Global IGBT-based Power Module Market 2016-2020

  • ID: 3832380
  • Report
  • Region: Global
  • 57 pages
  • TechNavio
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FEATURED COMPANIES

  • Fuji Electric
  • Infineon Technologies
  • Mitsubishi
  • SEMIKRON
  • STMicroelectronics
  • MORE
About IGBT

An IGBT chip has high power efficiency, high blocking voltage, and the ability to work on low power. IGBT and diode dies are combined to form power modules. These are large arrangements of basic building blocks of power electronic equipment. These assembled stacks are configured to cope with the needs of the highest power applications.

These modules are used in industrial motors, railroad traction, power supplies, renewable energy, and consumer appliances. These modules are also used to drive electric motors for both automotive and industrial applications.

The analysts forecast the global IGBT-based power module market to grow at a CAGR of 8.45% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global IGBT-based power module market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of IGBT-based power module sensors.

The market is divided into the following segments based on geography:

- Americas
- APAC
- EMEA

The report, Global IGBT-Based Power Module Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- Fairchild Semiconductor International
- Fuji Electric
- Infineon Technologies
- Mitsubishi
- SEMIKRON
- STMicroelectronics

Market drivers
- Increase in demand for electric and hybrid vehicles

Market challenges
- Reduction in size of IGBT modules leading to high power dissipation

Market trends
- Increase in demand for electric and hybrid vehicles

Key questions answered in this report
- What will the market size be in 2020 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Fuji Electric
  • Infineon Technologies
  • Mitsubishi
  • SEMIKRON
  • STMicroelectronics
  • MORE
PART 01: Executive summary
  • Highlights
PART 02: Scope of the report
  • Definition
  • Report overview
  • Base year and forecast period
  • Geographical segmentation
  • Common currency conversion rates
  • Top-vendor offerings
PART 03: Market research methodology
  • Research methodology
  • Economic indicators
PART 04: Introduction
  • Key market highlights
  • Technology landscape
PART 05: Market landscape
  • Market overview
  • Product life cycle of IGBT-based power module
  • Five forces analysis
PART 06: Market segmentation by application
  • Global IGBT-based power module market by application
  • IGBT-based power module market by industrial motor drives application
  • IGBT-based power module market by renewable energy application
  • IGBT-based power module market by railroad traction application
  • IGBT-based power module market by consumer appliances application
  • IGBT-based power module market by power supplies application
PART 07: Geographical segmentation
  • Global IGBT-based power module market by geography
  • Market size and forecast
  • IGBT-based power module market in APAC
  • IGBT-based power module market in EMEA
  • IGBT-based power module market in Americas
PART 08: Market drivers
  • Demand for modular power solutions in renewable energy applications
  • Increasing need for higher power density
  • Need for IGBT-based power modules in rail traction
  • Need for energy savings
  • Growing penetration of HVDC lines
PART 09: Impact of drivers

PART 10: Market challenges
  • Grid fault in power semiconductor devices
  • Reduction in size of IGBT modules leading to high power dissipation
  • Emerging market for GaN and SiC power semiconductors
PART 11: Impact of drivers and challenges

PART 12: Market trends
  • Increase in demand for electric and hybrid vehicles
  • Increasing adoption of clean energy sources
  • Increased demand for copper wire for interconnections
PART 13: Vendor landscape
  • Competitive scenario
PART 14: Summary of market figures

PART 15: Appendix
  • List of abbreviations
PART 16: About the Author

List of Exhibits

Exhibit 01: Global IGBT-based power module market 2015
Exhibit 02: Major countries covered
Exhibit 03: Currency conversion rates
Exhibit 04: Product offerings
Exhibit 05: Applications areas of IGBT-based power modules
Exhibit 06: Global IGBT-based power module market 2015-2020 ($ billions)
Exhibit 07: Product life cycle
Exhibit 08: Five forces analysis
Exhibit 09: Global IGBT-based power module market by application 2015
Exhibit 10: Global IGBT-based power module market by application 2015-2020 (% share)
Exhibit 11: Global IGBT-based power module market by application 2015-2020 ($ billions)
Exhibit 12: Global IGBT-based power module market by industrial motor drives application ($ millions)
Exhibit 13: Global IGBT-based power module market by renewable energy application ($ millions)
Exhibit 14: Global IGBT-based power module market by railroad traction application ($ millions)
Exhibit 15: Global IGBT-based power module market by consumer appliances application ($ millions)
Exhibit 16: Global IGBT-based power module market by power supplies application ($ millions)
Exhibit 17: Global IGBT-based power module market by geography 2015 (% share)
Exhibit 18: Global IGBT-based power module market by geography 2015-2020 (% share)
Exhibit 19: Global IGBT-based power module market by geography 2015-2020 ($ millions)
Exhibit 20: IGBT-based power module market in APAC ($ billions)
Exhibit 21: IGBT-based power module market in EMEA ($ millions)
Exhibit 22: IGBT-based power module market in Americas ($ millions)
Exhibit 23: Global HVDC transmission market 2015-2020 ($ billions)
Exhibit 24: Impact of drivers
Exhibit 25: Impact of drivers and challenges
Exhibit 26: Fairchild Semiconductor: Revenue contribution by business segment 2015
Exhibit 27: Infineon Technologies: Revenue contribution by business segment 2015
Exhibit 28: Infineon Technologies: Revenue contribution by geography 2015
Exhibit 29: Mitsubishi: Net sales breakdown by business segments as of March 31, 2015
Exhibit 30: Market summary of global IGBT-based power module market 2015-2020
Exhibit 31: CAGR comparison for application segments 2015-2020
Exhibit 32: CAGR comparison for geographical segments 2015-2020
Exhibit 33: Application segments: Year-over-year revenue comparison ($ millions)
Exhibit 34: Geographical segments: Year-over-year revenue comparison ($ millions)
Exhibit 35: Application segments: Year-over-year revenue comparison (by percentage)
Exhibit 36: Geographical segments: Year-over-year revenue comparison (by percentage)
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FEATURED COMPANIES

  • Fuji Electric
  • Infineon Technologies
  • Mitsubishi
  • SEMIKRON
  • STMicroelectronics
  • MORE
New Report Released: - Global IGBT-Based Power Module Market 2016-2020

The author of the report recognizes the following companies as the key players in the global IGBT-based power module market: Fairchild Semiconductor International, Fuji Electric, Infineon Technologies, Mitsubishi, SEMIKRON, and STMicroelectronics.

Commenting on the report, an analyst from the research team said: “One of the key trends for market growth will be increased demand for copper wire for interconnections. With the increased need for high power ratings for electronic applications such as electric rail tractions and the wind power generators, power semiconductor vendors are increasingly using copper wire for interconnections. The use of copper wire bonding for interconnections provides higher thermal conductivity, higher elastic modulus, higher melting temperature, and higher capacities than aluminum wire bonding for similar boundary conditions. This trend of using copper wire for interconnections will grow at a good pace during the forecast period and have a positive effect on the growth of the IGBT-based power module market.¬¬¬¬¬”

According to the report, one of the key drivers for market growth will be increasing need for higher power density. There is a continuous need for high power density in power electronics to achieve technological advances, especially in high-power applications. For instance, inverter systems, power electronic devices in railroad traction drives, wind power generators, and solar power generators use IGBT-based power modules to increase their operational efficiency. A number of vendors such as Infineon are investing in R&D to develop IGBT-based power modules that have a high power density. IGBTs have more advantages than power MOSFETs and GTOs as they require less power, have simplified circuits, and optimum forward and reverse blocking capabilities.

Further, the report states that occurrence of grid fault in power semiconductor devices will be a challenge for the market. Power semiconductors face the problem of grid fault. One particular challenge for power semiconductors is the need to cope with a grid fault for a specified period of time (fault ride through) - a feature demanded from wind turbines by network operators. In wind turbines with doubly-fed asynchronous generators, in particular, the IGBTs and freewheeling diodes need to be able to cope with high peaks in current and voltage.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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- Fairchild Semiconductor International
- Fuji Electric
- Infineon Technologies
- Mitsubishi
- SEMIKRON
- STMicroelectronics
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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