Global Back End of the Line Semiconductor Equipment Market 2016-2020

  • ID: 3832396
  • Report
  • Region: Global
  • 61 pages
  • TechNavio
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FEATURED COMPANIES

  • Applied Materials
  • ASML
  • Hitachi High-Technologies
  • Hitachi Kokusai Electric
  • KLA-Tencor
  • Lam Research
  • MORE
About Semiconductor Equipment Industry

The semiconductor equipment industry is an important part of the overall semiconductor market, with semiconductor chip makers investing 20% of their sales toward obtaining manufacturing equipment. The equipment manufacturing companies are leading the development of most core process technologies in the semiconductor market. The semiconductor production equipment industry is divided into front-end and back-end process equipment.

The analysts forecast the global back end of the line semiconductor equipment market to grow at a CAGR of 1.41% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global back end of the line semiconductor equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of BEOL semiconductor equipment.

The market is divided into the following segments based on geography:

- Americas
- APAC
- EMEA

The report, Global Back End of the Line Semiconductor Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- Applied Materials
- ASML
- KLA-Tencor
- Lam Research
- TEL

Other prominent vendors
- Dainippon Screen Manufacturing
- Hitachi High-Technologies
- Hitachi Kokusai Electric
- Nikon

Market drivers
- Rising demand for flip chip and advanced packaging technologies

Market challenges
- Dependency on few key suppliers

Market trends
- Increased need for semiconductor memory devices

Key questions answered in this report
- What will the market size be in 2020 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Applied Materials
  • ASML
  • Hitachi High-Technologies
  • Hitachi Kokusai Electric
  • KLA-Tencor
  • Lam Research
  • MORE
PART 01: Executive summary
  • Highlights
PART 02: Scope of the report
  • Market overview
  • Definition
  • Base year
  • Product segmentation
  • End-user segmentation
  • Geographical segmentation
  • Vendor selection
  • Common currency conversion rates
  • Top-vendor offerings
PART 03: Market research methodology
  • Research methodology
  • Economic indicators
PART 04: Introduction
  • Key market highlights
PART 05: Market landscape
  • Technology landscape of wafer fab equipment
  • Wafer-level manufacturing equipment categories
  • Key customers
  • Market size and forecast
  • Five forces analysis
PART 06: Market segmentation by product
  • Market overview
  • Market size and forecast
  • Stepper
  • CVD equipment
  • Coater developer
  • Wet station
  • PVD equipment
  • CMP equipment
  • Metal etching equipment
PART 07: Market segmentation by end user
  • Market overview
  • Market size and forecast
  • Foundry
  • Memory
  • IDM
PART 08: Geographical segmentation
  • Market size and forecast
  • APAC
  • Americas
  • EMEA
PART 09: Key leading countries

PART 10: Market drivers
  • Increase in number of fabs
  • Miniaturization of electronic devices
  • Proliferation of advanced consumer electronic products
  • Rising demand for flip chip and advanced packaging technologies
  • High requirement of SoC technology
PART 11: Impact of drivers

PART 12: Market challenges
  • Dependency on few key suppliers
  • High investment market
  • Fluctuations in the semiconductor industry
PART 13: Impact of drivers and challenges

PART 14: Market trends
  • Increase in the number of fabless semiconductor companies
  • Increased need for semiconductor memory devices
  • Growing application of IoT
  • Vehicle automation
PART 15: Vendor landscape
  • Competitive landscape
  • Other prominent vendors
PART 16: About the Author

List of Exhibits

Exhibit 01: List of major countries considered
Exhibit 02: Common currency conversion rates
Exhibit 03: Product offerings
Exhibit 04: Semiconductor production equipment
Exhibit 05: Semiconductor IC manufacturing process
Exhibit 06: Front-end chip formation steps
Exhibit 07: Back-end chip formation steps
Exhibit 08: Wafer-level manufacturing equipment categories
Exhibit 09: Requirements of a manufacturing equipment
Exhibit 10: Global BEOL semiconductor equipment market ($ billions)
Exhibit 11: Five forces analysis
Exhibit 12: Global BEOL semiconductor equipment market by product 2015-2020 (% share)
Exhibit 13: Global BEOL semiconductor equipment market by product 2015-2020 ($ billions)
Exhibit 14: Global BEOL semiconductor equipment market by stepper segment 2015-2020 ($ billions)
Exhibit 15: Global BEOL semiconductor equipment market by CVD equipment segment 2015-2020 ($ billions)
Exhibit 16: Global BEOL semiconductor equipment market by coater developer segment 2015-2020 ($ billions)
Exhibit 17: Global BEOL semiconductor equipment market by wet station segment 2015-2020 ($ billions)
Exhibit 18: Global BEOL semiconductor equipment market by PVD equipment segment 2015-2020 ($ billions)
Exhibit 19: Global BEOL semiconductor equipment market by CMP equipment segment 2015-2020 ($ billions)
Exhibit 20: Global BEOL semiconductor equipment market by metal etching equipment segment 2015-2020 ($ billions)
Exhibit 21: Global BEOL semiconductor equipment market by end-user 2015-2020 (% share)
Exhibit 22: Global BEOL semiconductor equipment market by end-user 2015-2020 ($ billions)
Exhibit 23: Global BEOL semiconductor equipment market by foundry segment 2015-2020 ($ billions)
Exhibit 24: Global BEOL semiconductor equipment market by memory segment 2015-2020 ($ billions)
Exhibit 25: Global BEOL semiconductor equipment market by IDM segment 2015-2020 ($ billions)
Exhibit 26: Segmentation of global BEOL semiconductor equipment market by geography 2015-2020 (% share)
Exhibit 27: Segmentation of global BEOL semiconductor equipment market by geography 2015-2020 ($ millions)
Exhibit 28: BEOL semiconductor equipment market in APAC ($ billions)
Exhibit 29: BEOL semiconductor equipment market in Americas ($ billions)
Exhibit 30: BEOL semiconductor equipment market in EMEA ($ billions)
Exhibit 31: Global NAND flash market 2015-2020 (% share)
Exhibit 32: Impact of drivers
Exhibit 33: Impact of drivers and challenges
Exhibit 34: CAGR of 3D NAND and DRAM 2015-2020
Exhibit 35: Cars shipment growth forecast 2015-2020 (% growth)
Exhibit 36: Key vendors
Exhibit 37: ASML customers by end-user segment
Exhibit 38: Other prominent vendors
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FEATURED COMPANIES

  • Applied Materials
  • ASML
  • Hitachi High-Technologies
  • Hitachi Kokusai Electric
  • KLA-Tencor
  • Lam Research
  • MORE
New Report Released: - Global Back End of the Line Semiconductor Equipment Market 2016-2020

The author of the report recognizes the following companies as the key players in the global back end of the line semiconductor equipment market: Applied Materials, ASML, KLA-Tencor, Lam Research, and TEL.

Other Prominent Vendors in the market are: Dainippon Screen Manufacturing, Hitachi High-Technologies, Hitachi Kokusai Electric, and Nikon.

Commenting on the report, an analyst from the research team said: “Increase in the number of fabless semiconductor companies will be a key trend for market growth. Semiconductor companies are going fabless in order to minimize overhead costs related to operations and maintenance of foundries. The majority of semiconductor companies are more intent on the design and development of their solutions, thereby outsourcing fabrication and other foundry-related activities to companies specializing in manufacturing, assembly, and testing of semiconductor ICs. This has affected the ratio of foundries and fabless companies, which stood at 1:11 in 2015 in the global semiconductor market. The rising number of fabless manufacturers will lead to an increase in the net aggregate demand for semiconductor ICs, thus generating demand for BEOL semiconductor equipment.”

According to the report, advanced transformation requires constant upgrades in consumer offerings. Capital investments play a key role in ensuring that R&D activities never suffer a cash crunch. Therefore, the proliferation of advanced consumer electronics will only induce more capital investments and hence is a key driver.

Further, the report states that high investment will be a challenge for the market. The increase in demand for compact ICs and the emergence of new 3D packaging solutions like TSV, stacked packaging, flip chip packaging, and MEMS packaging have led to a change in the manufacturing process of semiconductor ICs. Manufacturers are required to invest heavily in manufacturing equipment to produce compact ICs. Furthermore, the manufacturing process is complex, requires more time, and have a high probability of defects, thereby increasing the cost of manufacturing. The rapid technological changes in the semiconductor industry compel vendors to upgrade and maintain their equipment, which increases the cost of ownership of the equipment. Therefore, companies are going fabless, which is reducing the number of potential customers for semiconductor BEOL semiconductor equipment vendors.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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- Applied Materials
- ASML
- KLA-Tencor
- Lam Research
- TEL
- Dainippon Screen Manufacturing
- Hitachi High-Technologies
- Hitachi Kokusai Electric
- Nikon
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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