Flip-Chip Technologies and Global Markets

  • ID: 3789228
  • Report
  • Region: Global
  • 139 Pages
  • BCC Research
20 % OFF
until Jun 30th 2018
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The Global Market for Flip-Chip Technology Should Total $27.2 Billion and $41.4 Billion in 2016 and 2021 Respectively, Increasing at a CAGR of 8.8%

FEATURED COMPANIES

  • Amkor Technology Inc.
  • Gigpeak Inc.
  • Intel Corp.
  • Nichia Corp.
  • Signetics Corp.
  • Stmicroelectronics Nv
  • MORE
The global market for flip-chip technology totaled $24.9 billion in 2015. The market should total $27.2 billion and $41.4 billion in 2016 and 2021 respectively, increasing at a compound annual growth rate (CAGR) of 8.8% from 2016 to 2021.

This report provides:

- An overview of the global markets for flip-chip technologies, a process to interconnect IC’s and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads.

- Analyses of global market trends, with data from 2015, 2016, and projections of compound annual growth rates (CAGRs) through 2021.

- Discussion of the evolution, architecture, and value chain of flip-chip technologies.

- Examination of market dynamics, including drivers, restraints, and opportunities.

- Analysis of the flip-chip assembly markets by geography, including North America, Europe, Asia-Pacific, and others.

- Coverage of the competitive landscape, including mergers and acquisitions, collaborations and agreements, and new product development.

- Profiles of major players in the industry.

Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Amkor Technology Inc.
  • Gigpeak Inc.
  • Intel Corp.
  • Nichia Corp.
  • Signetics Corp.
  • Stmicroelectronics Nv
  • MORE
1: Introduction
- Study Goals And Objectives
- Reasons For Conducting The Study
- Scope Of Report
- Intended Audience
- Information Sources

2: Summary
- - Table Summary : Global Market For Flip-Chip Technology By Wafer Bumping Process, Through 2021
- - Figure Summary : Global Market For Flip-Chip Technology By Wafer Bumping Process, 2015-2021

3: Overview
- Market Definition
- Evolution Of Flip-Chip Wafer Bumping Technologies
- Significant Patents On Flip-Chip Technologies

4: Flip-Chip Technology Market By Wafer Bumping Process
- Introduction
- Market Dynamics

5: Flip-Chip Technology Market By Application
- Introduction
- Market Dynamics
- 2-D Logic System-On-A-Chip
- Memory
- Imaging
- High-Brightness Light-Emitting Diode (Hb-Led)
- Small Logic, Radio Frequency, Power, Analog, And Mixed-Signal Integrated Circuits
- 2.5-D And 3-D System-In-Package/System-On-A-Chip

6: Flip-Chip Technology Market By End Use
- Introduction
- Market Dynamics
- Smartphones
- Laptops
- Desktop Central Processing Units
- Graphics Processing Unit And Chipsets
- Other Computing Devices
- Automotive
- Robotics
- Medical Devices
- Smart Technologies
- Industrial Applications

7: Flip-Chip Technology Market By Region
- Introduction
- Market Snapshot
- North America
- Europe
- Asia-Pacific Region
- Rest Of The World

8: Industry Structure And Competitive Analysis
- Industry Structure
- Market Share Analysis
- Factors Impacting The Flip-Chip Market
- Patent Analysis

9: Company Profiles
- Amkor Technology Inc.
- Ase Group
- Faraday Technology Corp.
- Flipchip International Llc
- Gigpeak Inc.
- Globalfoundries Inc.
- Ibm Corp.
- Intel Corp.
- Kyocera America Inc.
- Nanium Sa
- Nichia Corp.
- Ntk Technologies Inc.
- Philips Lumileds Lighting Co.
- Powertech Technology Inc.
- Renesas Electronics America Inc.
- Samsung Electronics Co. Ltd.
- Signetics Corp.
- Siliconware Precision Industries Co. Ltd.
- Sk Hynix Inc.
- Stats Chippac Pte. Ltd.
- Stmicroelectronics Nv
- Suss Microtec Ag
- Taiwan Semiconductor Manufacturing Co.
- Tektronix Component Solutions Inc.
- Tessera Technologies Inc.
- Texas Instruments Inc.
- Tokyo Electron Ltd.
- Toshiba Electronics Europe Gmbh
- Unisem (M) Berhad
- Utac Holdings Ltd.

List Of Tables

Summary Table : Global Market For Flip-Chip Technology By Wafer Bumping Process, Through 2021
Table 1 : Global Market Shares For Flip-Chip Technology By Wafer Bumping Process, 2015 And 2021
Table 2 : Global Flip-Chip Unit Sales By Wafer Bumping Process, Through 2021
Table 3 : Global Flip-Chip Technology Average Price Per Unit By Wafer Bumping Process, 2015-2021
Table 4 : Global Market For Copper (Cu) Pillar Flip Chips By End Use, Through 2021
Table 5 : Mechanical Properties Of Tin-Lead (Sn-Pb)
Table 6 : Physical Properties Of Tin-Lead (Sn-Pb)
Table 7 : Global Market For Tin-Lead (Sn-Pb) Flip Chips By End Use, Through 2021
Table 8 : Characteristics Of Various Elements
Table 9 : Characteristics Of Various Mixed Compositions
Table 10 : Global Market For Lead (Pb)-Free Flip Chips By End Use, Through 2021
Table 11 : Global Market For Gold Stud Bumped Flip Chips By End Use, Through 2021
Table 12 : Global Market Demand For Flip-Chip Technologies By Application, Through 2021
Table 13 : Global Market For Flip Chips Used In 2-D Logic System-On-Chip By Region, Through 2021
Table 14 : Comparative Analyses Of Various Types Of Memory
Table 15 : Global Market For Flip Chips Used In Memory Applications By Region, Through 2021
Table 16 : Global Market For Flip Chips Used In Imaging Technologies By Region, Through 2021
Table 17 : Global Market For Flip Chips Used In Hb-Led Applications By Region, Through 2021
Table 18 : Global Market For Flip Chips Used In Rf Applications By Region, Through 2021
Table 19 : Global Market For Flip Chips Used In 2.5-D/3-D Applications By Region, Through 2021
Table 20 : Global Market For Flip-Chip Technology By End Use, Through 2021
Table 21 : Global Flip-Chip Market In Smartphones By Bumping Process, Through 2021
Table 22 : Global Flip-Chip Market In Laptops By Bumping Process, Through 2021
Table 23 : Global Flip-Chip Market In Desktop Central Processing Units By Bumping Process, Through 2021
Table 24 : Global Flip-Chip Market In Graphic Processing Units And Chipsets By Bumping Process, Through 2021
Table 25 : Global Flip-Chip Market In Other Computing Devices By Bumping Process, Through 2021
Table 26 : Global Flip-Chip Market In Automotive Applications By Bumping Process, Through 2021
Table 27 : Global Flip-Chip Market In Robotics By Bumping Process, Through 2021
Table 28 : Global Flip-Chip Market In Medical Devices By Bumping Process, Through 2021
Table 29 : Global Flip-Chip Market In Smart Technologies By Bumping Process, Through 2021
Table 30 : Global Flip-Chip Market In Industrial Applications By Bumping Process, Through 2021
Table 31 : Global Market For Flip-Chip Production By Region, Through 2021
Table 32 : Global Market For Flip-Chip End-Use Demand By Region, Through 2021
Table 33 : North American Market For Flip-Chip Production By Country, Through 2021
Table 34 : North American Market For Flip-Chip End-Use Demand By Country, Through 2021
Table 35 : North American Flip-Chip Market By End-Use Demand, Through 2021
Table 36 : North American Flip-Chip Market By Application, Through 2021
Table 37 : European Market For Flip-Chip Production By Country, Through 2021
Table 38 : European Market For Flip-Chip End-Use Demand By Country, Through 2021
Table 39 : European Flip-Chip Market By End-Use Demand, Through 2021
Table 40 : European Flip-Chip Market By Application, Through 2021
Table 41 : Asia-Pacific Market For Flip-Chip Production By Country, Through 2021
Table 42 : Asia-Pacific Market For Flip-Chip End-Use Demand By Country, Through 2021
Table 43 : Asia-Pacific Flip-Chip Market By End-Use Demand, Through 2021
Table 44 : Asia-Pacific Flip-Chip Market By Application, Through 2021
Table 45 : Row Flip-Chip Market By End-Use Demand, Through 2021
Table 46 : Row Flip-Chip Market By Application, Through 2021
Table 47 : Global Flip-Chip Market Shares By Key Players, 2014

List Of Figures

Summary Figure : Global Market For Flip-Chip Technology By Wafer Bumping Process, 2015-2021
Figure 1 : Development Of Wafer Bumping Technologies, 1960-2004
Figure 2 : Solder Evaporation Process
Figure 3 : Solder Alloy Electroplating Process
Figure 4 : Solder Paste Screening Process
Figure 5 : Global Market Shares For Flip-Chip Technology By Wafer Bumping Process, 2015 And 2021
Figure 6 : Global Flip-Chip Unit Sales By Wafer Bumping Process, 2015-2021
Figure 7 : Global Market For Copper (Cu) Pillar Flip Chips By End Use, 2015-2021
Figure 8 : Global Market For Tin-Lead (Sn-Pb) Flip Chips By End Use, 2015-2021
Figure 9 : Global Market For Lead (Pb)-Free Flip Chips By End Use, 2015-2021
Figure 10 : Global Market For Gold Stud Bumped Flip Chips By End Use, 2015-2021
Figure 11 : Market Segmentation By Application
Figure 12 : Global Market For Flip-Chip Technologies By Application, 2015-2021
Figure 13 : Structure Of Multi-Chip Module
Figure 14 : Structure Of System-On-Chip
Figure 15 : Global Market For Flip Chips Used In 2-D Logic System-On-Chip By Region, 2015-2021
Figure 16 : Global Market For Flip Chips Used In Memory Applications By Region, 2015-2021
Figure 17 : Global Market For Flip Chips Used In Imaging Technologies By Region, 2015-2021
Figure 18 : Structure Of Hb-Led
Figure 19 : Global Market For Flip Chips Used In Hb-Led Applications By Region, 2015-2021
Figure 20 : Global Market For Flip Chips Used In Rf Applications By Region, 2015-2021
Figure 21 : Architecture Of 2.5-D Integrated Circuit
Figure 22 : Structure Of 3-D Integrated Circuit
Figure 23 : Global Market For Flip Chips Used In 2.5-D/3-D Applications By Region, 2015-2021
Figure 24 : Global Market For Flip-Chip Technology By End Use, 2015-2021
Figure 25 : Global Flip-Chip Market In Smartphones By Bumping Process, 2015-2021
Figure 26 : Global Flip-Chip Market In Laptops By Bumping Process, 2015-2021
Figure 27 : Global Flip-Chip Market In Desktop Central Processing Units By Bumping Process, 2015-2021
Figure 28 : Global Flip-Chip Market In Graphics Processing Units And Chipsets By Bumping Process, 2015-2021
Figure 29 : Global Flip-Chip Market In Other Computing Devices By Bumping Process, 2015-2021
Figure 30 : Global Flip-Chip Market In Automotive Applications By Bumping Process, 2015-2021
Figure 31 : Global Flip-Chip Market In Robotics By Bumping Process, 2015-2021
Figure 32 : Global Flip-Chip Market In Medical Devices By Bumping Process, 2015-2021
Figure 33 : Global Flip-Chip Market In Smart Technologies By Bumping Process, 2015-2021
Figure 34 : Global Flip-Chip Market In Industrial Applications By Bumping Process, 2015-2021
Figure 35 : Regional Segmentation Of The Flip-Chip Market
Figure 36 : Industry Revenue Model
Figure 37 : Regional Analysis Of Patents, December 2012-December 2015
Figure 38 : Number Of Patents Filed By Year, December 2012-December 2015
Note: Product cover images may vary from those shown
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- Amkor Technology Inc.
- Ase Group
- Faraday Technology Corp.
- Flipchip International Llc
- Gigpeak Inc.
- Globalfoundries Inc.
- Ibm Corp.
- Intel Corp.
- Kyocera America Inc.
- Nanium Sa
- Nichia Corp.
- Ntk Technologies Inc.
- Philips Lumileds Lighting Co.
- Powertech Technology Inc.
- Renesas Electronics America Inc.
- Samsung Electronics Co. Ltd.
- Signetics Corp.
- Siliconware Precision Industries Co. Ltd.
- Sk Hynix Inc.
- Stats Chippac Pte. Ltd.
- Stmicroelectronics Nv
- Suss Microtec Ag
- Taiwan Semiconductor Manufacturing Co.
- Tektronix Component Solutions Inc.
- Tessera Technologies Inc.
- Texas Instruments Inc.
- Tokyo Electron Ltd.
- Toshiba Electronics Europe Gmbh
- Unisem (M) Berhad
- Utac Holdings Ltd.
Note: Product cover images may vary from those shown
5 of 5
Note: Product cover images may vary from those shown
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