Global Semiconductor Packaging Equipment Market 2016-2020

  • ID: 3832381
  • Report
  • Region: Global
  • 67 pages
  • TechNavio
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FEATURED COMPANIES

  • Applied Materials
  • ASM Pacific Technology
  • ChipMos
  • Greatek
  • Hua Hong
  • Lingsen Precision
  • MORE
About Semiconductor Packaging

Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components.

Semiconductor packaging offers the following benefits to wafers:

- Prevents corrosion
- Offers protection in case of impact
- Dissipates heat produced in the device
- Secures the contact leads or pins used to plug in the device to its external circuits

The analysts forecast the global semiconductor packaging equipment market to grow at a CAGR of 8.04% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor packaging equipment market for 2016-2020. To calculate the market size, the report considers the sale of semiconductor packaging equipment to the end-users - OSATs and IDMs.

The market is divided into the following segments based on geography:

- APAC
- Europe
- North America

The report, Global Semiconductor Packaging Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- Applied Materials
- ASM Pacific Technology
- Kulicke and Soffa Industries
- Tokyo Electron Limited
- Tokyo Seimitsu

Other prominent vendors
- ChipMos
- Greatek
- Hua Hong
- Jiangsu Changjiang Electronics Technology
- Lingsen Precision
- Nepes
- Tianshui Huatian
- Unisem
- Ultratech

Market drivers
- High demand for polymer adhesive wafer bonding equipment

Market challenges
- Fluctuation of foreign exchange rates

Market trends
- Growing number of mergers and acquisitions

Key questions answered in this report
- What will the market size be in 2020 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Applied Materials
  • ASM Pacific Technology
  • ChipMos
  • Greatek
  • Hua Hong
  • Lingsen Precision
  • MORE
PART 01: Executive summary
  • Highlights
PART 02: Scope of the report
  • Definition
  • Source year and forecast period
  • Market reportage
  • Market size computation
  • Market segmentation
  • Geographical coverage
  • Vendor segmentation
  • Common currency conversion rates
  • Top-vendor offerings
PART 03: Market research methodology
  • Research methodology
  • Economic indicators
PART 04: Introduction
  • Key market highlights
PART 05: Technology landscape
  • Wafer-level versus die-level packaging and assembly
  • Roadmap of semiconductor packaging industry
  • Ecosystem of semiconductor IC packaging industry
PART 06: Market landscape
  • Customer perspective
  • Market size and forecast
  • Five forces analysis
PART 07: Market segmentation by type
  • Types of packaging equipment
  • Die-level packaging equipment
  • Wafer-level packaging equipment
PART 08: Market segmentation by end-user
  • Global semiconductor packaging equipment market by end-user
  • OSATs
  • IDMs
PART 09: Geographical segmentation
  • Global semiconductor packaging equipment market by region
  • APAC
  • North America
  • Europe
PART 10: Market drivers
  • Growing number of fabs
  • High demand for polymer adhesive wafer bonding equipment
  • Complex semiconductor IC designs
  • Explosive growth of wireless computing devices along with advent of IoT
  • Growing demand for compact electronic devices
  • High need for SoC technology
PART 11: Impact of drivers

PART 12: Market challenges
  • High inventory levels in supply chain
  • Dependency on few key suppliers
  • Fluctuation of foreign exchange rates
  • High investment market
PART 13: Impact of drivers and challenges

PART 14: Market trends
  • Development of 3D chip packaging
  • Increase in number of OSAT vendors
  • Growing number of mergers and acquisitions
  • FOWLP technology
  • High need for semiconductor memory devices
  • Growing acceptance of wearable devices
  • Automation in automobiles
PART 15: Vendor landscape
  • Competitive scenario
  • Key vendors
  • Other prominent vendors
PART 16: Appendix
  • List of abbreviations
PART 17: About the Author

List of Exhibits

Exhibit 01: Segmentation of global semiconductor packaging equipment market
Exhibit 02: List of countries in key regions
Exhibit 03: Market vendors
Exhibit 04: Currency conversions
Exhibit 05: Product offerings
Exhibit 06: Steps involved in back-end chip formation
Exhibit 07:.5D IC block diagram
Exhibit 08: 5D IC block diagram
Exhibit 09: Supply chain in traditional semiconductor IC packaging industry
Exhibit 10: Supply chain in new semiconductor IC packaging industry
Exhibit 11: Global semiconductor packaging equipment market 2015-2020 ($ billions)
Exhibit 12: Five forces analysis
Exhibit 13: Global semiconductor packaging equipment market by type 2015 (% share)
Exhibit 14: Global semiconductor packaging equipment market by type 2020 (% share)
Exhibit 15: Global semiconductor packaging equipment market by die-level packaging equipment 2015-2020 ($ millions)
Exhibit 16: Global semiconductor packaging equipment market by wafer-level packaging equipment 2015-2020 ($ millions)
Exhibit 17: Global semiconductor packaging equipment market by end-user 2015 (% share)
Exhibit 18: Global semiconductor packaging equipment market by end-user 2020 (% share)
Exhibit 19: Global semiconductor packaging equipment market by OSAT 2015-2020 ($ millions)
Exhibit 20: Global semiconductor packaging equipment market by IDM 2015-2020 ($ millions)
Exhibit 21: Global semiconductor packaging equipment market by region 2015 (% share)
Exhibit 22: Global semiconductor packaging equipment market by region 2020 (% share)
Exhibit 23: Semiconductor packaging equipment market in APAC 2015-2020 ($ millions)
Exhibit 24: Semiconductor packaging equipment market in North America 2015-2020 ($ millions)
Exhibit 25: Semiconductor packaging equipment market in Europe 2015-2020 ($ millions)
Exhibit 26: Global semiconductor packaging equipment market 2015-2020 (% share)
Exhibit 27: CAGR of LED chip and sensor market 2015-2020
Exhibit 28: Impact of drivers
Exhibit 29: Impact of drivers (continued)
Exhibit 30: Global semiconductor market trend 1992-2015 ($ billions)
Exhibit 31: Impact of drivers and challenges
Exhibit 32: CAGR of 3D NAND and DRAM 2015-2020
Exhibit 33: Cars shipment growth forecast 2015-2020 (% growth)
Exhibit 34: Applied Materials: Segment-wise revenue contribution 2015 (% share)
Exhibit 35: Applied Materials: Segment-wise revenue break-up 2015 ($ billions)
Exhibit 36: Applied Materials: Silicon system segment performance 2014-2015 ($ billions)
Exhibit 37: Applied Materials: R&D expenses 2011-2015 ($ billions)
Exhibit 38: TEL: Sector performance by revenue 2012-2015
Exhibit 39: Tokyo Seimitsu: Business segmentation by revenue 2013-2015 ($ millions)
Exhibit 40: Other vendors in global semiconductor packaging equipment market
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FEATURED COMPANIES

  • Applied Materials
  • ASM Pacific Technology
  • ChipMos
  • Greatek
  • Hua Hong
  • Lingsen Precision
  • MORE
New Report Released: - Global Semiconductor Packaging Equipment Market 2016-2020

The author of the report recognizes the following companies as the key players in the global semiconductor packaging equipment market: Applied Materials, ASM Pacific Technology, Kulicke and Soffa Industries, Tokyo Electron Limited, and Tokyo Seimitsu.

Other Prominent Vendors in the market are: ChipMos, Greatek, Hua Hong, Jiangsu Changjiang Electronics Technology, Lingsen Precision, Nepes, Tianshui Huatian¸ Unisem, and Ultratech.

Commenting on the report, an analyst from the research team said: “One of the key trends for market growth will be growing number of mergers and acquisitions. The number of mergers and acquisitions is growing in the global semiconductor packaging and assembly equipment market. The existing vendors are focusing on M&A to increase their market share. For instance, in 2015, ASE agreed to buy a 24.99% stake in SPIL, a provider of advanced packaging solutions, for more than $919 million. Earlier in 2015, SPIL and Hon Hai Precision Industry announced a stock swap to strengthen their product offerings in SiP technology. New entrants in the market also prefer M&A in order to enter in the already highly competitive market.”

According to the report, growing number of fabs will be a key driver for market growth. The rising demand for semiconductor chips and memory devices from electronics end-user devices, sensor systems, IoT-connected devices, and medical devices is propelling the semiconductor industry on the high growth trajectory. However, the industry will slow down in 2016 mainly due to its cyclical nature, slow growth of the Chinese economy, falling ASPs of smartphones, and declining tablet and PC segments. The market is expected to gain ground in 2017 due to the evolution of the IoT, high demand for connected devices, and automation in automobiles. In order to meet this growing demand, semiconductor device manufacturers are increasing their capital spending by expanding their production facilities or constructing new fabs. The majority of the investment in new facilities will be toward the development of memory and logic ICs due to their high demand pattern.

Further, the report states that high investment market will be a challenge for the market. The increase in demand for compact ICs and the emergence of new 3D packaging solutions like TSV, stacked packaging, flip chip packaging, and MEMS packaging have led to a change in the manufacturing process of semiconductor ICs. Manufacturers are required to invest heavily in manufacturing equipment to produce compact ICs. Further, the manufacturing process is complex, requires more time, and has a high probability of defects, thereby increasing the cost of manufacturing. The rapid technological change in the semiconductor industry compels vendors to upgrade and maintain their equipment, which increases the cost of ownership of the equipment. Therefore, companies are going fabless, which is reducing the number of potential customers for semiconductor packaging equipment vendors.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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- Applied Materials
- ASM Pacific Technology
- Kulicke and Soffa Industries
- Tokyo Electron Limited
- Tokyo Seimitsu
- ChipMos
- Greatek
- Hua Hong
- Jiangsu Changjiang Electronics Technology
- Lingsen Precision
- Nepes
- Tianshui Huatian¸ Unisem
- Ultratech
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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