1 Industry Outlook
1.1 Industry Overview
1.2 Pest Analysis

2 Report Outline
2.1 Report Scope
2.2 Report Summary
2.3 Research Methodology
2.4 Report Assumptions

3 Market Snapshot
3.1 Total Addressable Market (TAM)
3.2 Segmented Addressable Market (SAM)
3.3 Related Markets

4 Electronic Smart Packaging
4.1 Overview
4.2 Market Trends and Impact
4.3 Types of Packaging
4.3.1 Passive Packaging
4.3.2 Active Packaging
4.3.3 Smart Packaging
4.4 Market Segmentation
4.5 Porter’s 5 (Five) Forces

5 Market Characteristics
5.1 Evolution
5.2 Architecture
5.3 Market Dynamics
5.3.1 Drivers
5.3.1.1 Technology adoption
5.3.1.2 Consumer demand
5.3.1.3 Ageing population
5.3.1.4 Low cost and less weight
5.3.2 Restraints
5.3.2.1 Lack of awareness about electronics in smart packaging
5.3.2.2 Increasing competition leading to price war
5.3.3 Opportunities
5.3.3.1 Use of NFC technology
5.3.3.2 Improving market conditions and falling costs
5.3.4 DRO - Impact Analysis

6 Printed Electronics in Smart Packaging
6.1 Overview
6.1.1 Printed electronic in smart packaging and their challenges
6.1.2 Electronics v/s Printed Electronics
6.1.3 Scope of printed electronics in smart packaging
6.1.4 Future impact of electronics in smart packaging
6.1.5 Future Investment and projects

7 Technology: Market Size and Analysis
7.1 Overview
7.2 Radio Frequency Identification (RFID)
7.2.1 Market Size and Analysis
7.3 NFC
7.3.1 Market Size and Analysis
7.4 Bluetooth Low Energy (BLE)
7.4.1 Market Size and Analysis
7.5 Electronic Article Surveillance (EAS)
7.5.1 Market Size and Analysis

8 Applications: Market Size and Analysis
8.1 Overview
8.2 Printed Light
8.2.1 Market Size and Analysis
8.3 Printed Touch
8.3.1 Market Size and Analysis
8.4 Printed Antennas
8.4.1 Overview
8.4.2 Market Size and Analysis
8.4.3 Printed NFC Antenna
8.4.4 Printed RFID Antenna
8.5 Printed RFID
8.5.1 Market Size and Analysis
8.6 Printed Sensors
8.6.1 Market Size and Analysis
8.7 Others
8.7.1 Market Size and Analysis

9 End-Users: Market Size and Analysis
9.1 Overview
9.2 Food
9.2.1 Market Size and Analysis
9.3 Beverage
9.3.1 Market Size and Analysis
9.4 Healthcare
9.4.1 Market Size and Analysis
9.5 Personal Care
9.5.1 Market Size and Analysis
9.6 Logistics/Transporting
9.6.1 Market Size and Analysis
9.7 Industry Machineries
9.7.1 Market Size and Analysis
9.8 Others
9.8.1 Market Size and Analysis

10 Regions: Market Size and Analysis
10.1 Overview
10.2 North America
10.2.1 Overview
10.2.2 Market Size and Analysis
10.2.2.1 US
10.2.2.2 Canada
10.3 Europe
10.3.1 Market Size and analysis
10.3.1.1 UK
10.4 Asia Pacific
10.4.1 Market Size and Analysis
10.4.1.1 Australia and New Zealand (ANZ)
10.4.1.2 China
10.4.1.3 India
10.5 MEA
10.6 Latin America

11 Vendor Profiles
11.1 Thin Film Electronics ASA
11.1.1 Overview
11.1.2 Business Unit
11.1.3 Geographic Revenue
11.1.4 Business Focus
11.1.5 SWOT Analysis
11.1.6 Business Strategy
11.2 Smartrac N.V.
11.2.1 Overview
11.2.2 Business Unit
11.2.3 Geographic Presence
11.2.4 Business Focus
11.2.5 SWOT Analysis
11.2.6 Business Strategy
11.3 Sealed Air
11.3.1 Overview
11.3.2 Business Unit
11.3.3 Geographic Revenue
11.3.4 Business Focus
11.3.5 SWOT Analysis
11.3.6 Business Strategy
11.4 Bemis Company Inc.
11.4.1 Overview
11.4.2 Business Unit
11.4.3 Geographic Presence
11.4.4 Business Focus
11.4.5 SWOT Analysis
11.4.6 Business Strategy
11.5 PakSense
11.5.1 Overview
11.5.2 Business Unit
11.5.3 Geographic Presence
11.5.4 Business Focus
11.5.5 SWOT Analysis
11.5.6 Business Strategy

12 Global Generalist
12.1 3M Co.
12.1.1 Overview
12.1.2 Cisco in Electronic Smart Packaging
12.2 Ametek Inc.
12.2.1 Overview
12.2.2 Ametek in Electronic Smart Packaging
12.3 RR Donnelley & Sons Co.
12.3.1 Overview
12.3.2 RR Donnelley in Electronic Smart Packaging
12.4 NEXX Systems Inc.
12.4.1 Overview
12.4.2 NEXX Systems Inc. in Electronic Smart Packaging

13 Companies to Watch for
13.1 PST Sensors
13.1.1 Overview
13.1.2 Market Overview
13.1.3 PST Sensors in Electronic Smart Packaging Market
13.2 Blue Spark Technologies Inc.
13.2.1 Overview
13.2.2 Market Overview
13.2.3 Blue Spark Technologies in Electronic Smart Packaging Market
13.3 Printechnologics
13.3.1 Overview
13.3.2 Market Overview
13.3.3 Printechnologics in Electronic Smart Packaging Market
13.4 Saralon GmbH
13.4.1 Overview
13.4.2 Market Overview
13.4.3 Saralon GmbH in Electronic Smart Packaging Market

14 Competitive Landscape
14.1 Competitor Comparison Analysis
14.2 Market Landscape
14.2.1 Mergers & Acquisitions (M&A)
14.2.2 Joint Venture
14.2.3 Capital Funding

Annexure
Abbreviations
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FEATURED COMPANIES

  • 3M Co.
  • Bemis Company Inc.
  • PakSense
  • PST Sensors
  • Saralon GmbH
  • Smartrac N.V.
  • MORE
The packaging of products and goods is necessary to protect and prevent them from the internal and external environments. At present, in modern lifestyle, the packaging has become an essential component. Increasing nuclear families and bachelor’s life has led a demand for ready to serve food where there is a need for quality food and shelf life. Increasing technology adoption and growing awareness for quality and shelf life have resulted in the concept of smart packaging that provides improved shelf life, monitors freshness, display information on quality, improves safety, and is more convenient.

With the evolving use of materials to create different packaging solutions, the electronic packaging is considered the most advanced type of smart packaging. Electronics on a package makes the package more attractive, highly secure and customer interactive. In the future, the smart packaging market will witness a rapid growth, and is expected to grow tremendously due to the use of printed electronics in the packaging. Printed electronics is a key in enabling smart packaging innovations and a fast-growing market for the industries. In the recent years, the smart packaging has become a fast growing segment across the world. The printed electronics has evolved as a new technology in smart packaging, where companies have started investing in electronics in packaging.

The current trend of flexible packaging and rapid growth of printed electronics in smart packaging will increase the revenue over the next decades. It is expected that electronic smart packaging will drive the market in the upcoming years for its less cost, flexibility and additional functionality on the packaging. The electronic smart packaging market is segmented into technologies, applications, end-users and regions. High growth is expected in Europe and North America in the coming 3-4 years.

Note: Product cover images may vary from those shown
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- 3M Co.
- Ametek Inc.
- Bemis Company Inc.
- Blue Spark Technologies Inc.
- NEXX Systems Inc.
- PakSense
- Printechnologics
- PST Sensors
- RR Donnelley & Sons Co.
- Saralon GmbH
- Sealed Air
- Smartrac N.V.
- Thin Film Electronics ASA

Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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