+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)


Flip Chip Market: By Packaging Process, By end users, By applications - Forecast 2016-2021

  • ID: 3919935
  • Report
  • January 2016
  • Region: Global
  • 150 pages
  • IndustryARC
1 of 3
Flip Chip technology is the method for interconnecting semiconductor devices such as Integrated Circuit chips and Micro-electromechanical systems (MEMS) to external circuitry with solder bumps that have been deposited on the chip pads. The chip is then mounted on the external circuitry with its top side down and properly aligned such that its pads align with the matching pads on the external circuit. Flip Chip offers reduced size of the devices (as packaging density increases) and increased performance. It is cheaper than wire bonding as all the bonds form simultaneously.

The Report ‘Flip Chip Market is segmented into six verticals, namely: By Joining Process, By Bumping Process, By Packaging, By Application, By End users and By Geography. The report is segmented by joining process into Solder joining, Thermo Compression, Thermo Sonic, Adhesive and few others. The report has been divided in terms of Bumping Processes like Copper Pillar, Lead-Free Solder, Tin-Lead eutectic solder, Gold stud and plated Solder and others. On the basis of Type of Packaging, The report is segmented into Flip Chip Ball Grid Array (fcBGA), Flip Chip Chip Scale Package (fcCSP), Wafer Level Packaging and others. The report also discusses the applications like 2D Logic System-on-a-chip, Light Emitting Diode, Imaging, Memory, ICs and many others. The report also distinguishes among the end users such as Telecommunications, Consumer Electronics, Automotive, Industrial, Medical devices and others. The report analyzes the market over the regions like North America, South America, APAC, Europe and Rest of the World.

Flip Chip Market in 2015 was dominated by North America; and closely followed by Europe. The APAC region is the fastest growing market of Flip Chip. Countries in APAC are major manufacturing hubs and are instrumental in increasing the demand. Higher demand of Smartphones and Automobile MCUs globally also enhances the growth of the market.

Key players in Flip Chip are:

Taiwan Semiconductor Manufacturing Companies Ltd. (Taiwan)
Samsung Group (South Korea)
Powertech Technology (Taiwan)
STATS ChipPAC Pte. Ltd. (Singapore)
Amkor Technology (The U.S.)
STMicroelectronics (Switzerland)
The methodology for estimating the Flip Chip Market is depended on the type of Packaging. 3D IC packaging technology has the highest growth rate. Considering the Applications part, Consumer Electronics has the largest market size and also the highest growth rate. Simultaneously, the companies involved in Flip Chip Market are also studied from the perspective of their product portfolio, annual turnover and other parameters. The data was validated with industry experts at technical and market levels.
Please Note: The report is to be delivered in 1-2 working days after an order is placed.
Note: Product cover images may vary from those shown
2 of 3
1. Flip Chip – Market Overview
1.1. Introduction
1.2. Market Scope
1.3. Stakeholders

2. Flip Chip - Executive Summary

3. Flip Chip – Market Landscape
3.1. Market Share Analysis
3.1.1. Comprehensive Market Share Analysis
3.2. Comparative Analysis
3.2.1. Competitor Benchmarking
3.2.2. Competitor Financial Analysis
3.2.3. Patent Analysis
3.2.4. End-User Profiling

4. Flip Chip – Market Forces
4.1. Market Drivers
4.2. Market Constraints
4.3. Market Challenges
4.4. Attractiveness of the Smart Parking Solutions Industry
4.4.1. Power of Suppliers
4.4.2. Power of Customers
4.4.3. Threat of New entrants
4.4.4. Threat of Substitution
4.4.5. Degree of Competition

5. Flip Chip – Strategic Analysis
5.1. Value Chain Analysis
5.2. Pricing Analysis
5.2.1. Influencing Factor Analysis
5.2.2. Forecast of Prices
5.3. Opportunities Analysis
5.4. Product/Market Life Cycle Analysis

6. Flip Chip – By joining process
6.1. Introduction
6.2. Solder Joining
6.3. Thermo Compression
6.4. Thermo Sonic Joining
6.5. Joining by Adhesive
6.6. Others

7. Flip Chip – By bumping process
7.1. Introduction
7.2. Copper (Cu) pillar
7.3. Lead (Pb) – free solder
7.4. Tin-Lead (Sn-Pb) eutectic solder
7.5. Gold stud and Plated solder
7.6. Others

8. Flip Chip – By Packaging type
8.1. Flip Chip Ball Grid Array (fcBGA) Technology
8.2. Flip Chip Chip Scale Package (fcCSP) Technology
8.3. Wafer Level Packaging
8.4. Others

9. Flip Chip – By application
9.1. Introduction
9.2. 2D logic system-on-a-chip (SoC)
9.3. Light Emitting Diode
9.4. Memory
9.5. Imaging
9.6. Integrated Circuits
9.7. Others

10. Flip Chip – By end users
10.1. Introduction
10.2. Telecommunications
10.3. Consumer Electronics
10.3.1. Smartphones
10.3.2. Laptops
10.3.3. Personal Computers
10.3.4. Gaming Devices
10.4. Automotive
10.5. Industrial
10.5.1. Robotics
10.5.2. Others
10.6. Medical devices
10.7. Others

11. Flip Chip Market - By Geography
11.1. Introduction
11.2. North America
11.2.1. U.S.
11.2.2. Canada
11.2.3. Others
11.3. South America
11.3.1. Brazil
11.3.2. Mexico
11.3.3. Others
11.4. Europe
11.4.1. Germany
11.4.2. U.K.
11.4.3. France
11.4.4. Others
11.5. Asia-Pacific
11.5.1. China
11.5.2. Japan
11.5.3. India
11.5.4. Others
11.6. Rest Of the World
11.6.1. Africa
11.6.2. Middle-East

12. Market Entropy
12.1. Introduction
12.2. Product Launches - Most Dominant Strategy
12.3. Mergers, Agreements & Partnerships
12.4. Acquisitions and Others

13. Company Profiles
13.1. ASE Group
13.2. Amkor technology
13.3. Intel Corporation
13.4. Powertech Technology
13.5. STATS ChipPAC Pte. Ltd.
13.6. Samsung Group
13.7. Taiwan Semiconductor Manufacturing Company Ltd.
13.8. United Microelectronics Corporation
13.9. Global Foundries
13.10. STMicroelectronics
13.11. Flip Chip International, LLC
13.12. Palomar Technologies
13.13. Nepes Ltd.
13.14. Texas Instruments
*More than 40 Companies are profiled in this Research Report, Complete List available on Request*
"*Financials would be provided on a best efforts basis for private companies"

14. Appendix
14.1. Abbreviations
14.2. Sources
14.3. Research Methodology
14.4. Compilation of Expert Insights
14.5. Disclaimer
Note: Product cover images may vary from those shown
3 of 3


4 of 3