Global Micro-electrical-mechanical-systems Market 2016-2020

  • ID: 3829435
  • Report
  • Region: Global
  • 71 pages
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FEATURED COMPANIES

  • AAC Technologies
  • Bosch
  • GoerTek
  • InvenSense
  • Maxim Integrated
  • Schneider Electric
  • MORE
About MEMS

MEMS are miniaturized devices and structures that are made using the techniques of microfabrication. These combine mechanical, optical, and fluidic elements with electronics. The size of MEMS devices can range from less than one micron up to a number of millimeters. These devices are integrated with a number of devices such as smartphones, tablets, wearables, vehicles, medical devices, and industrial devices for carrying out different types of automated functions. Consumer electronics is the largest market for MEMS.

The analysts forecast the global micro-electro-mechanical-systems (MEMS) market to grow at a CAGR of 11.95% during the period 2016-2020.

Covered in this report
The report covers the present scenario and the growth prospects of the global micro-electro-mechanical-systems (MEMS) market for 2016-2020. To calculate the market size, the report considers revenue generated from the sales of MEMS.

The market is divided into the following segments based on geography:
- Americas
- APAC
- EMEA

The report, Global Micro-Electro-Mechanical-Systems (MEMS) Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- Analog Devices
- Bosch Sensortec GmbH
- InvenSense Inc.
- Knowles Electronics, LLC
- STMicroelectronics NV
- Texas Instruments Inc.

Other prominent vendors
- AAC Technologies
- Delphi
- GoerTek
- Infineon
- Maxim Integrated
- Murata
- Schneider Electric
- Sensata Technologies
- Silicon Labs

Market drivers
- MEMS becoming integral part of consumer electronic devices
- For a full, detailed list, view the full report

Market challenges
- Accuracy and calibration issues during sensor fusion
- For a full, detailed list, view the full report

Market trends
- Advanced MEMS packaging
- For a full, detailed list, view the full report

Key questions answered in this report
- What will the market size be in 2020 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • AAC Technologies
  • Bosch
  • GoerTek
  • InvenSense
  • Maxim Integrated
  • Schneider Electric
  • MORE
PART 01: Executive summary
  • Highlights
PART 02: Scope of the report
  • Definition
  • Source year
  • Forecast period
  • Product segmentation
  • End-user segmentation
  • Geographical segmentation
  • Common currency conversion rates
  • Top-vendor offerings
PART 03: Market research methodology
  • Research methodology
  • Economic indicators
PART 04: Introduction
  • Key market highlights
PART 05: Market landscape
  • Market size and forecast by revenue
  • Market size and forecast by unit shipment
  • MEMS ASP forecast 2015-2020
  • Five forces analysis
PART 06: Market segmentation by product
  • Global MEMS market segmentation by product
  • Global pressure sensor MEMS market
  • Global inertial combos MEMS market
  • Global gyroscope MEMS market
  • Global RF MEMS market
  • Global accelerometers MEMS market
  • Global optical MEMS market
  • Global microphone MEMS market
PART 07: Market segmentation by end user
  • Global MEMS market for consumer electronic segment
  • Global MEMS market for automotive segment
  • Global MEMS market for industrial segment
  • Global MEMS market for medical segment
PART 08: Geographical segmentation
  • Market overview
  • Market size and forecast
  • APAC
  • EMEA
  • Americas
PART 09: Market drivers

PART 10: Impact of drivers

PART 11: Market challenges
  • Accuracy and calibration issues during sensor fusion
  • Declining prices of MEMS
  • Design complexity
PART 12: Impact of drivers and challenges

PART 13: Market trends
  • Advanced MEMS packaging
  • Increased adoption of smart lifestyle wearable devices
  • Increasing trend of sensor fusion
  • Holographic display based on microdisplay
PART 14: Vendor landscape
  • Competitive scenario
  • Analog Devices
  • Bosch
  • InvenSense
  • Knowles
  • STMicroelectronics
  • Texas Instruments
  • Other prominent vendors
PART 15: Appendix
  • List of abbreviations
PART 16: About the Author

List of Exhibits
Exhibit 01: List of major countries considered
Exhibit 02: Product offerings
Exhibit 03: IoT spending ($ trillions)
Exhibit 04: Global MEMS market by revenue 2015-2020 ($ billions)
Exhibit 05: Global MEMS market by unit shipment 2015-2020 ($ billions of units)
Exhibit 06: ASP trend 2015-2020
Exhibit 07: Five forces analysis
Exhibit 08: Global MEMS market by product 2015
Exhibit 09: Global MEMS market by product 2015-2020 (% share)
Exhibit 10: Global MEMS market by product 2015-2020 ($ billions)
Exhibit 11: Global pressure sensor MEMS market 2015-2020 ($ billions)
Exhibit 12: Global inertial combos MEMS market 2015-2020 ($ billions)
Exhibit 13: Global gyroscope MEMS market 2015-2020 ($ billions)
Exhibit 14: Global RF MEMS market 2015-2020 ($ billions)
Exhibit 15: Global accelerometers MEMS market 2015-2020 ($ billions)
Exhibit 16: Global smartphone shipment market 2015-2020 (millions of units)
Exhibit 17: Global optical MEMS market 2015-2020 ($ billions)
Exhibit 18: Global optical MEMS market by product 2015
Exhibit 19: Global microphone MEMS market 2015-2020 ($ billions)
Exhibit 20: Global MEMS market by end-user 2015-2020 (% share)
Exhibit 21: Global MEMS market by end-user 2015-2020 ($ billions)
Exhibit 22: Global MEMS market for consumer electronic segment 2015-2020 ($ billions)
Exhibit 23: Global MEMS market for automotive segment 2015-2020 ($ billions)
Exhibit 24: Global MEMS market for industrial segment 2015-2020 ($ billions)
Exhibit 25: Global MEMS market for medical segment 2015-2020 ($ billions)
Exhibit 26: Global MEMS market by geography 2015-2020 (% share)
Exhibit 27: Global MEMS market by geography 2015-2020 ($ billions)
Exhibit 28: MEMS market in APAC 2015-2020 ($ billions)
Exhibit 29: MEMS market in EMEA 2015-2020 ($ billions)
Exhibit 30: MEMS market in Americas 2015-2020 ($ billions)
Exhibit 31: Impact of drivers
Exhibit 32: Impact of drivers and challenges
Exhibit 33: Recent developments
Exhibit 34: Other prominent vendors
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FEATURED COMPANIES

  • AAC Technologies
  • Bosch
  • GoerTek
  • InvenSense
  • Maxim Integrated
  • Schneider Electric
  • MORE
New Report Released: – Global Micro-Electro-Mechanical-Systems (MEMS) Market 2016-2020

The author of the report recognizes the following companies as the key players in the global micro-electro-mechanical-systems (MEMS) market: Analog Devices, Bosch, InvenSense, Knowles, and STMicroelectronics.

Other Prominent Vendors in the market are: AAC Technologies, Delphi, GoerTek, Infineon, Maxim Integrated, Murata, Schneider Electric, Sensata Technologies, and Silicon Labs.

Commenting on the report, an analyst from the research team said: “Advanced micro-electro-mechanical-system packaging will be a key trend for market growth. The MEMS packaging industry is constantly evolving. There is a growing need to reduce packaging size and integrate 9-axis sensors in a single package. Also, it is important for vendors to achieve standardization in packaging because of the increase in unit shipments of MEMS sensors. Although standardization in packaging is difficult to achieve because of rapid advances in technology in consumer electronic devices, certain vendors are trying to achieve standardization in packaging materials for different sensors. A few of the packaging techniques adopted by the MEMS packaging industry include low-temperature wafer bonding, packing MEMS at wafer dicing level, and doped polysilicon and silicon interposers for packaging. Thus, the advances in MEMS packaging will benefit the vendors of MEMS.”

According to the report, one of the key drivers for market growth will be short replacement cycle time of mobile devices. Advances in technology and increase in disposable income have led to a change in consumer buying pattern. Consumer electronic devices such as mobile and tablets become obsolete after a short time, i.e., within one to one-and-half year. This increases the need to be replaced by the higher version or better technology model, thereby resulting in shorter product replacement cycles. Furthermore, due to the low prices of smartphones, it is affordable for the consumers, thus making the replacement rate very high. Companies such as Huawei and Xiaomi are giving tough competition to Apple and Samsung. With a rise in the number of mobile devices sold by regional vendors, the sale of sensors, accelerometers, gyroscopes, and microphones, which are integral parts of such devices, will also increase, leading to the growth of the market.

Further, the report states that accuracy and calibration issues during sensor fusion will be a challenge for the market. The combination of multiple sensors gives rise to calibration issues. This is because, different sensors acquire the measurements and then combine them using sensor fusion, which sometimes results in time lag or faulty output. The proper alignment of the sensors has to be determined frequently to avoid performance issues. Multiple sets of calibration are required in the sensor fusion unit, but this increases the power consumption of the device. Good calibration is a prerequisite for sensor fusion and preferably without the need for additional hardware.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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- Analog Devices
- Bosch
- InvenSense
- Knowles
- STMicroelectronics
- AAC Technologies
- Delphi
- GoerTek
- Infineon
- Maxim Integrated
- Murata
- Schneider Electric
- Sensata Technologies
- Silicon Labs.
Note: Product cover images may vary from those shown
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